Abstract: A semiconductor package according to an embodiment of the present invention includes: a heat sink board including an insulated board and a first metal layer formed on the insulated board; at least one semiconductor chip placed on the first metal layer; a plurality of lead frames connected to the semiconductor chips used to electrically connect the semiconductor chips to the outside; and a package housing partially covering the heat sink board, wherein both end parts of the insulated board are projected further than both end parts of the first metal layer.

Abstract: A heat sink board according to an embodiment of the present invention includes a heat sink layer, an insulated layer formed on the heat sink layer, and a metal layer formed on the insulated layer, wherein both end parts of the heat sink layer and both end parts of the insulated layer are respectively projected further than the both end parts of the metal layer.

Abstract: Provided is a semiconductor package having an exposed heat sink for high thermal conductivity. The semiconductor package includes at least one semiconductor chip 110, the lead frame 120, a signal line 130, the sealing member 140, and at least one heat sink 150, wherein the lead frame 120 has a first surface, to which the semiconductor chips 110 are attached, and a second surface facing the first surface, the signal line 130 electrically connects the semiconductor chips 110 and the semiconductor chip 110 to the lead frame 120 by wire bonding or clip bonding, the sealing member 140 surrounds areas where the semiconductor chips 110 are attached, except for an external connection terminal 121 of the lead frame 120, and exposes the second surface of the lead frame 120, and the at least one heat sink 150 are attached to the second surface of the exposed lead frame 120.

Abstract: Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.

Abstract: Provided is a semiconductor package modularized and manufactured by preparing a main block for putting on a semiconductor chip, an insulator, and one or more sub block, preparing the semiconductor chip, preparing an adhesive used in attaching the semiconductor chip, attaching the semiconductor chip to an upper surface or upper and lower surfaces of the main block, performing an electrical connection of the semiconductor chip, preparing a substrate comprising a pattern enabling an electrical connection and vertically attaching one side of the main block to the pattern of the substrate to enable an electrical connection. In the semiconductor package above, an accumulation rate increases on the substrate due to a vertically arranged structure of the semiconductor chips and a heat emission area is enlarged to improve a heat emission effect.

Abstract: A semiconductor package according to an embodiment of the present invention Includes: a lead frame comprising a pad and a lead spaced apart from the pad by a regular interval; a semiconductor chip adhered on the pad; and a clip structure electrically connecting the semiconductor chip and the lead, wherein an one end of the clip structure connected to the semiconductor chip inclines with respect to upper surfaces of chip pads of the semiconductor chip and is adhered to the upper surfaces of the chip pads of the semiconductor chip. A semiconductor package according to another embodiment of the present invention includes: a semiconductor chip comprising one or more chip pads; one or more leads electrically connected to the chip pads; and a sealing member covering the semiconductor chip, wherein an one end of the lead inclines with respect to one surface of the chip pad and is adhered to the chip pad and an other end of the lead is exposed to the outside of the sealing member.

Abstract: Provided is a press-fit pin.

Abstract: A method of bonding a terminal of a semiconductor chip using a solder bump includes preparing a semiconductor chip with an aluminum (Al) pad terminal formed thereon (S-1), forming a solder bump on the Al pad terminal through a primary solder (S-2), attaching the solder bump and a metal structure to each other via a secondary solder with a higher melting point than a melting point of the primary solder (S-3), performing heat treatment in an attachment state (S-4), and mixing the primary solder and the secondary solder that are melted during the heat treatment and converting a resulting mixture into a tertiary solder including one solder layer (S-4).

Abstract: Provided is a press-fit pin.

Abstract: Provided is a semiconductor package. More particularly, the present invention relates to a clip, a lead frame, and a substrate used in a semiconductor package having engraved patterns formed on surfaces thereof so as to increase an adhesive force and a corrosion resistant performance, thereby improving reliability of the semiconductor package, and the semiconductor package including the same.

Abstract: Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.

Abstract: A press-fit pin increases contact area with the contact hole to provide appropriate contact pressure, reduce contact resistance, and increase heat transfer efficiency. The press-fit pin is of a semiconductor package including an end portion and a press unit extending from the end portion and is divided into a first press-fitting piece and a second press-fitting piece, the first press-fitting piece forming a convex portion in a first direction perpendicular to the direction of the press-fit pin and bending to a second direction perpendicular to the direction of the press-fit pin and forming 30-110 degrees with the first direction and the second press-fitting piece forming a convex portion in a third direction perpendicular to the direction of the press-fit pin and being 180 degrees with the first direction and bending to a fourth direction perpendicular to the direction of the press-fit pin and forming 250-330 degrees with the first direction.

Abstract: A clip structure and a semiconductor package using the same include different metals in multiple layers so as to selectively, easily and exactly fix semiconductor chips, which consists of a lightweight material so as to lighten the weight of semiconductor packages and to help reduce manufacturing costs, and which in particular, maintains the width of a self-welding layer consisting of a clip structure so as to help improve the quality of adhesion. That is, according to a clip structure of the present invention, which electrically connects package elements in a semiconductor package, the clip structure includes a main metallic layer that is configured to maintain a shape, and a first functional layer that is piled on one surface of the main metallic layer and consists of a metal different from that of the main metal layer.

Abstract: A method of bonding a terminal of a semiconductor chip using a solder bump includes preparing a semiconductor chip with an aluminum (Al) pad terminal formed thereon (S-1), forming a solder bump on the Al pad terminal through a primary solder (S-2), attaching the solder bump and a metal structure to each other via a secondary solder with a higher melting point than a melting point of the primary solder (S-3), performing heat treatment in an attachment state (S-4), and mixing the primary solder and the secondary solder that are melted during the heat treatment and converting a resulting mixture into a tertiary solder including one solder layer (S-4).

Abstract: A low-cost semiconductor package using a conductive metal structure includes a lead frame including a pad and a lead, a semiconductor chip attached onto the pad of the lead frame, an Aluminum (Al) pad formed on the semiconductor chip, a clip structure having one side adhered to the Al pad and the other side adhered to the lead of the lead frame, and a sealing member formed to surround the semiconductor chip and the clip structure via molding, wherein the semiconductor chip is adhered directly to a junction of the lead frame through a first adhesive layer formed of a solder or epoxy resin-based material and is adhered directly to a junction of the Al pad and the clip structure through a second adhesive layer formed of a solder-based material.

Abstract: A press-fit pin increases contact area with the contact hole to provide appropriate contact pressure, reduce contact resistance, and increase heat transfer efficiency. The press-fit pin is of a semiconductor package including an end portion and a press unit extending from the end portion and is divided into a first press-fitting piece and a second press-fitting piece, the first press-fitting piece forming a convex portion in a first direction perpendicular to the direction of the press-fit pin and bending to a second direction perpendicular to the direction of the press-fit pin and forming 30-110 degrees with the first direction and the second press-fitting piece forming a convex portion in a third direction perpendicular to the direction of the press-fit pin and being 180 degrees with the first direction and bending to a fourth direction perpendicular to the direction of the press-fit pin and forming 250-330 degrees with the first direction.

Abstract: The present disclosure relates to a semiconductor package having a double-sided heat dissipation structure, and more particularly, to a semiconductor package having a double-sided heat dissipation structure which rapidly transfers high heat generated in a semiconductor chip to substrates exposed to upper and lower surfaces of the package to have excellent dissipation effect.

Abstract: A clip structure and a semiconductor package using the same include different metals in multiple layers so as to selectively, easily and exactly fix semiconductor chips, which consists of a lightweight material so as to lighten the weight of semiconductor packages and to help reduce manufacturing costs, and which in particular, maintains the width of a self-welding layer consisting of a clip structure so as to help improve the quality of adhesion. That is, according to a clip structure of the present invention, which electrically connects package elements in a semiconductor package, the clip structure includes a main metallic layer that is configured to maintain a shape, and a first functional layer that is piled on one surface of the main metallic layer and consists of a metal different from that of the main metal layer.

Abstract: The present disclosure relates to a semiconductor package having a double-sided heat dissipation structure, and more particularly, to a semiconductor package having a double-sided heat dissipation structure which rapidly transfers high heat generated in a semiconductor chip to substrates exposed to upper and lower surfaces of the package to have excellent dissipation effect.

Abstract: A semiconductor package comprise a downset has a first end coupled to a connection portion and a second opposite end electrically coupled to a lead of a lead frame; and an adhesion layer disposed between the lead and the second end of the downset to allow adhesion therebeween; wherein the downset is bent in a non-right angle at the first end thereof such that a bottom face of the second end of the downset is tilted toward a top face of the lead and thus a first side of both sides of the bottom face is closer to the top face of the lead than a second side opposite the first side, wherein a first trap region is defined between a side face of the second end at the first side and the top face of the lead to trap therein an adhesion material of the adhesion layer, wherein a second trap region is defined between the bottom face of the second end and the top face of the lead to trap therein an adhesion material of the adhesion layer.