Abstract: The present disclosure relates to a preparation method of a super absorbent polymer composition. More specifically, it relates to a preparation method of a super absorbent polymer composition capable of pulverizing the hydrogel polymer to a normal particle size without agglomeration between particles by adding an additive having a specific structure, reducing manufacturing cost by simultaneously performing a drying process and a surface cross-linking process, and significantly reducing the amount of fine powder generated during the process.

Abstract: A micro-lens array is provided. The micro-lens array includes a transparent substrate, a plurality of polarizers disposed on the transparent substrate, a passivation layer covering the plurality of polarizers, and a plurality of micro-lenses disposed on the passivation layer, wherein light reflected to an object passes through the transparent substrate, and then, is polarized based on a plurality of different polarization orientations formed by the plurality of polarizers and is incident on the plurality of micro-lenses.

Abstract: An attachable/detachable toecap coupled to the front of the work shoes is disclosed. The attachable/detachable toecap coupled to the front of the work shoe comprises a top plate formed to cover toes and a portion of top of a foot; a side plate formed to extend downwards from the side of the top plate and to surround the top plate; a bottom plate formed to be under the side plate and to cover the bottom of the front of the work shoe; and an anti-separation means for preventing separation of the toecap from the work shoes, wherein the anti-separation means further comprises coupling blocks protruding from the bottom of the work shoe and coupling grooves formed to have vertical perforations at the position corresponding to the coupling blocks, so that the coupling blocks are snap-fitted to prevent the separation of the toecap from the work shoe.

Abstract: A semiconductor package includes a package substrate, a connection pad including a recessed portion disposed on one surface of the package substrate, and an insulating pattern disposed on the one surface of the package substrate to be spaced apart from the connection pad. The connection pad includes an outer sidewall, an inner sidewall in the recessed portion inclining in an inward direction from an upper portion, and a groove pattern formed on the inner sidewall.

Abstract: A method of generating compensating data for a pixel circuit differences in a display device includes displaying a test image of pixels of the display device; generating a first camera image by photographing the test image; applying a test input signal to each of the pixels and sensing corresponding test outputs, wherein the test input signal is at least one of a test current and a test voltage; generating weights for the pixels based on the test outputs; generating a second camera image by applying the weights to the first camera image; and generating compensation data for the pixels based on the second camera image.

Abstract: The present disclosure is directed to compounds of formula (I): wherein X, Y, R1, R2 and R3 are as described herein, as stereoisomers, enantiomers or tautomers thereof or mixtures thereof; or pharmaceutically acceptable salts, solvates or prodrugs thereof, and pharmaceutical compositions comprising the compounds of formula (I), as described herein, which are useful as voltage-gated sodium channel modulators and are therefore are useful in treating seizure disorders such as epilepsy.

Abstract: A superconducting device includes a frequency tunable device comprising a first conductive pad and a second conductive pad that are connected to each other by a Josephson junction, a ferromagnetic structure disposed at a predetermined distance apart from the first and second conductive pads, a control line located below the ferromagnetic structure, and a control circuit configured to control a resonant frequency of the frequency tunable device by controlling current flowing through the control line.

Abstract: A hot-melt adhesive composition includes a styrene-butadiene-styrene triblock copolymer and a styrene-isoprene-styrene triblock copolymer. The hot-melt adhesive composition enables melt processing at a relatively low temperature because of having a low viscosity properties are property and thus exhibits excellent adhesive strength and heat resistance while improving the processability. In particular, the melt adhesive composition has excellent mechanical properties after curing, and thus can be used in various industrial fields.

Abstract: The present disclosure relates to an organic light emitting diode in which an emitting material layer disposed between two electrodes includes a first compound forming a fused ring among a boron atom and at least one of oxygen atom, sulfur atom and a selenium atom, and a second compound forming a fused ring between a boron atom and a nitrogen atom, and an organic light emitting device including the organic light emitting diode. The first compound and the second compound may be included in the same emitting material layer or adjacently disposed emitting material layers. The organic light emitting diode includes the emitting material layer where includes first and second compounds with adjusting their energy levels so that driving voltages of the organic light emitting diode can be lowered and luminous efficiency and luminous lifetime of the organic light emitting diode can be improved.

Abstract: A secondary battery includes: an electrode assembly including a first electrode plate, a separator, and a second electrode plate; a case in which the electrode assembly is accommodated; a cover part closing an open upper side of the case; and a pressure measurement part detachably installed on the cover part and configured to measure a pressure inside the case.

Abstract: An example computer system for providing a maturity model can include: one or more processors; and non-transitory computer-readable storage media encoding instructions which, when executed by the one or more processors, causes the computer system to: use a cloud computing cybersecurity matrix that organizes a suite of cybersecurity capabilities associated with a cloud computing environment; overlay the maturity model onto the cloud computing cybersecurity matrix, the maturity model measuring a maturity level of technologies associated with the cloud computing environment; and display a dashboard showing the cloud computing cybersecurity matrix with the maturity model overlaid thereon.

Abstract: A semiconductor package includes a semiconductor chip including a chip pad, a first insulating layer provided on the semiconductor chip and including a first via hole, a first wiring pattern provided on the first insulating layer and connected to the chip pad through the first via hole of the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring pattern and including a second via hole, and a second wiring pattern provided on the second insulating layer and connected to the first wiring pattern through the second via hole of the second insulating layer, wherein the first insulating layer includes a first upper surface in contact with the second insulating layer and a first lower surface opposite to the first upper surface, and the first upper surface of the first insulating layer has surface roughness greater that the first lower surface of the first insulating layer.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: Exemplary substrate processing chambers may include a chamber body defining a processing region. The chambers may include a backing plate disposed atop the chamber body, a diffuser above the processing region and supported by the backing plate, and a cooling frame disposed between the backing plate and the diffuser. The cooling frame may be coupled with the diffuser. The cooling frame may include a body having one or more fluid inlets and one or more fluid outlets. The body may define an opening. The fluid inlets may be in fluid communication with the one or more fluid outlets via one or more fluid lumens that each extend at least partially about a periphery of the opening. The fluid inlets may be in fluid communication with one or more fluid supply lumens. The fluid outlets may be in fluid communication with one or more fluid return lumens.

Abstract: A semiconductor package includes an upper structure including a semiconductor chip and a first molding layer for molding the semiconductor chip, a lower structure provided on the upper structure, the lower structure including a conductive post and a second molding layer for molding the conductive post, and a redistribution structure provided between the upper structure and the lower structure, the redistribution structure including a wiring pattern for electrically connecting a pad of the semiconductor chip to the conductive post, in which a thermal expansion coefficient of the second molding layer is different from a thermal expansion coefficient of the first molding layer.

Abstract: An organic light emitting diode (OLED) including at least one emitting material layer (EML) disposed between two electrodes and comprising a first compound including a fused ring of boron and oxygen as a nuclear atom and a second compound including a fused ring of born and nitrogen as a nuclear atom and an organic light emitting device including the OLED is disclosed. The first compound and the second compound may be the same emitting material layer or adjacently disposed emitting material layers. The OLED can lower its driving voltage and improve its luminous efficiency using the first and second compounds with adjusting their energy levels.

Abstract: An adhesive film for polarizing plates, a polarizing plate including the same, and an optical display apparatus including the same are provided. An adhesive film for polarizing plates is formed of an adhesive composition including a (meth)acrylic copolymer, an isocyanate curing agent, a metal chelate curing agent, and an antistatic agent, and has a surface resistance difference ?SR of 1.0 (log(?/?)) or less, as calculated by Equation 1 and, in Equation 1, SR1 is 10 (log(?/?)) or less.

Abstract: An electrolyte solution for a lithium secondary battery according to embodiments of the present disclosure includes a lithium salt, an organic solvent, a phosphate-based additive and a radical remover. Flame retardancy and high-temperature stability of the electrolyte solution are improved, and a lithium secondary battery including the electrolyte solution and having improved high-temperature life-span and storage properties is be provided.

Abstract: A secondary battery includes: an electrode assembly including a first electrode tab and a second electrode tab exposed at opposite sides, respectively; a case accommodating the electrode assembly and open on opposite sides; a first cap plate that seals a first side opening of the case; a first current collector that is in contact with and coupled to the first electrode tab exposed at a first side of the electrode assembly, the first current collector including a coupling hole; and a first terminal including a coupling protrusion inserted and coupled to the coupling hole of the first current collector, the first terminal including a portion exposed to an outside of the first cap plate, and an outer diameter of an end of the coupling protrusion is larger than outer diameters of other regions thereof.

Abstract: A superconducting qubit-based device includes: a superconducting qubit comprising a first conductive pad and a second conductive pad, each being formed of a superconducting material, and a ferromagnetic body configured to form a Josephson junction with the first conductive pad and the second conductive pad; a conducting wire spaced apart from the ferromagnetic body by a predetermined distance; and a control circuit configured to control a resonance frequency of the superconducting qubit by controlling a current flowing through the conducting wire.