Patents by Inventor Yung-Cheng Lee
Yung-Cheng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12188732Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. In some instances, the single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.Type: GrantFiled: January 2, 2024Date of Patent: January 7, 2025Assignee: The Regents of the University of ColoradoInventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
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Publication number: 20240369306Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: ApplicationFiled: May 17, 2024Publication date: November 7, 2024Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Patent number: 12104856Abstract: Some embodiments of the invention include a thermal ground plane with a variable thickness vapor core. For example, a thermal ground plan may include a first casing and a second casing where the second casing and the first casing configured to enclose a working fluid. The thermal ground plane may also include an evaporator region disposed at least partially on at least one of the first casing and the second casing; a condenser region disposed at least partially on at least one of the first casing and the second casing; and a wicking layer disposed between the first casing and the second casing a vapor core defined at least partially by a gap between the first casing and the second casing. The thickness of the gap can vary across the first casing and the second casing.Type: GrantFiled: October 18, 2017Date of Patent: October 1, 2024Assignees: Kelvin Thermal Technologies, Inc., THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATEInventors: Ryan John Lewis, Ronggui Yang, Yung-Cheng Lee
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Patent number: 11988453Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: GrantFiled: February 7, 2022Date of Patent: May 21, 2024Assignee: KELVIN THERMAL TECHNOLOGIES, INC.Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20240133643Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. In some instances, the single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
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Patent number: 11930621Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.Type: GrantFiled: June 18, 2021Date of Patent: March 12, 2024Assignee: Kelvin Thermal Technologies, Inc.Inventors: Ryan J. Lewis, Yung-Cheng Lee, Ali Nematollahisarvestani, Jason W. West, Kyle Wagner
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Patent number: 11898807Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.Type: GrantFiled: March 8, 2022Date of Patent: February 13, 2024Assignee: The Regents of the University of Colorado, a body corporateInventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
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Publication number: 20230332841Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.Type: ApplicationFiled: March 7, 2023Publication date: October 19, 2023Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20230292466Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.Type: ApplicationFiled: June 18, 2021Publication date: September 14, 2023Inventors: Ryan J. Lewis, Yung-Cheng Lee, Ali Nematollahisarvestani, Jason W. West, Kyle Wagner
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Patent number: 11598594Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.Type: GrantFiled: May 12, 2020Date of Patent: March 7, 2023Assignee: THE REGENTS OF THE UNIVERSITY OF COLORADOInventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
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Patent number: 11511377Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.Type: GrantFiled: August 22, 2019Date of Patent: November 29, 2022Assignee: Roccor, LLCInventors: Michael Hulse, William Francis, Yung Cheng Lee
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Publication number: 20220221233Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.Type: ApplicationFiled: March 8, 2022Publication date: July 14, 2022Inventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
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Patent number: 11353269Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.Type: GrantFiled: November 11, 2019Date of Patent: June 7, 2022Assignee: Kelvin Thermal Technologies, Inc.Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
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Publication number: 20220163268Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: ApplicationFiled: February 7, 2022Publication date: May 26, 2022Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20220155025Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.Type: ApplicationFiled: February 3, 2022Publication date: May 19, 2022Inventors: Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
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Patent number: 11306983Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.Type: GrantFiled: June 11, 2019Date of Patent: April 19, 2022Assignee: The Regents of the University of Colorado, a body corporateInventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
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Publication number: 20220074673Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Inventors: Ryan J. Lewis, Ronggui Yang, Yung-Cheng Lee
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Publication number: 20210400846Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.Type: ApplicationFiled: June 18, 2021Publication date: December 23, 2021Inventors: Ryan J. Lewis, Yung-Cheng Lee, Ali Nematollahisarvestani, Jason W. West, Kyle Wagner
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Publication number: 20210131753Abstract: This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.Type: ApplicationFiled: June 11, 2019Publication date: May 6, 2021Inventors: Ronggui Yang, Rongfu Wen, Shanshan Xu, Yung-Cheng Lee
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Publication number: 20200300563Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.Type: ApplicationFiled: May 12, 2020Publication date: September 24, 2020Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee