Patents by Inventor Yun Wen

Yun Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200365465
    Abstract: A method of forming a semiconductor device includes forming a gate structure over first and second fins over a substrate; forming an interlayer dielectric layer surrounding first and second fins; etching a first trench in the interlayer dielectric layer between the first and second fins uncovered by the gate structure; forming a helmet layer lining the first trench; and forming a dielectric feature in the first trench.
    Type: Application
    Filed: August 4, 2020
    Publication date: November 19, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Yun CHANG, Bone-Fong WU, Ming-Chang WEN, Ya-Hsiu LIN
  • Patent number: 10838253
    Abstract: A light source apparatus including a light-emitting module and a control unit is provided. The light-emitting module is configured to provide a light. The control unit is configured to make the light switched between a first light and a second light so that at least one of a blue-light hazard and a circadian stimulus value of the light is changed. A wavelength of a blue light main peak in a spectrum of the first light is different from a wavelength of a blue light main peak in a spectrum of the second light.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: November 17, 2020
    Assignees: Industrial Technology Research Institute, LRU TECHNOLOGY INC.
    Inventors: Tzung-Te Chen, Chia-Fen Hsieh, Tung-Yun Liu, Shih-Yi Wen, Chien-Chun Lu, Hsin-Yun Tsai
  • Publication number: 20200347419
    Abstract: A recombinant bacterium for producing L-lysine, a construction method thereof, and a method for producing L-lysine by using the recombinant bacterium. The recombinant bacterium has increased expression and/or activity of asparaginase compared to a starting bacterium.
    Type: Application
    Filed: May 22, 2018
    Publication date: November 5, 2020
    Inventors: Tingyi WEN, Chen ZHANG, Xiuling SHANG, Xin CHAI, Yun ZHANG, Shuwen LIU, Guoqiang WANG, Zhongcai LI
  • Publication number: 20200350347
    Abstract: A method for fabricating an image sensor array having a first group of photodiodes for detecting light at visible wavelengths a second group of photodiodes for detecting light at infrared or near-infrared wavelengths, the method including growing a germanium-silicon layer on a semiconductor donor wafer; defining pixels of the image sensor array on the germanium-silicon layer; defining a first interconnect layer on the germanium-silicon layer, wherein the interconnect layer includes a plurality of interconnects coupled to the first group of photodiodes and the second group of photodiodes; defining integrated circuitry for controlling the pixels of the image sensor array on a semiconductor carrier wafer; defining a second interconnect layer on the semiconductor carrier wafer, wherein the second interconnect layer includes a plurality of interconnects coupled to the integrated circuitry; and bonding the first interconnect layer with the second interconnect layer.
    Type: Application
    Filed: July 15, 2020
    Publication date: November 5, 2020
    Inventors: Yun-Chung Na, Szu-Lin Cheng, Shu-Lu Chen, Han-Din Liu, Hui-Wen Chen, Che-Fu Liang
  • Publication number: 20200333193
    Abstract: The surface temperature of a portable device is estimated. The portable device includes a sensor for detecting the internal temperature of the portable device. The portable device also includes circuitry for estimating the surface temperature, using the internal temperature and an ambient temperature of the portable device as input to a circuit model. The circuit model describes thermal behaviors of the portable device. The circuitry is operative to identify a scenario in which the portable device operates, and determine the ambient temperature using the scenario and at least the internal temperature.
    Type: Application
    Filed: July 3, 2020
    Publication date: October 22, 2020
    Inventors: Chi-Wen Pan, Pei-Yu Huang, Sheng-Liang Kuo, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li, Wei-Ting Wang
  • Patent number: 10806052
    Abstract: The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: October 13, 2020
    Assignee: WISTRON CORP.
    Inventors: Chi-Wen Chu, Yun An Chang
  • Publication number: 20200313029
    Abstract: Structures and techniques introduced here enable the design and fabrication of photodetectors (PDs) and/or other electronic circuits using typical semiconductor device manufacturing technologies meanwhile reducing the adverse impacts on PDs' performance. Examples of the various structures and techniques introduced here include, but not limited to, a pre-PD homogeneous wafer bonding technique, a pre-PD heterogeneous wafer bonding technique, a post-PD wafer bonding technique, their combinations, and a number of mirror equipped PD structures. With the introduced structures and techniques, it is possible to implement PDs using typical direct growth material epitaxy technology while reducing the adverse impact of the defect layer at the material interface caused by lattice mismatch.
    Type: Application
    Filed: April 14, 2020
    Publication date: October 1, 2020
    Inventors: Chien-Yu Chen, Szu-Lin Cheng, Chieh-Ting Lin, Yu-Hsuan Liu, Ming-Jay Yang, Shu-Lu Chen, Tsung-Ting Wu, Chia-Peng Lin, Yun-Chung Na, Hui-Wen Chen, Han-Din Liu
  • Patent number: 10790197
    Abstract: A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: I-Wen Wu, Hsien-Cheng Wang, Mei-Yun Wang, Shih-Wen Liu, Chao-Hsun Wang, Yun Lee
  • Publication number: 20200305002
    Abstract: A wireless device includes: a plurality of antennas; a first correlation series generator configured to generate a first correlation series based on transmission data; a second correlation series generator configured to generate a second correlation series based on the first correlation series; a first modulator configured to modulate the transmission data to generate a first modulated signal; a second modulator configured to modulate the first correlation series to generate a second modulated signal; a third modulator configured to modulate the second correlation series to generate a third modulated signal; a signal combiner configured to combine the first to third modulated signals to generate first to third transmission signals; and a transmitter configured to output the first to third transmission signals respectively via first to third antennas among the plurality of antennas.
    Type: Application
    Filed: January 24, 2020
    Publication date: September 24, 2020
    Applicant: FUJITSU LIMITED
    Inventors: YUN WEN, Makoto Yoshida
  • Patent number: 10785654
    Abstract: A wireless device includes: a plurality of antennas; a first correlation series generator configured to generate a first correlation series based on transmission data; a second correlation series generator configured to generate a second correlation series based on the first correlation series; a first modulator configured to modulate the transmission data to generate a first modulated signal; a second modulator configured to modulate the first correlation series to generate a second modulated signal; a third modulator configured to modulate the second correlation series to generate a third modulated signal; a signal combiner configured to combine the first to third modulated signals to generate first to third transmission signals; and a transmitter configured to output the first to third transmission signals respectively via first to third antennas among the plurality of antennas.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: September 22, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Yun Wen, Makoto Yoshida
  • Patent number: 10770504
    Abstract: An optical sensor including a semiconductor substrate; a first light absorption region formed in the semiconductor substrate, the first light absorption region configured to absorb photons at a first wavelength range and to generate photo-carriers from the absorbed photons; a second light absorption region formed on the first light absorption region, the second light absorption region configured to absorb photons at a second wavelength range and to generate photo-carriers from the absorbed photons; and a sensor control signal coupled to the second light absorption region, the sensor control signal configured to provide at least a first control level and a second control level.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: September 8, 2020
    Assignee: Artilux, Inc.
    Inventors: Yun-Chung Na, Szu-Lin Cheng, Shu-Lu Chen, Han-Din Liu, Hui-Wen Chen, Che-Fu Liang
  • Patent number: 10763766
    Abstract: The present teaching relates to a magnetic sensor residing in a housing. The magnetic sensor includes an input port and an output port, both extending from the housing, wherein the input port is to be connected to an external alternating current (AC) power supply. The magnetic sensor also includes an electric circuit which comprises an output control circuit coupled with the output port and configured to be at least responsive to a magnetic induction signal and the external AC power supply to control the magnetic sensor to operate in a state in which a load current flows through the output port. The magnetic induction signal is indicative of at least one characteristic of an external magnetic field detected by the electrical circuit and the operating frequency of the magnetic sensor is positively proportional to the frequency of the external AC power supply.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: September 1, 2020
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: Chi Ping Sun, Fei Xin, Ken Wong, Shing Hin Yeung, Hui Min Guo, Shu Zuo Lou, Xiao Ming Chen, Guang Jie Cai, Chun Fai Wong, Shu Juan Huang, Yun Long Jiang, Yue Li, Bao Ting Liu, En Hui Wang, Xiu Wen Yang, Li Sheng Liu, Yan Yun Cui
  • Patent number: 10756127
    Abstract: A method for fabricating an image sensor array having a first group of photodiodes for detecting light at visible wavelengths a second group of photodiodes for detecting light at infrared or near-infrared wavelengths, the method including growing a germanium-silicon layer on a semiconductor donor wafer; defining pixels of the image sensor array on the germanium-silicon layer; defining a first interconnect layer on the germanium-silicon layer, wherein the interconnect layer includes a plurality of interconnects coupled to the first group of photodiodes and the second group of photodiodes; defining integrated circuitry for controlling the pixels of the image sensor array on a semiconductor carrier wafer; defining a second interconnect layer on the semiconductor carrier wafer, wherein the second interconnect layer includes a plurality of interconnects coupled to the integrated circuitry; and bonding the first interconnect layer with the second interconnect layer.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: August 25, 2020
    Assignee: Artilux, Inc.
    Inventors: Yun-Chung Na, Szu-Lin Cheng, Shu-Lu Chen, Han-Din Liu, Hui-Wen Chen, Che-Fu Liang
  • Publication number: 20200266662
    Abstract: A wireless charging device of game machines, which comprises a game machine, provided with at least a table top, and the table top is provided with at least a concave tray; at least a wireless charging device, located in the concave tray of the table top; there is a panel at the top of the table top of the game machine, and the panel covers the wireless charging device in the tray; the wireless charging device comprises a wireless charging part and a charging support connected to each other. Thereby, the 3C product can be charged without a USB cable, it can be directly placed on the table top with a wireless charging device of game machine for wireless charging.
    Type: Application
    Filed: February 2, 2020
    Publication date: August 20, 2020
    Inventors: Nien-Chang HUANG, Yun-Ping CHEN, Yu-Chia HUNG, Hao-En HUNG, Po-Wen LU, Liang-Yi HO
  • Publication number: 20200258893
    Abstract: A non-volatile memory (NVM) cell includes a semiconductor wire including a select gate portion and a control gate portion. The NVM cell includes a select transistor formed with the select gate portion and a control transistor formed with the control gate portion. The select transistor includes a gate dielectric layer disposed around the select gate portion and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the control gate portion, a gate dielectric layer disposed on the stacked dielectric layer and a control gate electrode disposed on the gate dielectric layer. The stacked dielectric layer includes a first silicon oxide layer disposed on the control gate portion, a charge trapping layer disposed on the first silicon oxide, and a second silicon oxide layer disposed on the charge trapping layer.
    Type: Application
    Filed: April 27, 2020
    Publication date: August 13, 2020
    Inventors: Yun-Chi WU, Yu-Wen TSENG
  • Patent number: 10739206
    Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: August 11, 2020
    Assignee: MediaTek Inc.
    Inventors: Chi-Wen Pan, Pei-Yu Huang, Sheng-Liang Kuo, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li, Wei-Ting Wang
  • Patent number: 10741450
    Abstract: A method of forming a semiconductor device includes forming a gate structure over first and second fins over a substrate; forming an interlayer dielectric layer surrounding first and second fins; etching a first trench in the interlayer dielectric layer between the first and second fins uncovered by the gate structure; forming a helmet layer in the first trench; and filling the first trench with a dielectric feature.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: August 11, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Yun Chang, Bone-Fong Wu, Ming-Chang Wen, Ya-Hsiu Lin
  • Publication number: 20200251325
    Abstract: A semiconductor structure includes a substrate, a pair of first fins extending from the substrate, a pair of second fins extending from the substrate, an isolation feature over the substrate and separating bottom portions of the first and the second fins, a pair of first epitaxial semiconductor features over the pair of first fins respectively, a pair of second epitaxial semiconductor features over the pair of second fins respectively, and a first dielectric feature sandwiched between and separating the pair of first epitaxial semiconductor features. The pair of second epitaxial semiconductor features merge with each other.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: Ming-Chang Wen, Chang-Yun Chang, Hsien-Chin Lin, Hung-Kai Chen
  • Patent number: 10707260
    Abstract: A circuit that includes: a photodiode configured to absorb photons and to generate photo-carriers from the absorbed photons; a first MOSFET transistor that includes: a first channel terminal coupled to a first terminal of the photodiode and configured to collect a portion of the photo-carriers generated by the photodiode; a second channel terminal; and a gate terminal coupled to a first control voltage source; a first readout circuit configured to output a first readout voltage; a second readout circuit configured to output a second readout voltage; and a current-steering circuit configured to steer the photo-carriers generated by the photodiode to one or both of the first readout circuit and the second readout circuit.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: July 7, 2020
    Assignee: Artilux, Inc.
    Inventors: Yun-Chung Na, Szu-Lin Cheng, Shu-Lu Chen, Han-Din Liu, Hui-Wen Chen, Che-Fu Liang, Yuan-Fu Lyu, Chien-Lung Chen, Chung-Chih Lin, Kuan-Chen Chu
  • Publication number: 20200208188
    Abstract: The invention relates to a plasmid, a DNA assembly method and its application recombinant strain. The plasmid has single adjacent Type IIP and Type IIS RE recognition sites. The plasmid combines the properties of Type IIP and Type IIS REs to achieve recursive cycling, SCAR-free and repeat sequence assembly.
    Type: Application
    Filed: December 23, 2019
    Publication date: July 2, 2020
    Inventors: Shuwen LIU, Tingyi WEN, Yun ZHANG, Aihua DENG