Abstract: An exemplary device includes a frontside power rail disposed over a frontside of a substrate, a backside power rail disposed over a backside of the substrate, an epitaxial source/drain structure disposed between the frontside power rail and the backside power rail. The epitaxial source/drain structure is connected to the frontside power rail by a frontside source/drain contact. The epitaxial source/drain structure is connected to the backside power rail by a backside source/drain via. The backside source/drain via is disposed in a substrate, and a dielectric layer is disposed between the substrate and the backside power rail. The backside source/drain via extends through the dielectric layer and the substrate.

Abstract: Controller and method for a power converter. For example, the controller includes: a first terminal configured to receive a first voltage; a second terminal connected to a capacitor and biased to a second voltage; a voltage detector configured to receive the second voltage from the second terminal and generate a detection signal based at least in part on the second voltage; a charging controller configured to receive the detection signal and generate a first control signal based at least in part on the detection signal; and a charging current generator configured to receive the first voltage from the first terminal and receive the first control signal from the charging controller; wherein the voltage detector is further configured to: detect that the second voltage has decreased to a first predetermined threshold; and generate the detection signal indicating that the second voltage has decreased to the first predetermined threshold.

Abstract: Controller and method for a power converter. For example, the controller includes: a first terminal configured to receive a first voltage; a second terminal connected to a capacitor and biased to a second voltage; a voltage detector configured to receive the second voltage from the second terminal and generate a detection signal based at least in part on the second voltage; a charging controller configured to receive the detection signal and generate a first control signal based at least in part on the detection signal; and a charging current generator configured to receive the first voltage from the first terminal and receive the first control signal from the charging controller; wherein the voltage detector is further configured to: detect that the second voltage has decreased to a first predetermined threshold; and generate the detection signal indicating that the second voltage has decreased to the first predetermined threshold.

Abstract: Methods and systems for team cooperation with real-time recording of one or more moment-associating elements. For example, a method includes: delivering, in response to an instruction, an invitation to each member of one or more members associated with a workspace; granting, in response to acceptance of the invitation by one or more subscribers of the one or more members, subscription permission to the one or more subscribers; receiving the one or more moment-associating elements; transforming the one or more moment-associating elements into one or more pieces of moment-associating information; and transmitting at least one piece of the one or more pieces of moment-associating information to the one or more subscribers.

Abstract: Disclosed are an atomizer, an atomization system and an operation method of the atomization system. The atomizer includes an atomization pipe, a reservoir and a flexible block piece. The atomization pipe includes an opening. The opening penetrates through an outer surface of the atomization pipe. The reservoir is disposed in the atomization pipe. The opening is communicated with the reservoir. The flexible block piece is disposed in the opening. The flexible block piece allows an injection needle to pass through the flexible block piece and enter the reservoir. The atomization system includes a base and the atomizer, and the atomizer is detachably connected to the base. The flexible block piece is filled in the opening to play a sealing role, and when specific liquid is consumed, the specific liquid can be injected into the reservoir by penetrating the injector into the flexible block piece, thus achieving reuse of the atomizer.

Abstract: A miniature gas detection system includes a separation flow channel fabricated by semiconductor processes and a filling material disposed in the main flow channel of the separation flow channel to perform adsorption and separation on compositions of compounds contained in the gas introduced into the main flow channel. Each detection flow channel is formed with a monitoring chamber, and a micro-electromechanical systems pump is formed on the bottom portion of the monitoring chamber. In each monitoring chamber, a light emitted from the light emitting element is reflected by the two mirrors and received by the light detection element. Therefore, the light detection elements obtain and output spectra of the compositions of compounds contained in the gas according to the differences in optical adsorptions of the compositions of compounds for lights with different wavelengths, so as to analyze and determine the type of the gas contained in the compositions of compounds.

Abstract: A method of tuning parameters for image signal processing is provided. The method includes capturing at least one raw image. The method further includes generating a first rendered image by rendering the raw image based on a first parameter value set, and generating a second rendered image by rendering the raw image based on a second parameter value set. The method further includes calculating a first image quality score set for the first rendered image, and calculating a second image quality score set for the second rendered image. The method further includes generating a third parameter value set based on the first parameter value set, the second parameter value set, the first image quality score set, and the second image quality score set.

Abstract: A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.

Abstract: A method for saving power is provided. The method is used in a slave device. The method includes receiving a first switch request indicating to switch a clock source from a first clock to a second clock when the slave device enters sleep mode. The method includes transmitting a first clock source signal indicating to switch the clock source from the first clock to the second clock to registers. The method includes switching the clock source from the first clock to the second clock to the registers according to the first clock source signal.

Abstract: Provided are compounds, compositions and methods for inhibiting fascin activity or treating a condition or disorder mediated by fascin activity in a subject in need thereof.

Abstract: A method includes forming a lower transistor in a lower wafer, wherein the lower transistor includes a lower source/drain region, forming a contact plug electrically connecting to the lower source/drain region, and forming a metal line over the lower transistor. A first portion of the metal line is vertically aligned to the lower source/drain region. The method further includes bonding an upper wafer to the lower wafer, and forming an upper transistor in the upper wafer. The upper transistor includes an upper source/drain region, and is vertically aligned to a second portion of the metal line. A first interconnect structure is formed on the lower wafer and electrically connecting to the lower transistor. A second interconnect structure is formed on the upper wafer and electrically connecting to the upper transistor.

Abstract: A method includes forming a first transistor in a first wafer, wherein the first transistor includes a first source/drain region, forming a first bond pad electrically coupling to the first source/drain region, forming an second transistor in a second wafer, wherein the second transistor includes a second source/drain region, forming a second bond pad electrically coupling to the second source/drain region, and bonding the second wafer to the first wafer, with the second bond pad being bonded to the first bond pad.

Abstract: A semiconductor device including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a warpage control pattern is provided. The first semiconductor die includes an active surface and a rear surface opposite to the active surface. The second semiconductor die is disposed on the active surface of the first semiconductor die. The insulating encapsulation is disposed on the active surface of the first semiconductor die and laterally encapsulates the second semiconductor die. The warpage control pattern is disposed on and partially covers the rear surface of the first semiconductor die.

Abstract: An optical lens assembly includes a stop, and includes, in order from the object side to the image side: a first lens, a second lens, a third lens, a fourth lens, and fifth lens, wherein a focal length of the fifth lens is f5, a radius of curvature of an image-side surface of the fifth lens is R10, a distance between the stop to the image plane on the optical axis is SL, satisfying the relation: 1.27<f5*R10/SL<3.68.

Abstract: A package structure including IPD and method of forming the same are provided. The package structure includes a die, an encapsulant laterally encapsulating the die, a first RDL structure disposed on the encapsulant and the die, an IPD disposed on the first RDL structure and an underfill layer. The IPD includes a substrate, a first connector on a first side of the substrate and electrically connected to the first RDL structure, a guard structure on a second side of the substrate opposite to the first side and laterally surrounding a connector region, and a second connector disposed within the connector region and electrically connected to a conductive via embedded in the substrate. The underfill layer is disposed to at least fill a space between the first side of the IPD and the first RDL structure. The underfill layer is separated from the connector region by the guard structure.

Abstract: An assembling equipment is for attaching a component to a workpiece. The assembling equipment includes a platform, a conveying mechanism, a first attaching mechanism, a film removing mechanism, and a second attaching mechanism. The conveying mechanism transports a positioning assembly carrying a workpiece to a first station. The first attaching mechanism attaches a first component with a protective film to the workpiece at the first station. The conveying mechanism transports the positioning assembly to a second station, and the film removing mechanism at the second station removes the protective film from the workpiece. The conveying mechanism transports the positioning assembly to a third station. The second attaching mechanism at the third station attaches a second component to the first component on the workpiece to be connected together. The assembling equipment reduces manual labor intensity and labor costs and improves efficiency of production and the product quality.

Abstract: A method for tuning a plurality of image signal processor (ISP) parameters of a camera includes performing a first iteration. The first iteration includes extracting image features from an initial image, arranging a tuning order of the plurality of ISP parameters of the camera according to at least the plurality of ISP parameters and the image features, tuning a first set of the ISP parameters according to the tuning order to generate a first tuned set of the ISP parameters, and replacing the first set of the ISP parameters with the first tuned set of the ISP parameters in the plurality of ISP parameters to generate a plurality of updated ISP parameters.

Abstract: A new generation of network resource management architecture for coverage is provided, which constructs a structure of “signal coverage+capacity coverage” by incorporating satellite, space-based, and ground access points to achieve large-scale regional signal coverage and local area capacity coverage. In the core network, a global resource orchestrator is added, and in the access network, local resource orchestrator and virtual network management and maintenance unit are added for multiple functional units of resource management and control. In terms of coverage structure, it is divided into three-dimensional dense capacity coverage and three-dimensional global signal coverage. The former consists of ground dense network and aerial ad-hoc network, respectively realizing high traffic density coverage and large connection three-dimensional coverage.

Abstract: A display panel, a displaying device and a wearable device. The display panel includes a displaying region and a peripheral region surrounding the displaying region, a region of the peripheral region other than the bonding sub-region includes a first testing-unit group and a second testing-unit group, and each of the first testing-unit group and the second testing-unit group includes one or more circuit testing units; the displaying region includes a first lateral side and a second lateral side that extend in a first direction and face each other, the first direction refers to a direction from the bonding sub-region pointing to the displaying region; and a maximum distance from the first testing-unit group to the first lateral side in a direction perpendicular to the first direction is equal to a maximum distance from the second testing-unit group to the second lateral side in the direction perpendicular to the first direction.

Abstract: A user equipment (UE) of and a method for determining a transmission configuration indication (TCI) is provided. The UE includes a memory, a transceiver and a processor coupled to the memory and the transceiver. The processor is configured to control the transceiver to receive downlink control information (DCI) from a network node, and determine a corresponding TCI state according to an indication of the DCI or an indication of a medium access control (MAC) control element (CE).