Abstract: Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less than 100 microns; a second layer having a thickness of less than 200 microns, wherein a portion of the first layer and a portion of the second layer are sealed together; and a vacuum chamber formed between the first layer and the second layer and within which the plurality of pillars are disposed.

Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Abstract: Some embodiments of the invention provide a heat plate system that includes a closed vessel having at least one flexible surface. The flexible surface allows the vessel to come into intimate contact with heat-generating components (e.g., integrated circuits) residing at varying heights above the floor of a module (e.g., an avionics module). In some embodiments, the material may allow the heat plate to expand in response to absorbing heat, so that it may mold itself around the contours of different heat-generating components, increasing the surface area contact between the heat plate and the components, and increasing the heat plate's ability to conduct heat away from the components.

Abstract: A micro-electromechanical device or MEMS having a conformal layer of material deposited by atomic layer deposition is discussed. The layer may provide physical protection to moving components of the device, may insulate electrical components of the device, may present a biocompatible surface interface to a biological system, and may otherwise improve such devices. The layer may also comprise a combination of multiple materials each deposited with great control to allow creating layers of customizable properties and to allow creating layers having multiple independent functions, such as providing physical protection from wear and providing electrical insulation.

Abstract: The invention illustrates a high-security encoding device for remote controller, comprising: a timer, which is used to provide a transmitting time; a mode selector, which is used to provide a mode select value; a controller, by which an identity, the transmitting time, and the mode select value are received to generate a control signal; a key; an encryptor, which receives the control signal and applies the key to encrypt the control signal into a ciphertext; and a radio-frequency (RF) modulator, which modulates and thereafter outputs the ciphertext.

Abstract: A Spatial Light Modulator (SLM) includes a Ferroelectric Liquid Crystal (FLC) layer that is contained in a thin gap or cavity between an upper cover glass and a lower Very Large Scale Integration (VLSI) Complementary Metal Oxide Semiconductor (CMOS) chip. The circuits on the VLSI/CMOS chip are wire connected to an underlying substrate member. A selected volume and vertical height of medium and small size solder joints between the VLSI chip and the substrate member produce self aligning of the VLSI chip with the underlying substrate member during solder reflow. These solder joints also produce an upward directed force that urges the VLSI chip in an upward direction away from the substrate member during solder reflow. A selected volume and vertical height of large size solder joints between the substrate member and the cover glass produce a downward directed force that urges the cover glass in a downward direction during solder reflow.

Abstract: Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits and a thermally conductive base member that is perforated with holes. Motivating means are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.