Abstract: In some example embodiments, a back side illumination (BSI) image sensor may include a pixel configured to generate electrical signals in response to light incident on a back side of a substrate. In some example embodiments, the pixel includes, a photodiode, a device isolation film adjacent to the photodiode, a dark current suppression layer above the photodiode, a light shield grid above the photodiode and including an opening area of 1 to 15% of an area of the pixel, a light shielding filter layer above the light shield grid, a planarization layer above the light shielding filter layer, a lens above the planarization layer, and/or an anti-reflective film between the photodiode and the lens.

Abstract: A light-emitting element includes a first semiconductor layer doped to have a first polarity, a second semiconductor layer doped to have a second polarity different from the first polarity, a light-emitting layer disposed between the first and second semiconductor layers, a shell layer formed on side surfaces of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer, the shell layer including a divalent metal element, and an insulating film covering an outer surface of the shell layer and surrounding the side surface of the light-emitting layer.

Abstract: The present invention relates to a device and method for implementing dynamic-service-oriented communication between vehicle applications on an AUTomotive Open System ARchitecture (AUTOSAR) adaptive platform (AP). A machine including an electronic control unit (ECU) to which the portable operating system interface (POSIX) operating system (OS) is ported and implementing dynamic-service-oriented communication between vehicle applications on an AUTOSAR AP includes a skeleton which is an application for providing a service on the platform, a proxy which is an application using the service on the platform, and a service communication management (CM) which is an application for brokering service-oriented communication between vehicle applications on the platform.

Abstract: In some example embodiments, a back side illumination (BSI) image sensor may include a pixel configured to generate electrical signals in response to light incident on a back side of a substrate. In some example embodiments, the pixel includes, a photodiode, a device isolation film adjacent to the photodiode, a dark current suppression layer above the photodiode, a light shield grid above the photodiode and including an opening area of 1 to 15% of an area of the pixel, a light shielding filter layer above the light shield grid, a planarization layer above the light shielding filter layer, a lens above the planarization layer, and/or an anti-reflective film between the photodiode and the lens.

Abstract: An image sensor includes a first pixel group on a substrate and including a plurality of first pixels, a second pixel group on the substrate and including a plurality of second pixels, where at least one of the plurality of first pixels and at least one of the plurality of second pixels are adjacent in a first direction, a first autofocus pixel group between the first pixel group and the second pixel group, the first autofocus pixel group including a first autofocus pixel adjacent to the first pixel group and a second autofocus pixel adjacent to the second pixel group, a first color filter on the first autofocus pixel and the second autofocus pixel, a second color filter on the plurality of second pixels, and a light-shield pattern that separates the first color filter and the second color filter.

Abstract: An image sensor includes a semiconductor layer including a first section and a second section, the semiconductor layer having a first surface and a second surface that face each other, a device isolation layer in the semiconductor layer and defining a plurality of pixels; a first grid pattern on the first surface of the semiconductor layer over the first section; and a light-shield pattern on the first surface of the semiconductor layer over the second section. A top surface of the first grid pattern is located at a first level, a top surface of the light-shield pattern is located at a second level, the first level is lower than the second level, and the first and second levels are defined with respect to the first surface of the semiconductor layer.

Abstract: Disclosed is an image sensor including a first substrate that has a first surface and a second surface opposite to the first substrate and including a pixel array region and an edge region, an antireflection structure on the second surface, a pixel separation part in the first substrate and separating pixels from each other, and a microlens array on the antireflection structure. The antireflection structure includes a first dielectric layer, a titanium oxide layer, a second dielectric layer, and a third dielectric layer that are sequentially stacked. The first dielectric layer, the second dielectric layer, and the third dielectric layer include different materials from each other. On the edge region, the third dielectric layer penetrates the second dielectric layer and the titanium oxide layer to contact with the first dielectric layer.

Abstract: An image sensor includes a semiconductor layer including a first section and a second section, the semiconductor layer having a first surface and a second surface that face each other; a device isolation layer in the semiconductor layer and defining a plurality of pixels; a first grid pattern on the first surface of the semiconductor layer over the first section; and a light-shield pattern on the first surface of the semiconductor layer over the second section. A top surface of the first grid pattern is located at a first level, a top surface of the light-shield pattern is located at a second level, the first level is lower than the second level, and the first and second levels are defined with respect to the first surface of the semiconductor layer.

Abstract: An image sensor includes a first substrate including pixel regions, each of which comprises a photoelectric conversion region, color filters provided on the pixel regions, respectively, the color filters provided on a first surface of the first substrate, and micro lenses provided on the color filters, respectively. First period structures repeatedly arranged in a first direction are defined by the micro lenses. Each of the first period structures includes a first micro lens and a second micro lens of the micro lenses. At least one of a size, a curvature, a material or a shape of the first micro lens is different from at least one of a size, a curvature, a material or a shape of the second micro lens. A first arrangement period of the first period structures is equal to or greater than twice a pixel pitch of the pixel regions.

Abstract: Image sensors are provided. The image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. The color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter.

Abstract: Disclosed are a multilayered cell sheet of cardiac stem cells (CSCs) and a method of manufacturing the same. In particular, the present disclosure provides a method of manufacturing a multilayered cell sheet according to a single step culture procedure by using, as a three-dimensional matrix, a biodegradable natural polymer hydrogel and embedding CSCs in the hydrogel. The multilayered cell sheet of the present disclosure does not require any special device for the manufacturing, is manageable with good physicomechanical property, increases a cell engraftment rate after transplantation based on sufficient accumulation of various growth and protective factors and extracellular matrix between cells, and is also self-assembled by the cell-mediated hydrogel compaction, making nutrients transfer easy. Therefore, the multilayered cell sheet of the CSCs is expected to be usefully applicable as a therapeutic agent for myocardium regeneration.

Abstract: Image sensors are provided. The image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. The color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter.

Abstract: The present invention relates to a photo-cross-linkable shape-memory polymer and a preparation method therefor. The shape-memory polymer according to one embodiment of the present invention comprises a photo-cross-linkable functional group, and thus a shape-memory polymer having a melting point suitable for a physiological or medical application device can be provided. Particularly, a method for preparing the shape-memory polymer, according to one embodiment of the present invention, uses a catalyst for inducing the simultaneous ring-opening polymerization of two monomers (CL, GMA) during synthesis of the shape-memory polymer, thereby enabling the synthesis time of the shape-memory polymer to be reduced, and shape-memory polymers having various melting points can be readily prepared by controlling the introduction amounts of CL and GMA.

Abstract: A method of fabricating an image sensor includes forming a semiconductor substrate of a first conductivity type, forming a pixel isolation trench in in the semiconductor substrate to define pixel regions, forming a liner insulating layer in the pixel isolation trench, doping the liner insulating layer with dopants of a first conductivity type, forming a semiconductor layer on the liner insulating layer to fill the pixel isolation trench after the doping of the dopants, and performing a thermal treatment process on the semiconductor substrate.

Abstract: An image sensor includes a substrate including pixel regions and having a first surface, a second surface opposite the first surface. and a first trench recessed from the first surface, a shallow device isolation pattern provided in the first trench, and a deep device isolation pattern between the pixel regions and provided in the substrate. The deep device isolation pattern includes a semiconductor pattern penetrating at least a portion of the substrate, and an isolation pattern provided between the substrate and the semiconductor pattern. The isolation pattern includes a first isolation pattern adjacent to the second surface, and a second isolation pattern adjacent to the first surface. A first interface at which the first isolation pattern contacts the second isolation pattern is spaced apart from the shallow device isolation pattern. The first isolation pattern includes a different material from that of the second isolation pattern.

Abstract: An image sensor, including a substrate having a first surface, and a second surface opposite to the first surface; a first focus pixel; a first merged pixel; a second merged pixel; a first color filter; a second color filter; a third color filter; a grid pattern separating the first to third color filters, but not overlapped by the first to third color filters; a first micro-lens disposed on the first color filter; and a second micro-lens disposed on the second and third color filters, wherein a first-third unit pixel, the first focus pixel, and a second-third unit pixel are continuously arranged along the first direction, and wherein a width of the grid pattern between the first color filter and the second color filter is greater than a width of the grid pattern between the second color filter and the third color filter.

Abstract: An image sensor includes a semiconductor layer, a plurality of light sensing regions, a first pixel isolation layer, a light shielding layer, and a wiring layer. The semiconductor layer has a first surface and a second surface opposite to the first surface. The plurality of light sensing regions is formed in the semiconductor layer. The first pixel isolation layer is disposed between adjacent light sensing regions from among the plurality of light sensing regions. The first pixel isolation layer is buried in an isolation trench formed between the first surface and the second surface. The light shielding layer is formed on the second surface of the semiconductor layer and on some of the adjacent light sensing regions. The wiring layer is formed on the first surface of the semiconductor layer.

Abstract: An image sensor includes different first and second focus pixels in a substrate; a first adjacent pixel in the substrate and adjacent to the first focus pixel in a positive first direction, a pixel being absent between the first focus pixel and the first adjacent pixel; a first micro-lens covering the first adjacent pixel; a second adjacent pixel in the substrate and adjacent to the second focus pixel in a positive first direction, a pixel being absent between the second focus pixel and the second adjacent pixel; and a second micro-lens covering the second adjacent pixel, and an area of the first micro-lens being different from an area of the second micro-lens.

Abstract: An image sensor that provides a uniform sensitivity for pixels having color filters of the same color to increase the image quality is provided. The image sensor includes a substrate, a first grid pattern disposed on the substrate and including a first side wall and a second side wall opposite to the first side wall, a first pixel including a first photoelectric conversion element and a first color filter, and a second pixel including a second photoelectric conversion element and a second color filter. The first color filter contacts the first side wall and the second color filter contacts the second side wall. The first color filter and the second color filter are color filters of same color, and a first thickness of the first color filter is greater than a second thickness of the second color filter.

Abstract: An image sensor includes a semiconductor layer including a first section and a second section, the semiconductor layer having a first surface and a second surface that face each other; a device isolation layer in the semiconductor layer and defining a plurality of pixels; a first grid pattern on the first surface of the semiconductor layer over the first section; and a light-shield pattern on the first surface of the semiconductor layer over the second section. A top surface of the first grid pattern is located at a first level, a top surface of the light-shield pattern is located at a second level, the first level is lower than the second level, and the first and second levels are defined with respect to the first surface of the semiconductor layer.