Patents by Inventor Yung Wu

Yung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020048943
    Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.
    Type: Application
    Filed: August 3, 1998
    Publication date: April 25, 2002
    Inventors: CHIEH-WEN WANG, MING-LING LEE, YUAN-LIANG LAN, YI-YUNG WU, HUI-FANG WANG
  • Publication number: 20020020921
    Abstract: A method of manufacturing a printhead chip comprising the steps of first forming a resistive layer and a conductive layer over a substrate, wherein the resistive layer and the conductive layer act as a heater and a conductive line respectively. Thereafter, at least one insulating layer is deposited over the conductive layer and the resistive layer. Next, at least one metallic layer is deposited over the insulating layer without performing any intermediate photolithographic or etching operations, and then the metallic layer is patterned to form a contact opening. The contact opening passes through the metallic layer and the insulating layer while exposing a portion of the conductive layer. Subsequently, a metal plug is formed in the contact opening so that the metallic layer and the conductive layer are connected, thereby forming an electric circuit. Finally, a thick film is formed over the metallic layer acting as an ink channel for the printhead.
    Type: Application
    Filed: April 19, 2001
    Publication date: February 21, 2002
    Inventors: Chieh-Wen Wang, Ming-Ling Lee, Yuan-Liang Lan, Yi-Yung Wu, Hui-Fang Wang
  • Publication number: 20010048452
    Abstract: A method for fabricating a high-density ink-jet print head that utilizes a common high-density nozzle plate as a base for aligning a multiple of ink-jet printing modules. The high-density nozzle plate has wide body, high-density, high-resolution nozzles. The nozzle plate is fabricated using conventional electrochemical machining or laser machining techniques. The nozzle plate is able to provide not only a base for aligning each ink-jet printing module, but also the alignment necessary for the whole group of the ink-jet printing modules so that all modules are aligned properly. Therefore, the alignment operation can be carried out without the need for sophisticated alignment equipment and the alignment accuracy is high.
    Type: Application
    Filed: April 13, 1998
    Publication date: December 6, 2001
    Inventors: YUAN-LIANG LAN, YI-YUNG WU, CHIEH-WEN WANG, MING-LING LEE, YI-HSUAN LAI
  • Patent number: 6315542
    Abstract: Disclosed is a gas injection mold structure for use in the field of gas auxiliary injection molding, comprising a male mold and a gas injection device. The gas injection device includes a head and a cylindrical body extending from the head. The male mold is formed with a cylindrical cell. The cylindrical body has an outer periphery and the cylindrical cell has an inner wall being formed with matching outer and internal threads, respectively, such that the gas injection device is removably threaded into and affixed to the cylindrical cell by means of the cylindrical body. The cylindrical body is formed with a plurality of vertical grooves along an entire length of sides thereof.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: November 13, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Yung-Chih Chen, Wen-Liang Liu, Cheng-Lung Cheng, Chin-Yung Wu, Shian-Yih Wang
  • Patent number: 6299788
    Abstract: A method for polysilicon etching with HBr, He and He/O2 as reactive gas source is disclosed. A chamber pressure greater than 30 mTorr is held to achieve high selectivity to polysilicon over silicon oxide. A total flow rate of HBr and He greater than 420 sccm is provided. Under this condition of the total flow rate of HBr and He, the flow rates of HBr and He are respectively held in the range of about 180-280 sccm, and the flow rate of He/O2 is at about 5-10 sccm.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: October 9, 2001
    Assignee: Mosel Vitelic Inc.
    Inventors: Kuang-Yung Wu, Tien-Min Yuan, Shih-Chi Lai
  • Patent number: 6280021
    Abstract: A structure of ink slots on an ink-jet printhead chip. The structure includes a plurality of firing chambers and a plurality of ink reservoirs. Each of the firing chambers has a heater and is enclosed by a plurality of walls, so each of the firing chambers is isolated. The ink reservoirs are respectively connected to the firing chambers by ink slots and each of the ink reservoirs is also isolated. Additionally, distances of the ink slots are equal.
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: August 28, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Yung Wu, Je-Ping Hu, Yi-Hsuan Lai, Yuh-Horng Chuang, Chieh-Wen Wang
  • Patent number: 6273962
    Abstract: A method for preventing corrosion and particulate in a load-lock chamber is disclosed. The load-lock chamber is adjourning with an etching chamber and a wafer transferred module, each time a wafer in the cassette is transferred into the etching chamber for etching by a transfer arm. After that, the etched wafer is withdrawn by the same way to the cassette. The load-lock chamber comprising an outlet of N2-purge tube therein for venting the vacuum in the load-lock chamber to the surrounding. The method comprising at least a step of coupling heating means to the N2-purge tube, or heating N2 gases before injecting into the N2-purge tube so that the temperature of the N2-purge tube will at least not lower than the temperature of an environment within the load-lock chamber.
    Type: Grant
    Filed: April 6, 1999
    Date of Patent: August 14, 2001
    Assignee: Mosel Vitelic Inc.
    Inventors: Kuang-Yung Wu, Jia-Rurng Hwu, Tien-Min Yuan, Shih-Chi Lai
  • Patent number: 6209993
    Abstract: A method for fabricating a printhead chip. A silicon substrate having a first surface and a second surface is provided. A plurality of grooves is formed in the first surface by an etching process. A plurality of ink slots are formed in each of the grooves. Overflow grooves are formed in the first surface beside the grooves. A plurality of firing chambers is formed on the second surface. Each of the firing chambers is respectively connected to each of the ink slots.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: April 3, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Chieh-Wen Wang, Yi-Yung Wu, Hung-Lieh Hu, Ming-Ling Lee
  • Patent number: 6187613
    Abstract: The present invention provides a process for underfill encapsulating a flip chip which is driven by pressure. First, a metal foil is placed on a flip chip that has been connected to a substrate. Then, a downward pressure is applied to the metal foil so as to form a space among the metal foil, the flip chip, and the substrate. Then, an encapsulant is filled into the space under pressure. The chip on which the metal foil has been placed and that has been encapsulated is moved away. Then, another metal foil is placed on another flip chip that has been connected to the substrate to undergo the above-mentioned encapsulation process. Encapsulation of the next chip can begin without waiting the encapsulant packaging the prior chip to cure. Thus, the efficiency of the encapsulating machine can be greatly enhanced, and the conventional problems of encapsulant adhering to the mold can also be solved.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: February 13, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Chin-Yung Wu, Tay-Yuan Chen
  • Patent number: 6140909
    Abstract: A heat-generating resistor comprised essentially of Ru and Ta at the following composition ratios:22 atom percent .ltoreq.Ru.ltoreq.66 atom percent and34 atom percent .ltoreq.Ta.ltoreq.78 atom percent,and an ink jet head which includes said heat-generating resistor are provided.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: October 31, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Yung Wu, Dong-Sing Wuu, Chia-Chi Chan, Ray-Hua Horng
  • Patent number: 6126260
    Abstract: A method of prolonging the lifetime of a thermal-bubble-ink-jet print head. A first pulse is provided to a heater of the print head for generating a first bubble to expel an ink drop. A second pulse is provided to the heater after a delay time for generating a second bubble is generated. The second pulse is not large enough to expel another ink drop.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: October 3, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Liang Lan, Ming-Ling Lee, Yi-Yung Wu, Chu-Wen Chen, Ten-Hsing Jaw
  • Patent number: 6113736
    Abstract: A gas ring with curved surface on the edge of the gas-guiding trench of a gas ring apparatus is disclosed. The apparatus includes a ring-shaped body located on bottom of an etch chamber, wherein the ring-shaped body has a ring-shaped gas-guiding trench formed on the bottom surface and inside of the ring-shaped body, and wherein the intersection of sidewall of the ring-shaped gas-guiding trench and the bottom surface of the ring-shaped body has a curved bending surface. At least one gas hole extends from the top surface of the ring-shaped body to the ring-shaped gas-guiding trench. The apparatus also includes a first ring-shaped seal and a second ring-shaped seal situated on the bottom surface of the ring-shaped body. A blocking layer is formed to cover the surface of the ring-shaped body.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: September 5, 2000
    Assignee: Mosel Vitelic Inc.
    Inventors: Shih-Tung Lan, Sheng-Kai Chang, Kuang-Yung Wu, Shih-Chi Lai
  • Patent number: 6076732
    Abstract: A holographic spectroscope for a two-motor reflection system for generating scanning patterns in which a light beam is first reflected by a first reflector connected to a first motor electrically connected to a first control circuit. A second reflector for reflecting the light beam reflected by the first reflector is connected to a second motor electrically connected to a second control circuit and to form scanning patterns. A holographic spectroscope for diffracting the scanning patterns is mounted in the optical path of the light beam from the second reflector. Therefore, the scanning patterns can be improved to be more variable.
    Type: Grant
    Filed: July 9, 1997
    Date of Patent: June 20, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Liang Lan, Chu-Wen Chen, Yi-Yung Wu
  • Patent number: 5833590
    Abstract: A backbone stretching exerciser including a base frame unit having two front lugs and two rear guide rollers respectively disposed at the top, a seat frame unit having a fixed end pivoted to front lugs of the base frame unit and a free end, a back frame unit pivoted to the free end of the seat frame unit and adapted for supporting the user's back, the back frame unit having two substantially arched guide tubes bilaterally disposed at a back side thereof and respectively supported on the guide rollers of the base frame unit, and a hydraulic cylinder connected between the base frame unit and the free end of the seat frame unit to impart a damping resistance to the seat frame unit.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: November 10, 1998
    Inventors: Ching-Chih Chiu, Sheng-Yung Wu
  • Patent number: 5825859
    Abstract: The present invention is related to a display control device adapted to be used in a communication apparatus providing an information for transmitting the information to a display and transmitting the information to a second device when the information is required by the second device, which includes a buffer device storing therein the information, a decoder electrically connected to the buffer device for decoding the information stored in the buffer device and outputting the decoded information to the display, a bidirectional transmission device electrically connected to the buffer device for transmitting the information to the display and transmitting the information to the second device when the information is required by the second device, and a controller electrically connected to the bidirectional transmission device for controlling a transmission between the bidirectional transmission device and the second device.
    Type: Grant
    Filed: July 27, 1995
    Date of Patent: October 20, 1998
    Assignee: Holtek Micro Electronics, Inc.
    Inventors: Chi-Yung Wu, Rong-Tyan Wu
  • Patent number: 5684733
    Abstract: The present invention provides a fixed resistance sense-routed high density parallel ROM device for maintaining the resistance of a buried N+ region on a sense route constant. When data is read from a ROM cell matrix, the selection of different ROM cell transistors does not change the resistance of the buried N+ region on the sense route and thus enables a simplified design of a sense amplifier. The inactive select gate or transfer gate that is activated by the select line can be isolated by ion implantation for forming a buried P+ isolation and thus avoiding the narrowing or the cutting-off of the width of the active transfer gate or select gate due to ion diffusion.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: November 4, 1997
    Assignee: Holtek Microelectronics, Inc.
    Inventors: Chi-Yung Wu, Ling Chen, Tong Peng
  • Patent number: 5670380
    Abstract: Disclosed is an assay for fetal thyroid function involving determining the amount of fetal thyroid function indicator that is present in the maternal blood and maternal urine and then comparing the determined value to a known standard for the gestation age of the fetus. It is defined as below one standard deviation of the normal values. Also disclosed is a method of treating a fetus having hypothyroidism involving determining that the fetus is hypothyroid using the assay of the present invention and thereafter, administering supplemental thyroid hormone (T.sub.4, 500 ug/wk) into the amniotic sac. Also disclosed is a method of identifying euthyroid state using the assay of the present invention in hypothyroid fetuses receiving T.sub.4 therapy.
    Type: Grant
    Filed: July 8, 1994
    Date of Patent: September 23, 1997
    Inventor: Sing-Yung Wu
  • Patent number: 5173617
    Abstract: A digital phase lock loop that does not depend on a voltage controlled oscillator (VCO) for phase locking. A phase detector (PD), terminated with a latch, controls an up/down counter that programs an increase/decrease of delay on the delay line. The tapped output of the delay line goes through a two phase generator which in turn feeds back to the PD for comparison with the reference clock. This process is repeated until phase locking is obtained.
    Type: Grant
    Filed: August 10, 1989
    Date of Patent: December 22, 1992
    Assignee: Motorola, Inc.
    Inventors: Mitchell Alsup, Carl S. Dobbs, Yung Wu, Claude Moughanni, Elie I. Haddad