Abstract: A process for manufacturing a pixel array of top-emitting OLED pixel is provided. The process comprises: providing a substrate having at least two poly-silicon islands defined thereon, and defining an implantation region on the substrate; forming a gate insulator layer and a gate metal layer sequentially, and then defining a gate; carrying out an implantation process for forming the doped region; forming an inter-layer dielectric (ILD) layer and etching a plurality of contact holes thereon; forming a source/drain metal layer and defining a source/drain pattern thereon; wherein the patterned source/drain metal layer extends to the pixel array of the top-emitting OLED so as to be employed as a bottom electrode of the top-emitting OLED. The characteristic of the present invention is that the bottom electrode is substantially the portion of the source/drain extending to the pixel array of the top-emitting OLED, so that the array manufacturing can save at least two masks.

Abstract: The present invention discloses an apparatus of ion sensitive thin film transistor and method of manufacturing of the same. The apparatus of the invention, formed on a glass substrate, comprises an ion detector, formed on said glass substrate, including a plurality of ion sensitive transistors and a signal processor with display, also formed on said glass substrate, being coupled with said ion detector. The signal processor with display further comprises a circuit of signal processing, a driver circuit, and a display, wherein by means of the method of Low Temperature PolySilicon, i.e. LTPS technology, the invention integrates said ion detector and said signal processor with display on said glass substrate to become an tiny, light and thin apparatus with portable and disposable characteristics.

Abstract: An optical mouse has a housing, a printed circuit board, a light source unit, a photodetector unit, a light-guiding unit and a lens unit. The light source unit has different colors of image light sources and is disposed on the printed circuit board. The light-guiding unit is arranged in the housing and adjacent to the light source unit for guiding a non-complementary color light relative to a reflection surface from one of the image light sources to the reflection surface. The lens unit is arranged in the housing and positioned below the photodetector unit for converging a reflected light reflected by the reflection surface into the photodetector unit. Furthermore, the optical mouse can be operated on various colors of reflection surfaces, and still retains better sensitivity.

Abstract: A puzzle includes a base board on which set a number of cutouts, and the same number of puzzle pieces with shapes corresponding to the cutouts and images on both sides. With images on both sides of the puzzle pieces, the present invention provides two different jigsaw puzzles for assembly.

Abstract: The invention of a Low-Cost alternating color-pulse digital particle-image velocimetry DPIV (Digital Particle Image Velocimetry) system is proposed. In the proposed system Low-Cost basic equipments are used such as a continuous-wave laser in mixed mode, a CCD (Charge Couple Device) camera, a PMT (Photo-Multiplier Tube), an image-processing card, a PC (personal computer) etc., with an add-on alternating-color planar laser-sheet generating facility to achieve the purpose of DPIV (Digital Particle Image Velocimetry) of planar velocity measurements. With the add-on facility, the laser beam from the continuous-wave laser operated in mixed mode is turned into a planar laser sheet with alternating color at a designated frequency. The CCD (Charge Couple Device) camera captures the alternating-color images of the flow field seeded with small particles.

Abstract: A method of figuring an exposure energy. A required exposure energy is calculated according to a critical dimension (CD) of an exposing layer. A first CD deviation is obtained from a layer before the exposing layer. From the first CD deviation, a first energy compensation is calculated. Whether the deviation of photoresist sensitivity of two sequential batches is less than 1% is checked. If the deviation of photoresist sensitivity of two sequential batches is less than 1%, a sum of the required exposure energy and the first energy compensation is the exposure energy applied to the exposing layer. Otherwise, a second CD deviation is commutated according to the deviation of photoresist sensitivity of two sequential batches. A second energy compensation is then obtained from the second CD deviation, and a sum of the required exposure energy and the first/second energy compensation is the exposure energy applied to the exposing layer.

Abstract: A method of figuring an exposure energy. A required exposure energy is calculated according to a critical dimension (CD) of an exposing layer. A first CD deviation is obtained from a layer before the exposing layer. From the first CD deviation, a first energy compensation is calculated. Whether the deviation of photoresist sensitivity of two sequential batches is less than 1% is checked. If the deviation of photoresist sensitivity of two sequential batches is less than 1%, a sum of the required exposure energy and the first energy compensation is the exposure energy applied to the exposing layer. Otherwise, a second CD deviation is commutated according to the deviation of photoresist sensitivity of two sequential batches. A second energy compensation is then obtained from the second CD deviation, and a sum of the required exposure energy and the first/second energy compensation is the exposure energy applied to the exposing layer.

Abstract: A method for preventing gate washout in process of plastic injection molding includes a step 1 of preparing a film connected to a concavity surface in a first mold and patterns printed on a top surface of the film; a step 2 of inserting a block slidably received in a passage in a second mold and located beside a pouring gate between the first mold and the second mold; a step 3 of injecting plastic material in the concavity via the pouring gate; a step 4 of moving the block toward the first mold before the plastic material in the concavity is solidified; and a step 5 of removing the second mold from the first mold.

Abstract: The invention of a Low-Cost alternating color-pulse digital particle-image velocimetry DPIV (Digital Particle Image Velocimetry) system is proposed. In the proposed system Low-Cost basic equipments are used such as a continuous-wave laser in mixed mode, a CCD (Charge Couple Device) camera, a PMT (Photo-Multiplier Tube), an image-processing card, a PC (personal computer) etc., with an add-on alternating-color planar laser-sheet generating facility to achieve the purpose of DPIV (Digital Particle Image Velocimetry) of planar velocity measurements. With the add-on facility, the laser beam from the continuous-wave laser operated in mixed mode is turned into a planar laser sheet with alternating color at a designated frequency. The CCD (Charge Couple Device) camera captures the alternating-color images of the flowfield seeded with small particles. The images are then sent to a personal computer for analysis of the magnitude and direction of the velocity distribution of the flowfield.

Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.

Abstract: A manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same. The method utilizes semiconductor manufacturing technologies to configure various elements in a thermal bubble inkjet print head, such as ink channels, an ink slot, an energy transducer, an orifice plate, on a single substrate. The ink channels are formed on an top surface of the substrate using the anisotropic etching technique. The ink slot is formed on a back surface of the substrate using the anisotropic etching technique. The energy transducer and the orifice plate are formed in order above the ink channels using the coating and etching techniques. This thermal bubble inkjet print head manufacturing method is particularly useful in the all batch process without employing the steps of precision alignment joint for the orifice plate in a conventional inkjet print head. Therefore, the method can greatly increase production efficiency and lower production costs.

Abstract: A monolithic ink-jet print head and a method of fabricating the same are proposed, which not only can allow the nozzle device to be highly secured to the ink-jet print head, but also can allow the overall manufacturing process for the ink-jet print head to be more simplified and thus more cost-effective to implement as compared to the prior art. The monolithic ink-jet print head is constructed on a print-control chip formed with an array of transducers. A plurality of ink barrier layers are then formed from a first polymer over the print-control chip for separating the transducers from each other; and subsequently, a nozzle device is formed from a second polymer over the ink barrier layer. The second polymer is substantially equal or at least close in thermal expansion coefficient to the first polymer used to form the ink barrier layer.

Abstract: An object of the invention is to provide a preventive maintenance for effectively removing polymer stacked on a lower electrode within a reaction chamber of etching equipment during the process of dry etching of a silicon oxide layer. First, the lower electrode is preferably set at 0° C., and then the reaction chamber is pre-cleaned preferably 20 times by a pump/purge cleaning manner. After the pre-cleaning, nitrogen or inert gas is supplied into the reaction chamber such that the internal pressure is equal to atmospheric pressure. Subsequently, the reaction chamber is opened preferably for 10 minutes, and the lower electrode is kept at 0° C. during this moment. Afterwards, the surface of the lower electrode is wiped by a piece of clean cloth to peel off the polymer. Finally, the lower electrode is preferably set at 25° C. and is wiped several times by using de-ionized water, isopropanol (IPA), ethanol, a solution of hydrogen peroxide in water, or Cleaner 5060 produced by the 3M corporation.

Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.