Abstract: A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing

Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

Abstract: A data processing method includes the following steps: a processor receives a symmetric wrapping key, and when an application needs to use a user private key, the processor executes an encryption and decryption instruction in a hardware-acceleration instruction-set. The encryption and decryption instruction is configured to apply the symmetric wrapping key to decrypt a wrapped private key that corresponds to the application to obtain the user private key. In addition, the symmetric wrapping key is stored in a model specific register of the processor.

Abstract: A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and third circuit board (50) in that order, and stacking the fourth circuit board (60), the sixth circuit board (62), and the fifth circuit board (61) on the third circuit board (50), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Abstract: A method for manufacturing a circuit board is disclosed. An inner laminated structure with a conductive wiring layer and an outermost cover layer is provided. The conductive wiring layer includes a connection pad. A mask is disposed on a side of the cover layer away from the conductive wiring layer, and the mask defines a plurality of first openings penetrating the mask. A second opening is formed on the cover layer by laser etching through the mask to expose the connection pad. A surface treatment is applied to the connection pad and an electronic component is electrically connected with the connection pad. A circuit board is also disclosed.

Abstract: An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

Abstract: A reconfigurable metamaterial is used to enhance the reception field of a radio frequency (“RF”) coil for use in magnetic resonance imaging (“MRI”). In general, the metamaterial can be a metasurface, which may be flexible, having a periodic array of resonators. Each resonator in the periodic array can be defined as a unit cell of the metamaterial and/or metasurface. The unit cells include a first conductor and a second conductor separated by an insulator layer. The first conductor can be a solid conductor and the second conductor can be a conductive fluid (e.g., a liquid metal, a liquid metal alloy) contained within a microfluidic channel. Varying the volume of conductive fluid in each unit cell adjust the signal enhancement ratio of the metamaterial.

Abstract: A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Abstract: A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.

Abstract: A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Abstract: An optical image physiological monitoring system with radar detection assistance is disclosed. The system receives a visible-light image of a body and then identifies a chest feature of the visible-light image and determines a position of the chest feature. A processing unit controls a radar detector to move to aim a chest of the body. After then, a plurality of visible-light images and distance values from the radar detector are received continuously to determine whether the positions of the chest features are in a position change rage. If yes, a breathing frequency of the body is determined by the distance values received simultaneously.

Abstract: A front sight movement control method, device and storage medium for shooting games, having the following steps. S100: Get the image frame corresponding to the muzzle aiming position. If there is a first coordinate, determine whether there is a positioning spot in the said image frame and proceed to S100 if not or take it as a first coordinate and proceed to S100 if yes. If there is a first coordinate, determine whether there is a positioning spot in the said image frame and delete a first coordinate and proceed to S100 if not, or take it as a second coordinate if yes. S300: Get an offset value as a movement value of a front sight. S400: Replace a first coordinate with a second coordinate, and proceed to S100. This method can realize the target aiming through moving the gun muzzle, which enhances the sense of immersion and novelty that the user feels when playing a shooting game.

Abstract: An image detection method for selecting a representative image of a user is provided. In the image detection method, a plurality of images of the user are obtained, and a plurality of feature parameters of the plurality of images are obtained. A face occlusion analysis is performed on the plurality of images according to the plurality of feature parameters to determine whether the plurality of images clearly show the user's face. A plurality of feature vectors are determined, and a body distribution analysis is performed on the plurality of images according to the plurality of feature vectors to determine a body position and a position type of the user. An image related to the position type is selected according to results of the face occlusion analysis and the body distribution analysis.

Abstract: A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.

Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Abstract: The disclosed computer-implemented method for protecting users may include (i) identifying a first light-and-radio frequency signature that was captured by a security device based on signals emanating from a mobile computing device at a first time and location, (ii) identifying a second light-and-radio frequency signature that was captured by a same or different security device based on signals emanating from the same mobile computing device at a second time and location, (iii) determining that the first light-and-radio frequency signature and the second light-and-radio frequency signature match such that an inference is made that an individual possessing the mobile computing device was present at both the first time and location and the second time and location, and (iv) performing, based on the inference, a security action to protect a user. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Abstract: The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

Abstract: A high-frequency signal transmission structure capable of transmitting high frequency signals with reduced attenuation includes a first wiring board and a second wiring board. The first wiring board includes a first conductor layer, a second conductor layer, and a first base film layer sandwiched between the first conductor layer and the second conductor layer. The second wiring board includes a second base film layer and a third conductor layer. the second base film layer covers the surface of the first conductor layer facing away from the first base film layer. The first base film layer and the second base film layer surround the first conductor layer and both include an aerogel film layer having an air to gel ratio by volume of 80-99%. A method for manufacturing the high-frequency signal transmission structure is also disclosed.

Abstract: A server chassis includes a housing and two support portions. A bottom plate of the housing includes a loading surface and a three-dimensional reinforcing pattern integrally formed on the loading surface for reinforcing the structural strength of the bottom plate. The support portions are respectively located on an outer surface of the sidewall of the housing. A coverage area of the three-dimensional reinforcing pattern is greater than 10% of the total area of the loading surface. The three-dimensional reinforcing pattern includes a plurality of texture patterns regularly reproduced on the loading surface toward a linear axial direction. The three-dimensional reinforcing pattern also includes a plurality of first arc portions and a plurality of second arc portions arranged in a staggered alignment.