Abstract: The present invention is directed to a novel synthetic method for producing nanoscale heterostructures, and particularly nanoscale heterostructure particles, rods and sheets, that comprise a metal core and a monocrystalline semiconductor shell with substantial lattice mismatches between them. More specifically, the invention concerns the use of controlled soft acid-base coordination reactions between molecular complexes and colloidal nanostructures to drive the nanoscale monocrystalline growth of the semiconductor shell with a lattice structure incommensurate with that of the core. The invention also relates to more complex hybrid core-shell structures that exhibit azimuthal and radial nano-tailoring of structures. The invention is additionally directed to the use of such compositions in semiconductor devices.

Abstract: A latch module and an electronic device using the same are provided. The electronic device includes the latch module as well as first and second bodies that are opened and closed relative to each other. The latch module in the first body includes a pressing member, a linking member, and a latch. The pressing member is movably configured in and passes through the first body along a first axis. The linking member is pivoted to the first body. The pressing member leans against the linking member. The latch is configured in the first body along a second axis. The linking member leans against the latch. The pressing member moves relative to the first body along the first axis to press and rotate the linking member relative to the first body. Thus, the linking member presses the latch to move relative to the first body along the second axis.

Abstract: A button module including a cap, a first arm, a second arm, and a base is provided. The first arm has a first pivoting shaft, a first end connected to the cap, and a second end opposite to the first end. The second arm has a second pivoting shaft, a third end connected to the cap, and a fourth end opposite to the third end and pivoted to the second end. The first pivoting shaft and the second pivoting shaft are pivoted to the base respectively. A projection of the first pivoting shaft on the base is between a projection of the first end on the base and a projection of the second end on the base. A projection of the second pivoting shaft on the base is between a projection of the third end on the base and a projection of the fourth end on the base.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: A method and apparatus for aligning a device with a contactor is provided. The apparatus includes a pick and place device, for transporting the device. A first camera acquires an image of the device relative to device holder fiducials of the pick and place device. A second camera detects the location of the contactor relative to fiducials positioned on an alignment frame plate. A third camera to image frame and device holder fiducials to correlate the first and second camera coordinates. Given a processor determines the alignment difference between the device and the contactor. A plurality of actuators align the device with the contactor.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: A connection structure for a chip-on-glass (COG) driver IC and a connection method therefor are provided. The connection structure includes a driver IC having a surface provided with a plurality of polymeric bumps and a plurality of conductive bumps, and the height of the polymeric bumps in relation to the surface is smaller than that of the conductive bumps. When the driver IC is bonded to a glass substrate via an adhesive film by thermal compression bonding, the polymeric bumps are embedded into the adhesive film, and a gap is defined between the polymeric bumps and the glass substrate. Thus, the polymeric bumps can increase the contact area between the driver IC and the adhesive film, and enhance the connection reliability between the conductive bumps and pads of the glass substrate.

Abstract: A latch mechanism including a housing, a first device, a first sliding member, a second sliding member, a stopping portion and a second device is provided. The first and second devices and the first and second sliding members are disposed on the housing, wherein the first sliding member is located between the first device and the second sliding member. The stopping portion is disposed on at least one of the first device and the first sliding member for restricting a sliding distance of the first sliding member relative to the first device. The first sliding member is not allowed to drive the second sliding member to slide relative to the housing along a first direction to disengage the second device when sliding until the first device is detached from the housing and the engagement between the first device and the first sliding member is released.

Abstract: A liquid crystal display panel includes a lower substrate, a printed circuit board, at least one connection unit and a plurality of readout lines. The connection unit is adapted to connect the printed circuit board to a periphery region of the lower substrate, and has a driver. The readout lines are extended from the lower substrate to the printed circuit board through the connection unit having the driver.

Abstract: The present invention discloses a bump structure and a method for fabricating the same. The bump structure of the present invention comprises a semiconductor substrate having a plurality of connection pads; a passivation layer covering the substrate and having openings each corresponding to one connection pad, wherein the openings reveal a portion of each connection pad to form a plurality of electrical-connection areas; an elastic layer formed on the passivation layer; and a plurality of bumps each formed corresponding to one electric-connection area and extending to the elastic layer, whereby the elasticity and deformability of the bumps is enhanced. The present invention uses a larger-texture (?20 ?m) patterning process to fabricate an appropriate patterned elastic layer (having parallel lines, strips, or saw teeth) to enhance the elasticity and deformability of the bumps, whereby the bump structure of the present invention can apply to a fine-pitch IC.

Abstract: A method and apparatus for aligning a device with a contactor is provided. The apparatus includes a pick and place device, for transporting the device. A first camera acquires an image of the device relative to device holder fiducials of the pick and place device. A second camera detects the location of the contactor relative to fiducials positioned on an alignment frame plate. A third camera to image frame and device holder fiducials to correlate the first and second camera coordinates. Given a processor determines the alignment difference between the device and the contactor. A plurality of actuators align the device with the contactor.

Abstract: A chip having a bump layout suitable for the chip on glass technology and a driving IC includes a plurality of first bumps and a plurality of second bumps for electrically connecting to a glass substrate of a displayer. The first and second bumps are disposed on a surface of the chip and near two opposite long sides of the chip respectively. The ratio of the total contacting area of the first bumps to that of the second bumps is between 0.8 and 1.2. Thus, a pressure applied on the chip and the glass substrate of the displayer for connection can be uniformly exerted all over the chip, and the stability of the connection is therefore improved.

Abstract: The invention relates to a wiper mechanism (18) for a window panel (12) which is pivotable relative to the body (16) of the vehicle (10) between a closed position, and between an open position in which the window panel (12), comprising a shaft (22) for driving a wiper arm (24) in rotation around a rotation axis relative to the window panel (12), a motor reducer (26) comprising a driving shaft (36) which is capable of being coupled in rotation with the drive shaft (22) when the window panel is in the closed position, and means for locking (40) the drive shaft (22) in rotation relative to the plate (20), in a predetermined angular position, characterized in that the locking means (4) include a locking member (42) which is mounted movably relative to the plate (20), between a position for locking the drive shaft (22) in rotation relative to the plate (20), and an unlocked position enabling the drive shaft (22) to rotate relative to the plate (20).

Abstract: A display apparatus includes a substrate, a daisy chain, a driving circuit, and a conductive portion. The substrate has an electrode line. The daisy chain includes a first conducting wire separated from the electrode line. The first conducting wire has a first terminal and a second terminal. The conductive portion is disposed on the substrate. The first terminal is electrically connected to the electrode line and the second terminal is separated from the driving circuit.

Abstract: An electronic structural member or a semiconductor device having conductive bumps is provided. The conductive bump includes an organic buffer layer with an undercut structure, and the conductive bump is deformable during the bonding process so as to compensate the height difference between the conductive bumps. In addition, an adhesive is further disposed between the IC chip and the substrate, and partial adhesive fills in the undercut structure, such that not only the adhesive area can be increased to enhance the bonding force between the IC chip and the substrate, but the return force of the adhesive can be reduced.

Abstract: The invention discloses a display panel. A substrate comprising a chip bonding region and a cut cross-section is provided. A first conductive layer is disposed on the chip bonding region. An insulating layer is disposed on the substrate between the first conductive layer and the cut cross-section, covering a sidewall of the first conductive layer. A second conductive layer is disposed on the insulating layer extending until the cut cross-section and electrically connected to the first conductive layer.

Abstract: A magnetic latch assembly includes a first body, a second body, and a magnetic block and a magnetic latch. The magnetic block is movably disposed on the first body; therefore, it can be selectively moved close to or far away a first opening of the first body. The magnetic latch is disposed on the second body corresponding to a second opening of the second body. In addition, two ends of the magnetic latch form a hook portion and a tip portion, respectively. When the first body is close up against the second body and the magnetic block is moved close to the first opening, the magnetic block and the tip portion repel each other due to magnetic force so as to drive the magnetic latch rotating, so that the hook portion is moved and passing through the second opening and the first opening and hooked against the first body.

Abstract: The invention relates to a device for driving a windshield wiper arm of a motor vehicle. The inventive device comprises a first motive part (1) which is solidly connected to a support piece (10) which is in turn fixed to the body of the vehicle, said first part driving a second part (2) comprising a drive shaft (23) for driving the windshield wiper arm. The aforementioned second part is fixed to a bearing (20) that is solidly connected to an element that can move in relation to the body, in particular a rear window. In addition, the device is associated with a mounting part, known as a wedge mount (3), which provides a temporary link between the above-mentioned first and second parts, such that said parts are positioned correctly in relation to one another. According to the invention, the wedge is solidly connected to the first part or the second part (1, 2) by means of detachable tongue elements (30).