Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: The quality of a frame sequence is enhanced by a booster engine collaborating with a first stage circuit. The first stage circuit adjusts the quality degradation of the frame sequence when a condition in constrained resources is detected. The quality degradation includes at least one of uneven resolution and uneven frame per second (FPS). The booster engine receives the frame sequence from the first stage circuit, and generates an enhanced frame sequence based on the frame sequence for transmission to a second stage circuit.

Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first tier, a second tier, and a third tier. The first tier includes an interposer. The second tier is disposed on the first tier and includes a bottom die. The third tier is disposed on the second tier and includes a plurality of first dies and at least one second die. The at least one second die is disposed between the plurality of first dies. The plurality of first dies are electrically connected to the bottom die by a plurality of first connectors to form a signal path, the plurality of first dies are electrically connected to the interposer by a plurality of second connectors to form a power path, and the plurality of first connectors are closer to the at least one second die than the plurality of second connectors.

Abstract: A pressure sensing device, comprising: a frame work; a capacitive pressure sensor layer, surrounding the frame work; a capacitive touch sensor layer; and a flexible material layer, located between the pressure sensor layer and the touch sensor layer and surrounding the capacitive pressure sensor layer. The capacitive touch sensor layer is above the flexible material layer when the capacitive pressure sensor layer is below the flexible material layer. The capacitive touch sensor layer has a first driving electrode and a first sensing electrode. The capacitive pressure sensor layer has a second driving electrode and a second sensing electrode. A 3D gesture control system and a vehicle control system applying the pressure sensing device are also disclosed. Via the pressure sensing device, the 3D gesture control system and the vehicle control system can generate control commands according to a touch or a pressure provided by a user.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.

Abstract: A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module, a seal ring surrounding the liquid alloy TIM, and a package lid on the liquid alloy TIM and seal ring, wherein the seal ring, interposer module and package lid seal the liquid alloy TIM.

Abstract: A package structure is provided. The package structure includes a first package component mounted on a substrate, a lid structure disposed on the substrate and around the first package component, and a thermal interface material vertically sandwiched between the plurality of integrated circuit dies of the first package component and the lid structure. The first package component includes a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies. The lid structure covers the integrated circuit dies and exposes the underfill. A first portion and a second portion of the thermal interface material are laterally separated from each other, and a space between the first portion and the second portion is exposed from the lid structure.

Abstract: An in vitro training method for training genioglossus muscle strength includes adhering an electrode patch of an in vitro training device to a bottom of a chin of a user during a non-sleep period. The electrode patch receives an electrical stimulation signal from an electrical stimulation module of the in vitro training device to stimulate the genioglossus muscle of the user through transdermal electrical stimulation. The electrode patch includes a body surface adhering face and an assembling face opposite to the body surface adhering face. The body surface adhering face is adhered to the bottom of the chin of the user to align with the genioglossus muscle. The electrical stimulation module is disposed on the assembling face and in electrical connection with the electrode patch. The electrical stimulation module sends an electrical stimulation signal to stimulate the genioglossus muscle through transdermal electrical stimulation.

Abstract: An in vitro training method includes scanning a user's oral cavity to create a first oral cavity model. An articulator body is selected according to the first oral cavity model, and plural first customized electrode sheets are formed and assembled onto the articulator body to obtain an in vitro training device. The user bites the in vitro training device during a non-sleep period and uses the plural first customized electrode sheets to proceed with electrical stimulation on a top surface and two sides of a tongue of the user, thereby training a muscular endurance of infrahyoid muscles of the user for a training period. The user's oral cavity is scanned again to create a second oral cavity model. The first oral cavity model is compared with the second oral cavity model to timely renew the customized electrode sheets when the image over rate is lower than 80%.

Abstract: A fabricating method of a non-enzyme sensor element includes a printing step, a coating step and an electroplating step. In the printing step, a conductive material is printed on a surface of a substrate to form a working electrode, a reference electrode and an auxiliary electrode, and a porous carbon material is printed on the working electrode to form a porous carbon layer. In the coating step, a graphene film material is coated on the porous carbon layer of the working electrode to form a graphene layer. In the electroplating step, a metal is electroplated on the graphene layer by a pulse constant current to form a catalyst layer including a metal oxide.

Abstract: A method for preparing a long-chain branched polypropylene includes subjecting a T-reagent to a polymerization reaction with propylene in the presence of a catalyst composition. The catalyst composition includes an alkylaluminoxane and a metallocene-based catalyst. The metallocene-based catalyst contains a metal selected from the group consisting of titanium (Ti), zirconium (Zr), and hafnium (Hf). The T-reagent having an alkenyl silyl functional group is selected from the group consisting of 1,2-bis[dimethyl(vinyl)silyl]ethane, dimethyldivinylsilane, 7-octenyldimethyl(vinyl)silane, 7-octenyldimethyl(allyl)silane, 4-(but-3-enyl)phenyldimethyl(vinyl)silane, 4-(but-3-enyl)phenyldimethyl(allyl)silane, and combinations thereof.

Abstract: An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface.

Abstract: A communication device includes a first laser driver, a second laser driver, a light emitting and receiving component, and a processor. The light emitting and receiving component is connected to a passive optical network to send and/or receive an optical signal. The light emitting and receiving component converts the optical signal into a first electrical signal and outputs the first electrical signal to one of the first laser driver and the second laser driver. One of the first laser driver and the second laser driver converts the first electrical signal into a second electrical signal, and outputs the second electrical signal to the processor. The processor disables another one of the first laser driver and the second laser driver.

Abstract: A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.

Abstract: A pressure sensing device, comprising: a frame work; a capacitive pressure sensor layer, surrounding the frame work; a capacitive touch sensor layer; and a flexible material layer, located between the pressure sensor layer and the touch sensor layer and surrounding the capacitive pressure sensor layer. The capacitive touch sensor layer is above the flexible material layer when the capacitive pressure sensor layer is below the flexible material layer. The capacitive touch sensor layer has a first driving electrode and a first sensing electrode. The capacitive pressure sensor layer has a second driving electrode and a second sensing electrode. A 3D gesture control system and a vehicle control system applying the pressure sensing device are also disclosed. Via the pressure sensing device, the 3D gesture control system and the vehicle control system can generate control commands according to a touch or a pressure provided by a user.

Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first tier, a second tier, and a third tier. The first tier includes an interposer. The second tier is disposed on the first tier and includes a bottom die. The third tier is disposed on the second tier and includes a plurality of first dies and at least one second die. The at least one second die is disposed between the plurality of first dies. The plurality of first dies are electrically connected to the bottom die by a plurality of first connectors to form a signal path, the plurality of first dies are electrically connected to the interposer by a plurality of second connectors to form a power path, and the plurality of first connectors are closer to the at least one second die than the plurality of second connectors.

Abstract: The present disclosure provides an interspinous process device. The interspinous process device may include a main body having a cavity formed therein, the main body being configured to be disposed between the two adjacent spinous processes; and a spacer configured to be arranged in the cavity of the main body. When the main body is disposed between the two adjacent spinous processes and the spacer is arranged in the cavity of the main body, a volume of the cavity may be greater than a volume of the spacer, a height of the cavity may be equal to a height of the spacer, and a width of the cavity may be greater than a width of the spacer.

Abstract: A package structure is provided. The package structure includes a first package component, a second package component, and a lid structure. The first package component includes a plurality of integrated circuit dies and an underfill formed between the integrated circuit dies. The second package component includes a substrate, and the first package component is mounted on the substrate. The lid structure is disposed on the second package component and around the first package component, and the lid structure covers the integrated circuit dies and exposes the underfill.

Abstract: In an embodiment, a three-dimensional integrated circuit (3DIC) package includes an interposer, a plurality of connection pads, a plurality of dummy patterns, a plurality of integrated circuit structures and an underfill layer. The connection pads are disposed on and electrically connected to a first side of the interposer. The dummy patterns are disposed on the first side of the interposer and around the plurality of connection pads. The integrated circuit structures are electrically connected to the connection pads through a plurality of first bumps. The underfill layer surrounds the first bumps and covers the dummy patterns.

Abstract: A thermal module may include a cold plate including a cold plate base having a cold plate base protruding portion, and a cold plate cover on the cold plate base, and a heat pipe between the cold plate base and the cold plate cover, and including an upper heat pipe portion and a lower heat pipe portion in the cold plate base protruding portion.