Patents by Inventor Yun-Yeu Yeh
Yun-Yeu Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170363367Abstract: A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.Type: ApplicationFiled: August 19, 2016Publication date: December 21, 2017Inventors: Yun-Yeu YEH, Chuan-Chi TSENG, Ming-Quan CUI
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Publication number: 20170350657Abstract: A heat spreader with a liquid-vapor separation structure includes a first panel, a second panel bonded with the first panel and defining therebetween an enclosed accommodation chamber, multiple spacer members arranged spaced apart from one another in the accommodation chamber and abutted between the first panel and the second panel and defining multiple vapor passages and liquid passages therebetween and dividing the accommodation chamber into a heat-absorbing zone and a condensing zone that are disposed in communication with each other through the vapor passages and the liquid passages, a first wick material partially disposed in the liquid passages and partially disposed in the heat-absorbing zone and the condensing zone, and a working fluid filled in the accommodation chamber.Type: ApplicationFiled: August 2, 2016Publication date: December 7, 2017Inventors: Yun-Yeu YEH, Chuan-Chi TSENG, Ming-Quan CUI
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Patent number: 9593887Abstract: A heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers is disclosed to include a radiation fin set, a heat-dissipation spacer placed on the radiation fin set and defining opposing first surface and second surface, a first heat dissipation layer including multiple first heat pipes with respective first segments thereof placed on the first surface of the heat-dissipation spacer, and a second heat dissipation layer including multiple second heat pipes with respective first segments thereof placed on the second surface of the heat-dissipation spacer. At least a part of the first segment of at least one first heat pipe of the first heat dissipation layer is disposed overlapped on at least a part of the first segment of at least one second heat pipe of the second heat dissipation layer in a parallel manner.Type: GrantFiled: May 29, 2015Date of Patent: March 14, 2017Assignee: TAI-SOL ELECTRONICS CO., LTDInventors: Yun-Yeu Yeh, Sheng-Chin Chan
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Publication number: 20170034952Abstract: A fixture device includes an elongated body having at least two guide portions at two end sections thereof and a thread-coupling portion at a central section thereof, at least two latch members movably inserted through the guide portions to enable the guide portions move along axes of the latch members when the elongated body receives an external force, and an actuation bolt screwingly threaded through the thread-coupling portion and having an abutting part at a bottom thereof. Each latch member has a stop part to prevent the guide portions from upwardly escaping from the tops of the latch members. When being installed in a heat-dissipating module, the fixture device is combined with a heat-dissipating device which includes a bottom board and an integrated body formed by a plurality of fins, and the actuation bolt is inserted through a through hole passed through the center of the integrated body.Type: ApplicationFiled: November 4, 2015Publication date: February 2, 2017Inventors: Yun-Yeu YEH, Chun-Huang CHOU, Chien-Tung WANG
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Publication number: 20160298909Abstract: A heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers is disclosed to include a radiation fin set, a heat-dissipation spacer placed on the radiation fin set and defining opposing first surface and second surface, a first heat dissipation layer including multiple first heat pipes with respective first segments thereof placed on the first surface of the heat-dissipation spacer, and a second heat dissipation layer including multiple second heat pipes with respective first segments thereof placed on the second surface of the heat-dissipation spacer. At least a part of the first segment of at least one first heat pipe of the first heat dissipation layer is disposed overlapped on at least a part of the first segment of at least one second heat pipe of the second heat dissipation layer in a parallel manner.Type: ApplicationFiled: May 29, 2015Publication date: October 13, 2016Inventors: Yun-Yeu YEH, Sheng-Chin CHAN
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Publication number: 20160262289Abstract: A heat spreader-based heat sink module includes a heat spreader; a radiation fin set consisting of middle radiation fins on the middle and lateral radiation fins at two opposite lateral sides, the lateral radiation fins having end edges thereof defining with the middle radiation fins multiple installation spaces, the installation spaces being disposed at the two opposite lateral sides of the radiation fin set, each middle radiation fin defining a bearing portion between one respective pair of installation spaces; one or multiple retaining frames each including a holding-down segment located on the middle and pressed on one respective bearing portion of each middle radiation fin and two mounting segments respectively extended from two opposite ends of the holding-down segment and respectively positioned in one respective installation space; and multiple screw respectively mounted in the mounting segments of the one or multiple retaining frames.Type: ApplicationFiled: April 28, 2015Publication date: September 8, 2016Inventors: Yun-Yeu YEH, Chun-Huang CHOU, Chih-Wei CHEN
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Publication number: 20160219755Abstract: A thermoelectric-cooling-chip-based heat-dissipating system includes a partition board; a thermoelectric cooling chip having a hot side and a cold side located at two opposite sides of the partition board; a cool-air zone containing an air passage, a first fan, and a first heatsink set, wherein the first heatsink set is deposited on the cold side of the thermoelectric cooling chip, and the first fan and the first heatsink set are located in the air passage, so that the first fan blows air around the first heatsink set to move along the air passage; and a heat-dissipating zone containing a second fan and a second heatsink set, wherein the second fan blows air toward the second heatsink set, and the second heatsink set is deposited on the hot side of the thermoelectric cooling chip; wherein, the cool-air zone and the heat-dissipating zone are isolated from each other.Type: ApplicationFiled: June 2, 2015Publication date: July 28, 2016Inventors: Yaw-Huey LAI, Yun-Yeu YEH, Sheng-Chin CHAN
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Publication number: 20160209121Abstract: A heat-dissipating structure includes a heat-dissipating partition, a first heat-dissipating layer, and a second heat-dissipating layer. The heat-dissipating partition a first surface and a second surface that are opposite to each other. The first heat-dissipating layer includes a plurality of first heat pipes, each of which is disposed on the first surface of the heat-dissipating partition. The second heat-dissipating layer includes a plurality of second heat pipes, each of which is disposed on the second surface of the heat-dissipating partition. Each of the first heat pipes of the first heat-dissipating layer has at least one part overlapping at least one part of one of the second heat pipe of the second heat-dissipating layer. Thereby, heat from a to-be-cooled article can be quickly dissipated through the first heat-dissipating layer, the heat-dissipating partition, and the second heat-dissipating layer.Type: ApplicationFiled: March 13, 2015Publication date: July 21, 2016Inventors: Yun-Yeu YEH, Sheng-Chin CHAN
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Patent number: 7192254Abstract: The present invention is a radial fan having an axial fan blade configuration. The present invention comprises a hub; a first set of blades around the hub; and a second set of blades on the extending part. Therein, the hub comprises a hollow at the center, an axle, a guiding part and an extending part. The gaps are each between every two adjacent blades of the second blade set, having the same distance between every two adjacent gaps. The second set of blades comprises a plurality of blades around outside of the first set of blade and a ring connected with the blades. Accordingly, the structure of the blades may increase the wind pressure, reduce the energy loss by the blade rotation and raise the work efficiency of the blades while the noise is lessened and the working current is lowered.Type: GrantFiled: August 11, 2004Date of Patent: March 20, 2007Assignee: Datech Technology Co., Ltd.Inventors: Nien-Lun Li, Chih-Wen Tang, Yun-Yeu Yeh, Fu-Yin Wang
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Patent number: 7180740Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.Type: GrantFiled: September 30, 2004Date of Patent: February 20, 2007Assignee: Datech Technology Co., Ltd.Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee
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Publication number: 20060102325Abstract: The present invention is a guiding fin heat sink, where a heat-dissipation unit is stuck on a CPU by a base and the unit has guiding channels passing through two ends; heat pipes are located between the base and the unit at one end, the other end is made penetrating through the guiding channels, and one end surface of the guiding channels is corresponding to an opening on a side wall of a computer case; and, after the heat of the CPU is absorbed by the base, it is directed to the heat-dissipation unit and the heat pipes and is carried to the outside of the computer case by an air flow made a fan between the case and the unit, so that no heat re-cycling is in the case and better heat dissipation efficiency is obtained.Type: ApplicationFiled: November 17, 2004Publication date: May 18, 2006Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee
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Publication number: 20060067050Abstract: The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.Type: ApplicationFiled: September 30, 2004Publication date: March 30, 2006Inventors: Nien-Lun Li, Yun-Yeu Yeh, To Hsu, Hung-Chung Chu, Cheng-Hsing Lee
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Publication number: 20060034694Abstract: The present invention is a radial fan having an axial fan blade configuration. The present invention comprises a hub; a first set of blades around the hub; and a second set of blades on the extending part. Therein, the hub comprises a hollow at the center, an axle, a guiding part and an extending part. The gaps are each between every two adjacent blades of the second blade set, having the same distance between every two adjacent gaps. The second set of blades comprises a plurality of blades around outside of the first set of blade and a ring connected with the blades. Accordingly, the structure of the blades may increase the wind pressure, reduce the energy loss by the blade rotation and raise the work efficiency of the blades while the noise is lessened and the working current is lowered.Type: ApplicationFiled: August 11, 2004Publication date: February 16, 2006Inventors: Nien-Lun Li, Chih-Wen Tang, Yun-Yeu Yeh, Fu-Yin Wang
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Publication number: 20050254957Abstract: The present invention relates to a fan hub with a rocket shaped end. The fan hub comprises a hub body with a depressed ditch rounding at a proper position and a guiding section extended from the depressed ditch, and a plurality of fan blades on the outer surface of the hub body. The guiding section gradually narrows to an end and the tip at the end is in a curved shape. Accordingly, when the fan blades rotate, undesirable noise and working current can be reduced; and, simultaneously, the present invention can effectively guide the air flow, decrease the wastage of power, and improve the working efficiency of the fan.Type: ApplicationFiled: May 14, 2004Publication date: November 17, 2005Inventors: Nien-Lun Li, Yun-Yeu Yeh
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Patent number: D512499Type: GrantFiled: August 28, 2003Date of Patent: December 6, 2005Assignee: Datech Technology Co., Ltd.Inventors: Nien-Lun Li, Yun-Yeu Yeh, Hzen-Hsing Lee, Yi-Peng Hung
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Patent number: D513799Type: GrantFiled: March 29, 2004Date of Patent: January 24, 2006Assignee: Datech Technology Co., Ltd.Inventors: Nien-Lun Li, Yun-Yeu Yeh
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Patent number: D530809Type: GrantFiled: May 19, 2004Date of Patent: October 24, 2006Assignee: Datech Technology Co., Ltd.Inventors: Nien-Lun Li, Yun-Yeu Yeh