Abstract: Some embodiments include an integrated assembly having a carrier-sink-structure, and having digit lines over the carrier-sink-structure. Transistor body regions are over the digit lines. Extensions extend from the carrier-sink-structure to the transistor body regions. The extensions are configured to drain excess carriers from the transistor body regions. Lower source/drain regions are between the transistor body regions and the digit lines, and are coupled with the digit lines. Upper source/drain regions are over the transistor body regions, and are coupled with storage elements. Gates are adjacent the transistor body regions. The transistor body regions, lower source/drain regions and upper source/drain regions are together comprised a plurality of transistors. The transistors and the storage elements are together comprised by a plurality of memory cells of a memory array. Some embodiments include methods of forming integrated assemblies.

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a first memory cell and a second memory cell, each of the first and second memory cells including a first transistor including a first region and a first charge storage structure separated from the first region; a second transistor including a second region formed over the first charge storage structure; a first data line coupled to the first memory cell configured to provide a first sum based on current on the first data line during a memory operation; a second data line coupled to the second memory cell configured to provide a second sum based on current on the second data line during the memory operation; and an output circuit to provide output information based on values of the first and second sums.

Abstract: A trench-gate source-follower (TGSF) transistor is described, such as for integration with image sensor pixels. The TGSF transistor is at least partially built into a trench etched into a substrate. A contiguous doped region is implanted around the inner walls of the trench to form a buried-trench current channel. A trench-gate is formed to have at least a buried portion that fills the volume of the trench. A gate oxide layer can be disposed between the buried portion of the trench-gate and the buried-trench current channel. Drain and source regions are formed on either end of the trench-gate. Activating the trench-gate causes current to flow between the drain and source regions via the buried-trench current channel around the buried portion of the trench-gate. The geometry of the buried-trench current channel can effectively increase the width of the active region of the source-follower transistor without increasing its physical layout width.

Abstract: A saddle-gate source follower transistor is described, such as for integration with in-pixel circuitry of complementary metal-oxide semiconductor (CMOS) image sensor (CIS) pixels. The saddle-gate source-follower transistor structure can include a channel region having a three-dimensional geometry defined on its axial sides by trenches. A gate oxide layer is formed over the top and axial sides of the channel region, and a saddle-gate structure is formed on the gate oxide layer. As such, the saddle-gate structure includes a seat portion extending over the top of the channel region, and first and second fender portions extending over the first and second axial sides of the channel region, such that the first and second fender portions are buried below an upper surface of the semiconductor substrate (e.g., buried into trenches formed in side isolation regions).

Abstract: Some embodiments include an integrated assembly having a carrier-sink-structure, and having digit lines over the carrier-sink-structure. Transistor body regions are over the digit lines. Extensions extend from the carrier-sink-structure to the transistor body regions. The extensions are configured to drain excess carriers from the transistor body regions. Lower source/drain regions are between the transistor body regions and the digit lines, and are coupled with the digit lines. Upper source/drain regions are over the transistor body regions, and are coupled with storage elements. Gates are adjacent the transistor body regions. The transistor body regions, lower source/drain regions and upper source/drain regions are together comprised a plurality of transistors. The transistors and the storage elements are together comprised by a plurality of memory cells of a memory array. Some embodiments include methods of forming integrated assemblies.

Abstract: A riding mowing device includes a seat used for a user to sit on and including a seat cushion and a backrest; a frame for supporting the seat; a cutting assembly including a cutting deck and a mowing element for mowing grass, where the mowing element is at least partially accommodated in the cutting deck, and the cutting assembly is mounted to the frame; a traveling assembly for driving the riding mowing device to travel; a control circuit board for controlling at least the cutting assembly and the traveling assembly; and a power supply assembly for supplying power to at least the cutting assembly and the traveling assembly. At least part of the control circuit board is disposed between the seat and the power supply assembly.

Abstract: An apparatus includes at least one vertical transistor having a channel region. The channel region includes an upper region having a first width and a lower region below the upper region and having a second width smaller than the first width. The upper region defines at least one overhang portion extending laterally beyond the lower region. The at least one vertical transistor further includes gate electrodes at least partially vertically beneath the at least one overhang portion of the upper region of the channel region. Additional apparatuses and related systems and methods are also disclosed.

Abstract: Some embodiments include an integrated assembly having a carrier-sink-structure, and having digit lines over the carrier-sink-structure. Transistor body regions are over the digit lines. Extensions extend from the carrier-sink-structure to the transistor body regions. The extensions are configured to drain excess carriers from the transistor body regions. Lower source/drain regions are between the transistor body regions and the digit lines, and are coupled with the digit lines. Upper source/drain regions are over the transistor body regions, and are coupled with storage elements. Gates are adjacent the transistor body regions. The transistor body regions, lower source/drain regions and upper source/drain regions are together comprised a plurality of transistors. The transistors and the storage elements are together comprised by a plurality of memory cells of a memory array. Some embodiments include methods of forming integrated assemblies.

Abstract: A battery pack for powering an outdoor moving includes: a housing mounted to the outdoor moving device and supported by the outdoor moving device; and a cell module mounted to the housing and including multiple cells. A cell is cylindrical and the diameter of the cell is greater than or equal to 3 cm.

Abstract: Redox catalysts having surface medication, methods of making redox catalysts with surface modification, and uses of the surface modified redox catalysts are provided. In some aspects, the redox catalysts include a core oxygen carrier region such as CaMnO3, BaMnO3-?, SrMnO3-?, Mn2SiO4, Mn2MgO4-?, La0.8Sr0.2O3-?, La0.8Sr0.2FeO3-?, Ca9Ti0.1Mn0.9O3-?, Pr6O11-?, manganese ore, or a combination thereof; and an outer shell having an average thickness of about 1-100 monolayers surrounding the outer surface of the core region. The outer shell can include, for example a salt selected such as Li2WO4, Na2WO4, K2WO4, SrWO4, Li2MoO4, Na2MoO4, K2MoO4, CsMoO4, Li2CO3, Na2CO3, K2CO3, or a combination thereof.

Abstract: Techniques are described for implementing a square-gate source-follower (SGSF) transistor for integration with complementary metal-oxide semiconductor (CMOS) image sensor (CIS) pixels. The SGSF transistor can have an active layer with active regions, including a drain region separated from each of two source regions to form parallel current channels. A square-gate structure layer includes main-gate regions, each disposed above a corresponding one of the current channels, and a side-gate region to couple the main-gate regions. At a particular physical width (W) and current channel length (L), the parallel current channels can act similarly to a conventional linear source-follower having dimensions of 2W and the same L. SGSF implementations can provide a number of features, including higher frame rate, lower power consumption, and lower noise, as compared to those of a conventional source-follower transistor of comparable W and L dimensions.

Abstract: Redox catalysts having surface medication, methods of making redox catalysts with surface modification, and uses of the surface modified redox catalysts are provided. In some aspects, the redox catalysts include a core oxygen carrier region such as CaMnO3, BaMnO3??, SrMnO3??, Mn2SiO4, Mn2MgO4??, La0.8Sr0.2O3??, La0.8Sr0.2FeO3??, Ca9Ti0.1Mn0.9O3??, Pr6O11??, manganese ore, or a combination thereof; and an outer shell having an average thickness of about 1-100 monolayers surrounding the outer surface of the core region. The outer shell can include, for example a salt selected such as Li2WO4, Na2WO4, K2WO4, SrWO4, Li2MoO4, Na2MoO4, K2MoO4, CsMoO4, Li2CO3, Na2CO3, K2CO3, or a combination thereof.

Abstract: Disclosed is an apparatus for testing blood coagulation indicators, including a blood sample receiving and preprocessing unit, and the blood preprocessing part is configured to remove or neutralize the anticoagulation effect of the artificially added anticoagulant in the blood sample; a reacting unit in which the blood undergoes a clotting process; a blood coagulation indicator analyzing and computing unit which may measure an electrical signal passing through the blood sample during the course of testing to obtain measurement results reflecting a time measurement function; and a result displaying unit. Further disclosed is a method for testing coagulation indicators of a blood sample using the apparatus.

Abstract: In one aspect, the disclosure relates to an oxygen-deficient mixed metal perovskite having the formula SrxA1-xFeyB1-yO3-?, wherein A can be Ca, K, Y, Ba, La, Sm, or any combination thereof; wherein B can be Co, Cu, Mn, Mg, Ni, Ti, or any combination thereof; wherein x is from 0 to 1; wherein y is from 0 to 1; and wherein ? is from 0 to 0.7. Also disclosed are redox catalysts comprising the oxygen-deficient mixed metal perovskites and methods for chemical looping air separation, chemical looping CO2 splitting, and chemical looping alkane conversion using the disclosed catalysts.

Abstract: An imaging pixel design is provide with a photo-sensor block structure that facilitates dynamic control of well capacity in the photodiode region (i.e., a “well capacity adjustment (WCA) gate photo-sensor block”). The photodiode region includes a doped well in which photocharge is accumulated responsive to exposure to incident illumination. The capacity of the well corresponds to a well potential. WCA structures (e.g., deep trench regions) form walls at least partially surrounding and capacitively coupling with the doped well, such that biasing of the WCA structures changes the well potential and the corresponding well capacity. As such, the WCA structures can be biased during integration to increase the well potential to a high level for large well capacity, and the WCA structures can be differently biased during photocharge transfer to decrease the well potential to a sufficiently low level that avoids lag and/or other conventional concerns.

Abstract: A trench-gate source-follower (TGSF) transistor is described, such as for integration with image sensor pixels. The TGSF transistor is at least partially built into a trench etched into a substrate. A contiguous doped region is implanted around the inner walls of the trench to form a buried-trench current channel. A trench-gate is formed to have at least a buried portion that fills the volume of the trench. A gate oxide layer can be disposed between the buried portion of the trench-gate and the buried-trench current channel. Drain and source regions are formed on either end of the trench-gate. Activating the trench-gate causes current to flow between the drain and source regions via the buried-trench current channel around the buried portion of the trench-gate. The geometry of the buried-trench current channel can effectively increase the width of the active region of the source-follower transistor without increasing its physical layout width.

Abstract: A hybrid ferroelectric-metal-oxide-semiconductor field effect transistor (Fe-MOSFET) device is described, such as for incorporation into in-pixel circuitry of an imaging pixel array to provide both reset and dual conversion gain features. The Fe-MOSFET includes source and drain regions implanted in a semiconductor substrate and separated by a channel region. The source region can be the floating diffusion region of a photosensor. A gate structure is deposited on the substrate directly above at least the channel region and an isolating layer is formed on the surface of the substrate to electrically isolate the gate structure from at least the channel region. The isolating layer is split into a Fe segment of ferroelectric material that can be written to different polarization states for conversion gain control, and a dielectric segment that can be used for current channel formation in the channel region.

Abstract: Some embodiments include an integrated assembly having an array of vertically-extending active regions. Each of the active regions is contained within a four-sided area. Conductive gate material is configured as first conductive structures. Each of the first conductive structures extends along a row of the array. The first conductive structures include segments along three of the four sides of each of the four-sided areas. Second conductive structures are under the active regions and extend along columns of the array. Third conductive structures extend along the rows of the array and are adjacent the fourth sides of the four-sided areas. Storage-elements are coupled with the active regions. Some embodiments include methods of forming integrated assemblies.

Abstract: Some embodiments include an integrated assembly having digit lines which extend along a first direction, and which are spaced from one another by intervening regions. Each of the intervening regions has a first width along a cross-section. Pillars extend upwardly from the digit lines; and the pillars include transistor channel regions extending vertically between upper and lower source/drain regions. Storage elements are coupled with the upper source/drain regions. Wordlines extend along a second direction which crosses the first direction. The wordlines include gate regions adjacent the channel regions. Shield lines are within the intervening regions and extend along the first direction. The shield lines may be coupled with at least one reference voltage node. Some embodiments include methods of forming integrated assemblies.

Abstract: Techniques are described for implementing a split-select-block (split-SEL) complementary metal-oxide semiconductor (CMOS) image sensor (CIS) pixel physical architecture, such as for reducing noise in low-light application contexts. The split-SEL CIS pixel physical architecture can include a pixel block with one or more photodiodes. Above the photodiodes, there can be: a first oxide diffusion region with a reset block and a gain block disposed thereon; and a second oxide diffusion region with a select block disposed thereon. Below the photodiodes, there can be a third oxide diffusion region with a source follower (SF) block (e.g., a square-gate SF transistor) disposed thereon. A trace can be routed through the set of photodiodes to couple the source of the SF block with the select block. The architecture permits an appreciable increase in the physical gate length and/or other features.