Patents by Inventor Yusaku ASANO

Yusaku ASANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 8476741
    Abstract: According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: July 2, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Susumu Obata, Takahiro Sogou, Yusaku Asano, Takeshi Miyagi
  • SEMICONDUCTOR DEVICE
    Publication number: 20110215427
    Abstract: According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
    Type: Application
    Filed: January 19, 2011
    Publication date: September 8, 2011
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Susumu OBATA, Takahiro Sogou, Yusaku Asano, Takeshi Miyagi
  • SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME
    Publication number: 20110186982
    Abstract: According to one embodiment, a surface mount diode including a diode chip including a first main surface and a second main surface, a cathode electrode including a first internal electrode portion on the first main surface and a first external electrode portion on the first internal electrode portion, an anode electrode including a second internal electrode portion on the second main surface and a second external electrode portion on the second internal electrode portion, a thickness of the second external electrode portion being the same as a thickness of the first external electrode portion, a first covering member covering a periphery surface of one of the internal electrode portions and a periphery surface of the diode chip, and a second covering member covering a periphery surface of the other of the internal electrode portions, the second covering member being different in color from the first covering member.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 4, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Tomoyuki KITANI, Akira TOJO, Takao NOGI, Kazuhito HIGUCHI, Tomohiro IGUCHI, Masako FUKUMITSU, Susumu OBATA, Yusaku ASANO