Patents by Inventor Yusheng Bian

Yusheng Bian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230314730
    Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure includes a back-end-of-line stack located over a substrate. The back-end-of-line stack includes a waveguide core having a longitudinal axis and a tapered section with a width that varies with position along the longitudinal axis based on a non-linear function.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Inventor: Yusheng Bian
  • Publication number: 20230314706
    Abstract: Disclosed is a structure including a first waveguide core with a first end portion and a second waveguide core with a second end portion, which overlays and is physically separated from the first end portion. The structure includes a coupler configured for interlayer waveguide coupling. Specifically, the coupler includes an additional waveguide core stacked vertically between and physically separated from the first end portion and the second end portion. Optionally, the coupler includes multiple additional waveguide cores. The shapes of the various waveguide cores are configured in order to achieve mode matching so that optical signals pass between the first end portion of the first waveguide core and the second end portion of the second waveguide core through each additional waveguide core in sequence. Also disclosed is a structure including a crossing array implemented using couplers.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Patent number: 11774686
    Abstract: Structures for an edge coupler of a photonics chip and methods of forming an edge coupler for a photonics chip. The structure includes a waveguide core on a dielectric layer, as well as an interconnect structure including a interlayer dielectric layer positioned over the dielectric layer and an opening penetrating through the interlayer dielectric layer to the waveguide core. A region of the interlayer dielectric layer is positioned to overlap with a portion of the waveguide core. The region of the interlayer dielectric layer has a surface that is rounded with a curvature.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: October 3, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Brett Cucci, Yusheng Bian, Abdelsalam Aboketaf, Edward Kiewra, Robert K. Leidy
  • Publication number: 20230305241
    Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure includes a substrate, a waveguide core, and a metamaterial layer positioned in a vertical direction between the substrate and the waveguide core. The metamaterial layer includes a plurality of elements separated by a plurality of gaps and a dielectric material in the plurality of gaps.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 28, 2023
    Inventor: Yusheng Bian
  • Publication number: 20230305242
    Abstract: Photonics structures including a slotted waveguide and methods of fabricating such photonics structures. The photonics structure includes a slotted waveguide having a first waveguide core and a second waveguide core laterally positioned adjacent to the first waveguide core. The first waveguide core is separated from the second waveguide core by a slot. The photonics structure further includes a metamaterial structure having a plurality of elements separated by a plurality of gaps and a dielectric material in the plurality of gaps. The metamaterial structure and the slot of the slotted waveguide are positioned with an overlapping arrangement.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 28, 2023
    Inventor: Yusheng Bian
  • Publication number: 20230305240
    Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure includes a substrate, a first waveguide core, and a second waveguide core positioned in a vertical direction between the first waveguide core and the substrate. The second waveguide core includes a taper and an inverse taper longitudinally positioned adjacent to the taper.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 28, 2023
    Inventor: Yusheng Bian
  • Patent number: 11768337
    Abstract: Structures for a coupler and methods of forming a structure for a coupler. A structure for a directional coupler may include a first waveguide core having one or more first airgaps and a second waveguide core including one or more second airgaps. The one or more second airgaps are positioned in the second waveguide core adjacent to the one or more first airgaps in the first waveguide core. A structure for an edge coupler is also provided in which the waveguide core of the edge coupler includes one or more airgaps.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: September 26, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Spencer Porter, Mark Levy, Siva P. Adusumilli, Yusheng Bian
  • Publication number: 20230280549
    Abstract: Structures including an optical component, such as an edge coupler, and methods of fabricating such structures. The structure includes a substrate, a waveguide core over the substrate, and a metamaterial layer positioned in a vertical direction between the waveguide core and the substrate. The metamaterial layer includes a set of elements separated by a set of gaps and a dielectric material in the set of gaps.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 7, 2023
    Inventor: Yusheng Bian
  • Patent number: 11747562
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to spiral waveguide absorbers and methods of manufacture. The structure includes: a photonics component; and a waveguide absorber with a grating pattern coupled to a node of the photonics component.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: September 5, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventor: Yusheng Bian
  • Patent number: 11747560
    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first waveguide with a first main body and a first end portion, which is tapered; and a second waveguide with a second main body and a second end portion, which has two branch waveguides that are positioned adjacent to opposing sides, respectively, of the first end portion of the first waveguide and that branch out from the second main body, thereby forming a V, U or similar shape. The arrangement of the two branch waveguides of the second end portion of the second waveguide relative to the tapered first end portion of the first waveguide allows for mode matching conditions to be met at multiple locations at the interface between the waveguides, thereby creating multiple signal paths between the waveguides and effectively reducing the light signal power density along any one path to prevent or at least minimize any power-induced damage.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: September 5, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Roderick A. Augur
  • Patent number: 11747559
    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first primary waveguide, which has a first main body and a first end portion that is tapered; at least one supplemental waveguide positioned laterally adjacent to and extending beyond the first end portion of the first primary waveguide; and a second primary waveguide, which has a second main body and a second end portion that at least partially underlays/overlays the first end portion of the first primary waveguide and the supplemental waveguide(s). The arrangement the end portions of the primary waveguides and the supplemental waveguide(s) allows for mode matching conditions to be met at multiple locations at the interface between the primary waveguides, thereby creating multiple signal paths between the primary waveguides and effectively reducing the light signal power density in any one path to prevent or at least minimize any power-induced damage.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: September 5, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Publication number: 20230273369
    Abstract: Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Shesh Mani Pandey, Yusheng Bian, Steven M. Shank, Judson Holt
  • Publication number: 20230266533
    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Theodore Letavic, Yusheng Bian, Hemant Dixit
  • Publication number: 20230266544
    Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Yusheng Bian, Nicholas Polomoff, Keith Donegan, Qizhi Liu, Steven M. Shank
  • Publication number: 20230266526
    Abstract: Disclosed is an optical waveguide including a waveguide core and waveguide cladding surrounding the waveguide core. The waveguide cladding includes at least one stack of cladding material layers positioned laterally adjacent to a sidewall of the waveguide core such that each cladding material layer in the stack abuts the sidewall of the waveguide core. Each of the cladding material layers in the stack has a smaller refractive index than the waveguide core and at least two of the cladding material layers in the stack have different refractive indices, thereby tailoring field confinement and reshaping the optical mode. Different embodiments include different numbers of cladding material layers in the stack, different stacking orders of the cladding material layers, different waveguide core types, symmetric or asymmetric cladding structures on opposite sides of the waveguide core, etc. Also disclosed is a method of forming the optical waveguide.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: GlobalFoundries U.S. Inc.
    Inventors: Shesh Mani Pandey, Yusheng Bian, Francis O. Afzal
  • Publication number: 20230266529
    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a waveguide core and a back-end-of-line stack including a first metallization level, a second metallization level, and a heat sink having a metal feature in the second metallization level. The heat sink is positioned adjacent to a section of the waveguide core. The first metallization level including a dielectric layer positioned between the metal feature and the section of the waveguide core.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Hemant Dixit, Yusheng Bian, Theodore Letavic
  • Publication number: 20230266530
    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Yusheng Bian, Hemant Dixit, Theodore Letavic
  • Patent number: 11733458
    Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes a first waveguide core having a first inverse taper, a second waveguide core having a second inverse taper, and a third waveguide core having a third inverse taper that is laterally positioned between the first inverse taper and the second inverse taper. The structure further includes a fourth waveguide core having a fourth inverse taper that is positioned to overlap with the first inverse taper, and a fifth waveguide core having a fifth inverse taper that is positioned to overlap with the second inverse taper.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: August 22, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventor: Yusheng Bian
  • Patent number: 11719895
    Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: August 8, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Yusheng Bian, Nicholas Polomoff, Keith Donegan, Qizhi Liu, Steven M. Shank
  • Patent number: 11721780
    Abstract: Structures for an avalanche photodetector and methods of forming a structure for an avalanche photodetector. The structure includes a first semiconductor layer having a first portion and a second portion, and a second semiconductor layer stacked in a vertical direction with the first semiconductor layer. The first portion of the first semiconductor layer defines a multiplication region of the avalanche photodetector, and the second semiconductor layer defines an absorption region of the avalanche photodetector. The structure further includes a charge sheet in the second portion of the first semiconductor layer. The charge sheet has a thickness that varies with position in a horizontal plane, and the charge sheet is positioned in the vertical direction between the second semiconductor layer and the first portion of the first semiconductor layer.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: August 8, 2023
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Asif Chowdhury, Yusheng Bian