Patents by Inventor Yunwen Huang

Yunwen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE
    Publication number: 20100307913
    Abstract: The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.
    Type: Application
    Filed: November 2, 2007
    Publication date: December 9, 2010
    Inventors: Yue Ma, Xi Wang, Yunwen Huang, Zhenxu Pang, Voha Nuch, David Wang