Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Abstract: A method for preparing a flexible sol-gel polishing block, the method comprises: (1) adding a gel agent and a 20 ?m diamond abrasive into deionized water, and stirring to even to obtain a first material; (2) adding carbon fiber into the first material obtained in the step 1, and mixing to even to obtain a second material; (3) injecting the second material obtained in the step 2 into a mold, and curing to obtain a cured gel; and (4) drying the cured gel to obtain the flexible sol-gel polishing block.

Abstract: Protecting against potentially harmful app (PHA) installation on a mobile device. In some embodiments, a method may include identifying apps already installed on multiple mobile devices, identifying PHAs in the apps already installed on the multiple mobile devices, training a machine learning classifier, based on the apps already installed on multiple mobile devices, to predict a likelihood that each of the PHAs will be installed on any mobile device, identifying one or more apps already installed on a particular mobile device, predicting, using the machine learning classifier, a likelihood that a target PHA of the PHAs will be installed on the particular mobile device based on the one or more apps already installed on the particular mobile device, and in response to the likelihood being higher than a threshold, performing a remedial action to protect the particular mobile device from the target PHA.

Abstract: A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.

Abstract: A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Abstract: A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

Abstract: A breath detecting system and breath detecting mat thereof are disclosed. The breath detecting mat is placed under bed mattress and has a hollow board, a vibration sensor and a signal processing circuit. The vibration sensor and the signal processing circuit are mounted in the hollow board. The vibration sensor senses the micro-vibrations caused by the breathing of the person is lying on the bed mattress and outputs the breath sensing signal to the signal processing circuit. The signal processing circuit samples the sensing signal according to different moving average points to generate the fast-moving and slow-moving average signals. Since the first fast-moving and slow-moving average signals have many cross points, the signal processing circuit calculates each time difference between every two adjacent cross points. A present breath frequency is calculated according to the time differences. Therefore, the noises of the sensing signal are effectively removed.

Abstract: A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.

Abstract: A processor with an elliptic curve cryptographic algorithm and a data processing method thereof are shown. Three elliptic curve cryptographic instructions are proposed in the instruction set architecture for key exchange between an initiator and a responder. The initiator device executes the first elliptic curve cryptographic instruction to generate a key pair (rA, RA). In addition to considering the first temporary public key RA, the responder device further takes the second temporary public key RB into consideration when executing the second elliptic curve cryptographic instruction to generate the responder-generated shared key KB. Based on the temporary private key rA, and the temporary public keys RA and RB, the initiator device executes the third elliptic curve cryptographic instruction to generate the initiator-generated shared key KA.

Abstract: A processor with an elliptic curve cryptographic algorithm and a data processing method thereof are shown. The processor has a first register, storing a private key pointer pointing to a private key. In response to a single elliptic curve cryptographic instruction of an instruction set architecture, the processor reads a ciphertext input from a first storage space within a system memory, performing a decryption procedure using the elliptic curve cryptographic algorithm on the ciphertext input based on the private key obtained by referring to the first register to decrypt the ciphertext input and generate a plaintext output, and programming the plaintext output into a second storage space within the system memory.

Abstract: A processor with an elliptic curve cryptographic algorithm and a data processing method thereof are shown. The processor has a first register, storing a public key pointer pointing to a public key. In response to a single elliptic curve cryptographic instruction of an instruction set architecture, the processor reads a plaintext input from a first storage space within a system memory, performing an encryption procedure using the elliptic curve cryptographic algorithm on the plaintext input based on the public key obtained by referring to the first register to encrypt the plaintext input and to generate a ciphertext output, and programming the ciphertext output into a second storage space within the system memory.

Abstract: A processor with an elliptic curve cryptographic algorithm and a data processing method thereof are shown. The processor has first register storing a Hash value pointer, and a second register, storing a private key pointer. In response to a first elliptic curve cryptographic instruction of an instruction set architecture, the processor reads a first storage space within a system memory by referring to the first register to get a Hash value of the data to be signed, reads a private key by referring to the second register, performs a signature procedure using the elliptic curve cryptographic algorithm on the Hash value based on the private key to generate a digital signature, and programs the digital signature into a second storage space within the system memory.

Abstract: A processor with an elliptic curve cryptographic algorithm and a data processing method thereof are shown. The processor has a first register storing a Hash value pointer, a second register storing a public key pointer, a third register storing a signature pointer, and a fourth register for storage of a verified result. In response to a first elliptic curve cryptographic instruction of an instruction set architecture, the processor reads the Hash value of the data by referring to the first register, obtains the public key by referring to the second register, obtains the digital signature to be verified by referring to the third register, performs a signature verification procedure using the elliptic curve cryptographic algorithm on the Hash value based on the public key and the digital signature to be verified to generate the verified result, and programs the verified result into the fourth register.

Abstract: A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1=3˜65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2=0.02˜3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3=0.02˜1.0 W/m.K. A circuit board and its manufacturing method are also provided.

Abstract: A visible-light-image physiological monitoring system with thermal detecting assistance is disclosed. The system takes a visible-light image and a thermal image of a body at the same time. A processing unit identifies a body feature of the visible-light image and determines a coordinate of the feature. In a learning mode, an initial temperature of the body feature is determined from the thermal image according to the coordinate of the body feature. After then, a physiological status monitoring mode is executed to monitor the temperature changes of the body feature and output an alarm when the temperature is determined to be abnormal. Therefore, a monitoring accuracy of the visible-light-image physiological monitoring system is increased and avoids transmitting false alarms or no alarms.

Abstract: A server chassis includes a housing and two support portions. A bottom plate of the housing includes a loading surface and a three-dimensional reinforcing pattern integrally formed on the loading surface for reinforcing the structural strength of the bottom plate. The support portions are respectively located on an outer surface of the sidewall of the housing. A coverage area of the three-dimensional reinforcing pattern is greater than 10% of the total area of the loading surface. The three-dimensional reinforcing pattern includes a plurality of texture patterns regularly reproduced on the loading surface toward a linear axial direction. The three-dimensional reinforcing pattern also includes a plurality of first arc portions and a plurality of second arc portions arranged in a staggered alignment.

Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Abstract: We describe a cell culture medium comprising a basal medium supplemented with a CDK1/2/9 inhibitor and a Bcr-Abl/Src kinase inhibitor. The CDK1/2/9 inhibitor may comprise AZD5438 and the Bcr-Abl/Src kinase inhibitor may comprise Dasatinib. The cell culture medium may be capable of maintaining or increasing pluripotency in a cell cultured in the cell culture medium in the absence of co-culture such as feeder cells. We describe the use of such a medium for feeder-free culture of a naïve pluripotent stem cell as well as re-programming of a primed pluripotent stem cell into a naïve pluripotent stem cell.

Abstract: A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.