Patents by Inventor Yuping Hong

Yuping Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120087090
    Abstract: A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).
    Type: Application
    Filed: December 15, 2011
    Publication date: April 12, 2012
    Inventors: Taqing Feng, Zhijian Li, Yuping Hong, Hongliang Chen, Jian Shi
  • Publication number: 20110042057
    Abstract: A cooling system includes a buried heat exchange unit (301), a first air-liquid heat exchanger (302), a second air-liquid heat exchanger (303), a control device (304), a fluid conveying device (305), and connecting pipes (307). A control method applicable to the cooling system includes: acquiring environment information, where the environment information includes at least one of the following temperatures: an outdoor temperature of the equipment room and a temperature of the soil surrounding buried pipes; and controlling at least one of the at least two circulation pipelines to be in an open state according to a control policy and the acquired environment information, where a circulation fluid is driven by the fluid conveying device to flow in the open circulation pipeline. An equipment room using the cooling system is also provided.
    Type: Application
    Filed: November 1, 2010
    Publication date: February 24, 2011
    Inventors: Yuening Li, Yuping Hong
  • Publication number: 20100295429
    Abstract: A cabinet temperature control system comprises a cabinet and an underground temperature control unit. The cabinet comprises an air discharging chamber and an air introducing chamber which are in communication with each other inside the cabinet. The underground temperature control unit comprises an air discharging chamber and an air introducing chamber which are in communication with each other inside the underground temperature control unit. The air discharging chamber of the cabinet and the air introducing chamber of the underground temperature control unit, and the air discharging chamber of the underground temperature control unit and the air introducing chamber of the cabinet, are in communication with each other respectively, so that the cabinet and the underground temperature control unit form an air circulating circuit. The underground temperature control unit further comprises a radiator arranged in the air circulating circuit. The system also has fans controlled by a control module.
    Type: Application
    Filed: August 3, 2010
    Publication date: November 25, 2010
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Weixing Wu, Yuping Hong, Liqian Zhai, Xiaoming Kong
  • Publication number: 20100253189
    Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.
    Type: Application
    Filed: June 18, 2010
    Publication date: October 7, 2010
    Inventors: Shengqin Ji, Yuping HONG, Yongchao He