Abstract: A fabric care article made of solid or semi-solid matrix of materials for repetitive or multiple use in a machine drying apparatus such as a tumble dryer. The matrix includes a structuring agent comprising a filler structuring agent and a polymeric structuring agent. The filler structuring agent comprises about 0.2 % to about 10% and the polymeric structuring agent comprises about 0.5 to about 20% by weight of the composition. The matrix further includes up to about 25% of an anionic soap surfactant, about 10% to about 60% of free fatty acid, and about 1% to about 50% of a non-ionic, but is substantially free from cationic surfactant. When the fabric care article is used up, it simply disappears, indicating to a user that the article needs to be replenished.

Abstract: A fabric care article made of solid or semi-solid matrix of materials for repetitive or multiple use in a machine drying apparatus such as a tumble dryer. The matrix includes a structuring agent comprising a filler structuring agent and a polymeric structuring agent. The filler structuring agent comprises about 0.2% to about 10% and the polymeric structuring agent comprises about 0.5 to about 20% by weight of the composition. The matrix further includes up to about 25% of an anionic soap surfactant, about 10% to about 60% of free fatty acid, and about 1% to about 50% of a non-ionic, but is substantially free from cationic surfactant. When the fabric care article is used up, it simply disappears, indicating to a user that the article needs to be replenished.

Abstract: An aqueous fabric softening composition suitable for use in a wash and/or rinse cycle of automatic laundry machine, the composition comprising: (a) from about 0.5% to about 4%, by weight of the composition, of a synthetic anionic surfactant; (b) a fatty acid soap, wherein the weight ratio of the synthetic anionic surfactant to the fatty acid soap is below about 1; (c) from about 0.05% to about 2%, by weight of the composition, of a cationic quaternary cellulose ether polymer.

Abstract: A shear-thinning lamellar gel detergent composition containing suspended particles, employing a non-neutralized fatty acid as a structuring agent, in a specific amount, depending on the total surfactant level. The weight % ratio of non-neutralized fatty acid to the total surfactant within a specific range, defined by the Gelling Index equation, results in gels with the desired properties. The inventive product offers an advantage of laundry pre-treater and a detergent in a single product and also provides a visual cue of suspended particles.

Abstract: A process of making a liquid laundry detergent composition comprising a polyanionic ammonium surfactant, the process comprising: forming the polyanionic ammonium surfactant by mixing a liquid carrier with: (a1) from about 0.03% to about 85%, by weight of the composition, of a conjugate acid of an anionic surfactant; and (a2) from about 10% to about 50%, based on the molar equivalent of the amount of the conjugate acid, of a polyamine; (a3) wherein the mixing of (a1) and (a2) is carried out in the substantial absence of bases other than the polyamine. Also included is a process wherein the monoanionic surfactant is formed along with the polyanionic ammonium surfactant, in which case a base other than the polyamine may be present but than the amount of such base should be no greater than the required stoichiometric amount of the base to form the monoanionic surfactant.

Abstract: A liquid laundry detergent composition comprising: (a) from about 0.1% to about 80%, by weight of the composition, of a polyanionic ammonium surfactant; (b) a liquid carrier; (c) wherein the composition is substantially free of bases having pKa equal to or greater than 10, other than nitrogen-based bases.

Abstract: A method for controlling and/or calibrating rapid thermal process systems is described. One or more wafers comprising a silicon semiconductor substrate having a refractory metal layer thereon are silicided in a RTP system at different temperatures. Sheet resistance uniformity of the wafer is measured thereby detecting silicidation phase transition temperature points at the highest uniformity points. The temperature points are used to calibrate or to reset the RTP system. A plurality of wafers comprising a silicon semiconductor substrate having a refractory metal layer thereon can be silicided in each of a plurality of rapid thermal process systems. Sheet resistance uniformity of each of the wafers is measured thereby detecting silicidation phase transition temperature points by highest sheet resistance uniformity for each of the RTP systems. The temperature points are used to match temperatures for each of the RTP systems.

Abstract: A method for controlling and/or calibrating rapid thermal process systems is described. One or more wafers comprising a silicon semiconductor substrate having a refractory metal layer thereon are silicided in a RTP system at different temperatures. Sheet resistance uniformity of the wafer is measured thereby detecting silicidation phase transition temperature points at the highest uniformity points. The temperature points are used to calibrate or to reset the RTP system. A plurality of wafers comprising a silicon semiconductor substrate having a refractory metal layer thereon can be silicided in each of a plurality of rapid thermal process systems. Sheet resistance uniformity of each of the wafers is measured thereby detecting silicidation phase transition temperature points by highest sheet resistance uniformity for each of the RTP systems. The temperature points are used to match temperatures for each of the RTP systems.

Abstract: An integrated circuit redistribution structure. The integrated circuit redistribution structure includes a plurality of conductive pads located on an active side of an integrated circuit. The integrated circuit redistribution structure includes a redistribution layer and an under bump material structure for receiving a solder bump. The redistribution layer can include a first mechanically protective layer which adheres to the active side of the integrated circuit. The redistribution layer includes a plurality of conductive lines in which at least one of the conductive lines is connected to at least one conductive pad. Each conductive line includes an adhesion and diffusion barrier layer, an electrical conductor layer, and a first metallic protective layer. The under bump material structure is formed over at least one conductive line.