Abstract: A power conversion apparatus supplies power to a load, and the power conversion apparatus includes a power switch, a transformer, and a control module. The control module alternately turns on and turns off a power switch of the power conversion apparatus to convert an input voltage into an output voltage through the transformer. When the power switch is turned off, a primary side of the transformer generates a resonance voltage. The control module sets a predetermined counting threshold according to the output voltage, and sets a blanking time interval according to a feedback signal related to the load. After the blanking time interval ends, the control module counts a number of an oscillation turning point generated by the resonance voltage due to the oscillation of the resonance voltage. When the number reaches the predetermined counting threshold, the control module turns on the power switch.

Abstract: A method for removing a heavy metal from water includes subjecting a microbial solution containing a liquid culture of a urease-producing bacterial strain and a reaction solution containing a manganese compound and urea to a microbial-induced precipitation reaction, so as to obtain biomineralized manganese carbonate (MnCO3) particles, admixing the biomineralized MnCO3 particles with water containing a heavy metal, so that the biomineralized MnCO3 particles adsorb the heavy metal in the water to form a precipitate, and removing the precipitate from the water.

Abstract: A semiconductor device includes a first substrate, an electronic component, and a lid. The first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a connector structure. The electronic component is coupled to the first substrate top side and coupled to the connector structure. The lid includes a wall part including a ring part coupled to the first substrate top side, a first part of an overhang part coupled to the first substrate lateral side, and a second part of the overhang part extending from the first part of the overhang part away from the first substrate lateral side.

Abstract: Epitaxial source/drain structures for enhancing performance of multigate devices, such as fin-like field-effect transistors (FETs) or gate-all-around (GAA) FETs, and methods of fabricating the epitaxial source/drain structures, are disclosed herein. An exemplary device includes a dielectric substrate. The device further includes a channel layer, a gate disposed over the channel layer, and an epitaxial source/drain structure disposed adjacent to the channel layer. The channel layer, the gate, and the epitaxial source/drain structure are disposed over the dielectric substrate. The epitaxial source/drain structure includes an inner portion having a first dopant concentration and an outer portion having a second dopant concentration that is less than the first dopant concentration. The inner portion physically contacts the dielectric substrate, and the outer portion is disposed between the inner portion and the channel layer. In some embodiments, the outer portion physically contacts the dielectric substrate.

Abstract: The present invention discloses a fabrication method and use of a ?40 mm large-size and high-contrast fiber optic image inverter, belonging to the field of manufacturing of fiber optic imaging elements. The light-absorbing glass for preparing the ?40 mm large-size and high-contrast fiber optic image inverter consists of the following components in molar percentage: SiO2 60-69.9, Al2O3 1.0-10.0, B2O3 10.1-15.0, Na2O 1.0-8.0, K2O 3.0-10.0, MgO 0.1-1.0, CaO 0.5-5.0, ZnO 0-0.1, TiO2 0-0.1, ZrO2 0.1-1.0, Fe2O3 3.0-6.5, Co2O3 0.1-0.5, V2O5 0.51-1.5 and MoO3 0.1-1.0. The fiber optic image inverter has the advantages of low crosstalk of stray light, high resolution and high contrast.

Abstract: Information output methods and apparatuses, computer equipment and readable storage media which relate to the field of computer technology are provided. The information output method includes: detecting whether a search connection is established between a delivery terminal and a beacon device deployed by a target physical object by using a pre-cached joint beacon atlas bound to the target physical object, where the joint beacon atlas records a set of communication identifiers covered by a physical object; if the search connection is established between the delivery terminal and the beacon device deployed by the target physical object, outputting a corresponding time point when the search connection is in a stable state as information of a delivery resource arriving at the target physical object.

Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.

Abstract: An electronic device is disclosed. In one aspect, the electronic device includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface, where the PCB includes a thermally conductive region having a plurality of vias that extend from the first surface to the second surface; a semiconductor device attached to the second surface of the PCB and overlying the thermally conductive region; a transformer having a magnetic core; a shield arranged to partially enclose the transformer and define an opening; and an insert disposed within the opening, attached to the first surface of the PCB and overlying the thermally conductive region.

Abstract: An uplink transmission method, a terminal device, and a network device are provided. A terminal device receives a DCI transmitted by a network device. The DCI is used to schedule the terminal device to transmit an uplink transmission, and the DCI includes first indication information and second indication information. The first indication information indicates a SRS resource set corresponding to the uplink transmission. The target SRS resource set includes at least one of a first SRS resource set and a second SRS resource set, and the target SRS resource set is a SRS resource set corresponding to the uplink transmission when the uplink transmission is transmitted to a STRP or a MTRP. The second indication information is used to determine a target SRS resource corresponding to the uplink transmission in the target SRS resource set.

Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: A pharmaceutical composition containing a mixed polymeric micelle and a drug enclosed in the micelle, in which the mixed polymeric micelle, 1 to 1000 nm in size, includes an amphiphilic block copolymer and a lipopolymer. Also disclosed are preparation of the pharmaceutical composition and use thereof for treating cancer.

Abstract: Computer-implemented method and system for receiving and processing one or more moment-associating elements. For example, the computer-implemented method includes receiving the one or more moment-associating elements, transforming the one or more moment-associating elements into one or more pieces of moment-associating information, and transmitting at least one piece of the one or more pieces of moment-associating information.

Abstract: A multifunctional sound device includes a housing, a sound unit, a vibrator, and a coil. The housing includes an accommodating cavity, and the sound unit is suspended in the accommodating cavity. The sound unit includes a frame, a vibration system, and a magnetic circuit system. The vibration system is fixed in the frame, and the magnetic circuit system drives the vibration system to vibrate and generate sound along a first direction, where the magnetic circuit system includes a magnetic gap. Since the speaker and the motor share one magnetic system, the sound unit and the vibrator are assembled in the housing, which greatly reduces occupied space. The sound unit and the vibrator form a dual-vibration system, and the sound unit cooperatively vibrates with the vibrator in addition to generating sound, which improves vibration effects and further avoids adding other components, thereby saving space.

Abstract: A multifunctional sound device includes a housing, a sound unit, a vibrator, and coils. The housing includes an accommodating cavity, and the sound unit is accommodated in the accommodating cavity and is fixedly connected to the housing. The sound unit includes a frame, a vibration system, and a magnetic circuit system. The vibration system is disposed in the frame, and the magnetic circuit system drives the vibration system to reciprocally vibrate and generate sound along a first direction. The sound unit and the vibrator are assembled in the housing and share one magnetic system, which saves space and greatly reduces occupied space. Moreover, the magnetic circuit system interacts with the coils to drive the vibrator to vibrate in the second direction and the third direction, thereby enhancing vibration effect.

Abstract: Systems and methods for improving radiated electromagnetic interference (EMI) in switching power supplies are disclosed. In one aspect, a converter circuit includes a transformer having a primary winding and a secondary winding, the primary winding extending from a first primary terminal to a second primary terminal, a first switch having a first gate terminal, a first source terminal and a first drain terminal, wherein the first drain terminal is coupled to the first primary terminal, and the first source terminal is coupled to a power source, and a capacitor having a first capacitor terminal and second capacitor terminal, wherein the first capacitor terminal is coupled to the power source. A ferrite bead is coupled between the first primary terminal and the first drain terminal, and a capacitor network is coupled in parallel with the ferrite bead and arranged to reduce radiated electromagnetic interference of the converter circuit.

Abstract: A semiconductor device and method of fabricating the same include a substrate, a first epitaxial layer, a first protection layer, and a contact etching stop layer. The substrate includes a PMOS transistor region, and the first epitaxial layer is disposed on the substrate, within the PMOS transistor region. The first protection layer is disposed on the first epitaxial layer, covering surfaces of the first epitaxial layer. The contact etching stop layer is disposed on the first protection layer and the substrate, wherein a portion of the first protection layer is exposed from the contact etching stop layer.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: Provided in the present application are an electronic device and a control method for the electronic device. A shell in the electronic device is provided with a first face and a second face that are arranged opposite each other and a first side portion and a second side portion that are arranged opposite each other; a guide apparatus is received in the shell, and the guide apparatus can drive the second side portion to extend or retract; and a flexible display screen is arranged at an outer surface of the shell, and the side, located at the second face, of the flexible display screen is provided with an opening, and when the guide apparatus drives the second side portion to extent, the flexible display screen is split from the opening, and the flexible display screen moves from the second face to the first face along the guide apparatus.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.

Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.