Abstract: A magnetic latch assembly includes a first body, a second body, and a magnetic block and a magnetic latch. The magnetic block is movably disposed on the first body; therefore, it can be selectively moved close to or far away a first opening of the first body. The magnetic latch is disposed on the second body corresponding to a second opening of the second body. In addition, two ends of the magnetic latch form a hook portion and a tip portion, respectively. When the first body is close up against the second body and the magnetic block is moved close to the first opening, the magnetic block and the tip portion repel each other due to magnetic force so as to drive the magnetic latch rotating, so that the hook portion is moved and passing through the second opening and the first opening and hooked against the first body.

Abstract: A two-way fastening structure for a tablet PC comprises a mainframe, a cover body, a pusher, and a fastener. The mainframe has a fastening groove, and a magnetic element is provided adjacent to the fastening groove. The cover body has a bottom wall and a top wall opposite to the bottom wall. The bottom wall and the top wall respectively have a first opening and a second opening corresponding to the fastening groove. The pusher is slidably disposed within the cover body corresponding to the first opening and the second opening. The pusher is provided with an elastic element at one end, such that the pusher has a first position and a second position. When the cover body is turned to cover the mainframe, the magnetic element attracts the fastener, such that the fastener protrudes from the first opening or the second opening, and thereby snapping in the fastening groove.

Abstract: The invention discloses a display panel. A substrate comprising a chip bonding region and a cut cross-section is provided. A first conductive layer is disposed on the chip bonding region. An insulating layer is disposed on the substrate between the first conductive layer and the cut cross-section, covering a sidewall of the first conductive layer. A second conductive layer is disposed on the insulating layer extending until the cut cross-section and electrically connected to the first conductive layer.

Abstract: A card insertion structure of an electronic device is provided, which includes an accommodating groove caved in the electronic device, a first cover covered on the accommodating groove, a card slot extending from a wall of the accommodating groove, and a second cover pivotally disposed on the electronic device. The card slot is used for inserting a card such as a subscriber identity module (SIM) card, and the first cover catches the second cover to be in a covered position. When the card is to be ejected, the second cover cannot be pivoted unless the first cover is removed first, and the second cover pushes the card to move outwards when being pivoted, thus achieving the purpose of ejecting the card. Furthermore, due to the catch of the first cover, the card cannot be ejected if the second cover is inappropriately pivoted, thereby avoiding damaging the card.

Abstract: A fastening and automatic ejecting structure for a battery of a notebook is provided, which comprises: a first fastening element disposed on a predetermined position of the computer and swinging to and fro between a first position and a second position in a predetermined direction; a second fastening element disposed on a predetermined position of the battery and moving to and fro between a third position and a fourth position in a predetermined direction along with the battery. Moreover, when the battery is pushed and moves from the third position to the fourth position, the first fastening element will be forced to swing towards the second position and to be bound with the predetermined position of the battery. When the battery is pushed again and moves from the fourth position to the third position, the first fastening element will be released from the battery.

Abstract: A fastening and automatic ejecting structure for a battery of a notebook is provided, which comprises: a first fastening element disposed on a predetermined position of the computer and swinging to and fro between a first position and a second position in a predetermined direction; a second fastening element disposed on a predetermined position of the battery and moving to and fro between a third position and a fourth position in a predetermined direction along with the battery. Moreover, when the battery is pushed and moves from the third position to the fourth position, the first fastening element will be forced to swing towards the second position and to be bound with the predetermined position of the battery. When the battery is pushed again and moves from the fourth position to the third position, the first fastening element will be released from the battery.

Abstract: A liquid crystal display includes a glass substrate, a plurality of pixels formed on the glass substrate for displaying an image according to gamma voltages, a voltage divider installed on a printed circuit board, the voltage divider including a resistor and a thermistor coupled in series with the resistor for generating gamma voltages for the pixels, and a driver IC chip coupled to the pixels and the voltage divider for controlling the voltage divider to generate gamma voltages to the pixels.

Abstract: A method for bonding an IC chip to a substrate where the method comprises the steps of providing an IC chip with a plurality of bumps each having a buffer layer and a conductive layer, providing a substrate having a plurality of conductive elements arranged corresponding to the plurality of bumps, placing a non-conductive film between the plurality of conductive devices and their corresponding bumps, and pressing and heating the IC chip and the substrate so that the plurality of bumps are in contact with the plurality of conductive elements respectively. The bonding structure is formed between a first and second substrate where the structure has a buffer layer having an opening and formed on the first substrate, a conductive layer formed on the buffer layer, and a non-conductive film formed between the conductive layer and the second substrate as a bonding medium for the bonding structure.

Abstract: An electrical conducting structure including an integrated circuit, a substrate, and a plurality of bumps, wherein at least one bump comprises a first conductive part connected to the integrated circuit at one end; a second conductive part connected to the integrated circuit at one end; a conductive connection part connecting the first conductive part and the second conductive part; a first insulation part surrounding the first conductive part and the second conductive part; and a second insulation part located between the first conductive part and the second conductive part.

Abstract: An electrical conducting structure including an integrated circuit, a substrate, and a plurality of bumps, wherein at least one bump comprises a first conductive part connected to the integrated circuit at one end; a second conductive part connected to the integrated circuit at one end; a conductive connection part connecting the first conductive part and the second conductive part; a first insulation part surrounding the first conductive part and the second conductive part; and a second insulation part located between the first conductive part and the second conductive part.

Abstract: A liquid crystal display module manufactured by a chip-on-glass technology includes at least one glass substrate having a display area and a peripheral area. A plurality of scan and data lines is separately formed on the display area along horizontal and vertical directions. The liquid crystal display module also includes at least one gate driver chip and at least one source driver chip mounted on the peripheral area. The gate and source driver chips transmit signals to the scan and data lines via a plurality of output terminals, and thicknesses of the gate and source driver chips are less than 0.3 mm.

Abstract: A testing design for flip chip connection process. In one embodiment the testing design has a substrate, a plurality of connections formed on said substrate, at least one integrated device and a plurality of bumps formed on said integrated device, wherein at least one of said bumps is electrically connected to said plurality of connectors to form an electrical channel.

Abstract: The present invention describes a conductive bump structure. This structure comprises a buffer layer. The buffer layer manifests a deformation during bonding process. This deformation may compensate for the height difference among the gold bumps.

Abstract: A testing design for flip chip connection process. In one embodiment the testing design has a substrate, a plurality of connections formed on said substrate, at least one integrated device and a plurality of bumps formed on said integrated device, wherein at least one of said bumps is electrically connected to said plurality of connectors to form an electrical channel.

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract: A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention provides a method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed.

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract: A fiber optic sensor is also disclosed for measuring or detecting the prece of an environmental field condition such as under-water acoustic perturbations. The sensor includes a force transfer transducer, which is enclosed within a shell, with a pressure equalizer for equalizing the interior and exterior shell pressures. An optical fiber is coiled about the transducer. An optical detector detects stress or strain in the optical fiber, resulting from external perturbations. The sensor is able to operate at various depths or altitudes. Pressure equalization enables the isolation of dynamic external perturbations from other pressure variations. For this purpose, a pressure equalizing valve may be used to allow the equalization of slow changes in static pressures, and the detection of higher frequency perturbations which might emanate from a target source.