Patents by Inventor Yuping Hong
Yuping Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240040751Abstract: A heat conducting member is provided. The heat conducting member provided in this application includes a substrate and a heat conducting layer. The substrate includes a heat conducting surface. The heat conducting layer includes a transition layer and a protective layer. The transition layer is disposed on the heat conducting surface, and the protective layer is disposed on a surface that is of the transition layer and that is away from the heat conducting surface. Roughness Ra of the protective layer is less than or equal to 0.4. The transition layer can provide a hardness transition function between the substrate and the protective layer, to facilitate improving overall hardness of the heat conducting member. The protective layer may ensure surface hardness, to prevent an undesirable situation such as a scratch.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Inventors: Ming CHENG, Buping YUAN, Chengpeng YANG, Yuping HONG, Qinghe ZHANG
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Publication number: 20230156970Abstract: A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board.Type: ApplicationFiled: January 9, 2023Publication date: May 18, 2023Inventors: Yuping HONG, Xiaowei HUI, Meng WANG
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Patent number: 11330737Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.Type: GrantFiled: October 23, 2020Date of Patent: May 10, 2022Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Xiaowei Hui, Yuping Hong, Wei Chen
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Publication number: 20220046783Abstract: In an embodiment a heat dissipation apparatus includes a thermally conductive housing having a vacuum cavity in the thermally conductive, a chip placement region on a first surface of the thermally conductive housing, a capillary structure including a first capillary structure connected to a second capillary structure, wherein the first capillary structure and the second capillary structure are fixedly connected to an inner wall of the thermally conductive housing, wherein the first capillary structure is located on a side close to the first surface, a vertical projection of the first capillary structure on the first surface covering at least a part of a vertical projection of the chip placement region on the first surface, and wherein a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure, and a working medium placed in the capillary structure.Type: ApplicationFiled: October 22, 2021Publication date: February 10, 2022Inventors: Zhen Sun, Zhen Lu, Yuping Hong
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Publication number: 20210045263Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.Type: ApplicationFiled: October 23, 2020Publication date: February 11, 2021Applicant: HUAWEI TECHNOLOGIES CO.,LTD.Inventors: Xiaowei Hui, Yuping Hong, Wei Chen
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Patent number: 10820448Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.Type: GrantFiled: July 1, 2019Date of Patent: October 27, 2020Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Xiaowei Hui, Yuping Hong, Wei Chen
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Publication number: 20190327857Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.Type: ApplicationFiled: July 1, 2019Publication date: October 24, 2019Inventors: Xiaowei Hui, Yuping Hong, Wei Chen
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Patent number: 9872416Abstract: The present invention discloses a communications product (100), including a remote radio module (10) and a mounting kit (30), where the mounting kit (30) includes a fastening part (32), the fastening part (32) is configured to mount and fasten the remote radio module (10) to a holder, the mounting kit (30) further includes a ventilation part (34) and an air supply part (36), an air source is disposed inside the air supply part (36), the ventilation part (34) is connected between the fastening part (32) and the air supply part (36), a ventilation channel is disposed inside the ventilation part (34), and the ventilation channel allows the air supply part (36) to communicate with the remote radio module (10), so that an air flow generated by the air source reaches the remote radio module (10) after passing through the ventilation channel, to dissipate heat for the remote radio module.Type: GrantFiled: February 17, 2017Date of Patent: January 16, 2018Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Youhe Ke, Yuping Hong, Mingliang Hao
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Publication number: 20170164514Abstract: The present invention discloses a communications product (100), including a remote radio module (10) and a mounting kit (30), where the mounting kit (30) includes a fastening part (32), the fastening part (32) is configured to mount and fasten the remote radio module (10) to a holder, the mounting kit (30) further includes a ventilation part (34) and an air supply part (36), an air source is disposed inside the air supply part (36), the ventilation part (34) is connected between the fastening part (32) and the air supply part (36), a ventilation channel is disposed inside the ventilation part (34), and the ventilation channel allows the air supply part (36) to communicate with the remote radio module (10), so that an air flow generated by the air source reaches the remote radio module (10) after passing through the ventilation channel, to dissipate heat for the remote radio module.Type: ApplicationFiled: February 17, 2017Publication date: June 8, 2017Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Youhe KE, Yuping HONG, Mingliang HAO
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Patent number: 9451725Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.Type: GrantFiled: August 17, 2015Date of Patent: September 20, 2016Assignee: Huawei Technologies Co., Ltd.Inventors: Yuping Hong, Chenglong Wang, Mingliang Hao, Youhe Ke
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Patent number: 9423192Abstract: A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.Type: GrantFiled: November 18, 2011Date of Patent: August 23, 2016Assignee: Huawei Technologies Co., Ltd.Inventors: Vadim Tsoi, Uno Henningsson, Yuping Hong, Feng Peng, Hua Yang, Haipeng Li
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Publication number: 20160057888Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.Type: ApplicationFiled: August 17, 2015Publication date: February 25, 2016Inventors: Yuping Hong, Chenglong Wang, Mingliang Hao, Youhe Ke
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Patent number: 8839848Abstract: A cabinet temperature control system comprises a cabinet and an underground temperature control unit. The cabinet comprises an air discharging chamber and an air introducing chamber which are in communication with each other inside the cabinet. The underground temperature control unit comprises an air discharging chamber and an air introducing chamber which are in communication with each other inside the underground temperature control unit. The air discharging chamber of the cabinet and the air introducing chamber of the underground temperature control unit, and the air discharging chamber of the underground temperature control unit and the air introducing chamber of the cabinet, are in communication with each other respectively, so that the cabinet and the underground temperature control unit form an air circulating circuit. The underground temperature control unit further comprises a radiator arranged in the air circulating circuit. The system also has fans controlled by a control module.Type: GrantFiled: August 3, 2010Date of Patent: September 23, 2014Assignee: Huawei Technologies Co., Ltd.Inventors: Weixing Wu, Yuping Hong, Liqian Zhai, Xiaoming Kong
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Patent number: 8792240Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).Type: GrantFiled: December 15, 2011Date of Patent: July 29, 2014Assignee: Huawei Technologies Co., Ltd.Inventors: Taqing Feng, Zhijian Li, Yuping Hong, Hongliang Chen, Jian Shi
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Patent number: 8514571Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.Type: GrantFiled: January 20, 2012Date of Patent: August 20, 2013Assignee: Huawei Technologies Co., Ltd.Inventors: Shengqin Ji, Yuping Hong, Yongchao He
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Publication number: 20120222444Abstract: The present invention relates to a communication device, and in particular, to a Remote Radio Unit (RRU). The RRU includes an RRU radiator structural member and a shell, where the shell includes an evaporator, radiating pipes and a shell body, the inside of the evaporator is in communication with the radiating pipes to form a loop for holding a phase change medium, and the radiating pipes are disposed on the shell body; and the evaporator is connected to a radiator of the RRU radiator structural member. By using the RRU according to the present invention, the radiating efficiency can be improved.Type: ApplicationFiled: March 2, 2012Publication date: September 6, 2012Applicant: Huawei Technologies Co., Ltd.Inventors: Zhijian Li, Taqing Feng, Yuping Hong, Jian Shi
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Patent number: 8223492Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.Type: GrantFiled: June 18, 2010Date of Patent: July 17, 2012Assignee: Huawei Technologies Co., Ltd.Inventors: Shengqin Ji, Yuping Hong, Yongchao He
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Publication number: 20120147562Abstract: A heat exchanger, a heat dissipation method and a communication apparatus are provided. The heat exchanger includes a first and a second air passage separated from each other. The first air passage has a first fan unit and a first group of heat dissipation tubules. The second air passage has a second fan unit and a second group of heat dissipation tubules. The upper ends of the first and second group of heat dissipation tubules are communicated with each other via a steam manifold. The lower ends of the first and second group of heat dissipation tubules are communicated with each other via a liquid manifold. A closed pipeline filled with liquid vaporized when heated, is formed by the first and second group of dissipation tubules, the steam manifold and the liquid manifold. Heat dissipation fins are set among the first and second group of dissipation tubules.Type: ApplicationFiled: December 15, 2011Publication date: June 14, 2012Inventors: Taqing FENG, Yuping Hong, Hui Lin, Feng Peng, Yunhul Zhang, Chong Wu
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Publication number: 20120120600Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.Type: ApplicationFiled: January 20, 2012Publication date: May 17, 2012Applicant: Huawei Technologies Co., Ltd.Inventors: Shengqin JI, Yuping HONG, Yongchao HE
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Publication number: 20120111553Abstract: A heat spreading device of thermo siphon, the device comprising sectioning forming a first chamber portion and a second chamber portion, first plurality of conduits, and second at least two conduits, the second at least two conduits providing interconnection of the first and second chamber portions is disclosed. Integral parts/portions are provided, such as cavities, barrier and fins.Type: ApplicationFiled: November 18, 2011Publication date: May 10, 2012Inventors: Vadim Tsoi, Uno Henningsson, Yuping Hong, Feng Peng, Hua Yang, Haipeng Li