Patents by Inventor Yun Kwang Jeon
Yun Kwang Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210183618Abstract: Embodiments of the inventive concepts provide antennas, plasma generating circuits, plasma processing apparatus, and methods for manufacturing semiconductor devices using the same. The circuits include radio-frequency power sources generating radio-frequency powers, antennas receiving the radio-frequency powers to generate plasma and having a first mutual inductance, and inductors connecting the antennas to the radio-frequency power sources, respectively. The inductors have a second mutual inductance reducing and/or canceling the first mutual inductance.Type: ApplicationFiled: February 26, 2021Publication date: June 17, 2021Inventors: Dong-Hyub LEE, Dougyong SUNG, Je-Hun WOO, Bongseong KIM, Juho LEE, Yun-Kwang JEON, Junghyun CHO
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Patent number: 10971333Abstract: Embodiments of the inventive concepts provide antennas, plasma generating circuits, plasma processing apparatus, and methods for manufacturing semiconductor devices using the same. The circuits include radio-frequency power sources generating radio-frequency powers, antennas receiving the radio-frequency powers to generate plasma and having a first mutual inductance, and inductors connecting the antennas to the radio-frequency power sources, respectively. The inductors have a second mutual inductance reducing and/or canceling the first mutual inductance.Type: GrantFiled: October 3, 2017Date of Patent: April 6, 2021Inventors: Dong-Hyub Lee, Dougyong Sung, Je-Hun Woo, Bongseong Kim, Juho Lee, Yun-Kwang Jeon, Junghyun Cho
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Patent number: 10971343Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.Type: GrantFiled: January 30, 2019Date of Patent: April 6, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Protopopov Vladimir, Ki Ho Hwang, Doug Yong Sung, Se Jin Oh, Kul Inn, Sung Ho Jang, Yun Kwang Jeon
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Patent number: 10903053Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.Type: GrantFiled: August 23, 2019Date of Patent: January 26, 2021Inventors: Hak Young Kim, Jung Pyo Hong, Jong Woo Sun, Doug Yong Sung, Yong Ho Lim, Yun Kwang Jeon, Hwa Jun Jung
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Patent number: 10896838Abstract: An electrostatic chuck includes a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base. The chuck further includes an upper heater section including upper heaters between the lower heaters and the chuck electrode, and a upper ground electrode between the upper heaters and the lower heaters, and a plurality of via contact electrodes connecting the upper ground electrode into the lower ground electrode.Type: GrantFiled: January 15, 2019Date of Patent: January 19, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minsung Kim, Myoung Soo Park, Dougyong Sung, Yun-Kwang Jeon
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Patent number: 10861724Abstract: Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.Type: GrantFiled: April 13, 2018Date of Patent: December 8, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongwoo Sun, Hakyoung Kim, Yun-Kwang Jeon, Wonyoung Jee
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Patent number: 10854485Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.Type: GrantFiled: December 4, 2019Date of Patent: December 1, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minsung Kim, Myoung Soo Park, Dongyun Yeo, Dougyong Sung, Suho Lee, Yun-Kwang Jeon
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Publication number: 20200126827Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.Type: ApplicationFiled: December 4, 2019Publication date: April 23, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minsung KIM, Myoung Soo PARK, Dongyun YEO, Dougyong SUNG, Suho LEE, Yun-Kwang JEON
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Patent number: 10566221Abstract: The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate transferring apparatus including a chamber, a filter assembly disposed in a chamber to provide external air into the chamber, and an additional assembly including a moisture removing part and a purge gas providing part sequentially stacked on the filter assembly may be provided. The filter assembly may be coupled to the additional assembly.Type: GrantFiled: September 26, 2018Date of Patent: February 18, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun Sun Choi, Yun-Kwang Jeon, Taekyun Kang
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Patent number: 10522374Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.Type: GrantFiled: December 28, 2017Date of Patent: December 31, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minsung Kim, Myoung Soo Park, Dongyun Yeo, Dougyong Sung, Suho Lee, Yun-Kwang Jeon
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Publication number: 20190378693Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.Type: ApplicationFiled: August 23, 2019Publication date: December 12, 2019Inventors: Hak Young Kim, Jung Pyo Hong, Jong Woo Sun, Doug Yong Sung, Yong Ho Lim, Yun Kwang Jeon, Hwa Jun Jung
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Patent number: 10481005Abstract: A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.Type: GrantFiled: October 11, 2018Date of Patent: November 19, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Se Jin Oh, Tae Kyun Kang, Yu Sin Kim, Jae Ik Kim, Chan Bin Mo, Doug Yong Sung, Seung Bin Ahn, Kul Inn, Yun Kwang Jeon
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Publication number: 20190323893Abstract: A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.Type: ApplicationFiled: October 11, 2018Publication date: October 24, 2019Inventors: SE JIN OH, TAE KYUN KANG, YU SIN KIM, JAE IK KIM, CHAN BIN MO, DOUG YONG SUNG, SEUNG BIN AHN, KUL INN, YUN KWANG JEON
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Patent number: 10395900Abstract: A plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.Type: GrantFiled: January 25, 2017Date of Patent: August 27, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Hak Young Kim, Jung Pyo Hong, Jong Woo Sun, Doug Yong Sung, Yong Ho Lim, Yun Kwang Jeon, Hwa Jun Jung
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Publication number: 20190164731Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.Type: ApplicationFiled: January 30, 2019Publication date: May 30, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Protopopov VLADIMIR, Ki Ho HWANG, Doug Yong SUNG, Se Jin OH, Kul INN, Sung Ho JANG, Yun Kwang JEON
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Publication number: 20190148205Abstract: An electrostatic chuck includes a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base. The chuck further includes an upper heater section including upper heaters between the lower heaters and the chuck electrode, and a upper ground electrode between the upper heaters and the lower heaters, and a plurality of via contact electrodes connecting the upper ground electrode into the lower ground electrode.Type: ApplicationFiled: January 15, 2019Publication date: May 16, 2019Inventors: Minsung KIM, Myoung Soo PARK, Dougyong SUNG, Yun-Kwang JEON
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Publication number: 20190080944Abstract: Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.Type: ApplicationFiled: April 13, 2018Publication date: March 14, 2019Inventors: Jongwoo SUN, Hakyoung KIM, Yun-Kwang JEON, Wonyoung JEE
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Patent number: 10229818Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.Type: GrantFiled: September 9, 2016Date of Patent: March 12, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Protopopov Vladimir, Ki Ho Hwang, Doug Yong Sung, Se Jin Oh, Kul Inn, Sung Ho Jang, Yun Kwang Jeon
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Patent number: 10224228Abstract: A substrate processing apparatus includes an electrostatic chuck which is made up of a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a first heater section in the dielectric plate between the chuck electrode and the base. The first heater section includes first heaters that are separated from each other in a first direction, and respective first upper plate electrodes disposed between the first heaters and the base. The first upper plate electrodes are separated from each other in the first direction and respectively connected to the first heaters.Type: GrantFiled: January 31, 2017Date of Patent: March 5, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minsung Kim, Myoung Soo Park, Dougyong Sung, Yun-Kwang Jeon
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Publication number: 20190067054Abstract: The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate transferring apparatus including a chamber, a filter assembly disposed in a chamber to provide external air into the chamber, and an additional assembly including a moisture removing part and a purge gas providing part sequentially stacked on the filter assembly may be provided. The filter assembly may be coupled to the additional assembly.Type: ApplicationFiled: September 26, 2018Publication date: February 28, 2019Applicant: Samsung Electronics Co., Ltd.Inventors: Hyun Sun Choi, Yun-Kwang Jeon, Taekyun Kang