Abstract: A method of monitoring reactivity changes in a nuclear reaction when the nuclear reaction is subcritical. The method controls the parameter of the nuclear reaction that affects reactivity of the reaction to slightly alter the reactivity while monitoring an output of a source range detector. The Inverse Count Rate Ratio from the output of the detector is determined periodically during a transient portion of the output. A correction factor is applied to the Inverse Count Rate Ratio data and the data is plotted as a function of time. The correction factor linearizes the Inverse Count Rate Ratio data so that the curve can be predictably extrapolated.

Abstract: In a valve assembly, a main frame unit has an inner space defined by opposite side walls connected respectively to lateral walls of adjacent chambers, front and rear walls connected between the side walls, and top and bottom walls disposed on opposing top and bottom ends of the front and rear walls. Each side wall is formed with an access hole for passage of a workpiece into and out of the inner space. The rear wall is formed with a through hole and is mounted detachably with a cover plate for closing the through hole. A valve unit is disposed in the inner space and is movable so as to close the access hole in one of the side walls. A drive unit has a rotary axle disposed rotatably in the inner space and coupled to the valve unit to control closing movement of the valve unit.

Abstract: This invention relates to a method for monitoring an executed process, more particularly for monitoring and tracing the execution of an application program on a window-based operating platform. The method of the present invention is first to collect the information of all executed processes, and then to build up a history table of all processes for finding out the main process of the execution of the application program. Next, according to the processes' handles saved in the history table, the monitoring method is to extract all sub-processes of the main process and construct the relation of all processes of the execution of the application program. Finally, hierarchically trace and monitor all executed processes of the application program.

Abstract: A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.

Abstract: A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.