Abstract: An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.

Abstract: An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re).

Abstract: Provided is an insulating substrate which includes an aluminum substrate and an anodized film covering a whole surface of the aluminum substrate and in which the anodized film contains intermetallic compound particles with a circle equivalent diameter of 1 ?m or more in an amount of up to 2,000 pcs/mm3. Also provided is a method for manufacturing the insulating substrate which includes an anodizing treatment step for anodizing the aluminum substrate. The anodized film of the insulating substrate covering the whole surface of the aluminum substrate contains intermetallic compound particles with a circle equivalent diameter of 1 ?m or more in an amount of up to 2,000 pcs/mm3.

Abstract: A method of cross-flow filtration using a membrane filter has a feeding a fluid to be filtered across a membrane surface of a porous alumina membrane filter serving as the membrane filter so that the fluid flows parallel to the membrane surface to separate material to be filtered with the porous alumina membrane filter. The porous alumina membrane filter is made of an aluminum anodized film and includes micropores having a degree of ordering as defined by formula (1): Degree of ordering (%)=B/A×100??(1) of at least 50%, a porosity as defined by formula (2): Porosity (%)=C/D×100??(2) of at least 40%, and a percentage of a pore size standard deviation to an average pore size of up to 10%.

Abstract: Provided is an anisotropically conductive member that has a dramatically increased density of disposed conductive paths, can be used as an electrically connecting member or inspection connector for electronic components such as semiconductor devices even today when still higher levels of integration have been achieved, and has excellent flexibility. The anisotropically conductive member includes an insulating base and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in the thickness direction of the insulating base, one end of each of the conductive paths protruded on one side of the insulating base, the other end of each of the conductive paths exposed or protruded on the other side thereof. The insulating base is made of a resin material and the conductive paths are formed at a density of at least 1,000,000 conductive paths/mm2.

Abstract: A light reflecting substrate comprises at least: an insulating layer and a metal layer disposed in contact with the insulating layer. The total reflectivity of light in the wavelength range of more than 320 nm and not more than 700 nm is not less than 50% and the total reflectivity of light in the wavelength range of 300 nm to 320 nm is not less than 60%. The light reflecting substrate further improves the emission power of the light-emitting device when used as the substrate therefor.

Abstract: A microstructure that comprises an insulating base material having through micropores filled with metal at a high filling ratio and that can be used as an anisotropically conductive member is provided. The microstructure comprises an insulating base material having through micropores with a pore size of from 10 to 500 nm at a density of from 1×106 to 1×1010 pores/mm2, a metal being filled into the through micropores at a filling ratio of at least 80%.

Abstract: An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.

Abstract: A radiation reflection plate for use in LEDs is a reflection plate including an aluminum alloy layer with a depth of at least 10 ?m and an anodized film formed at a surface thereof. Pore portions of the anodized film have at least two layers of different refractive indices in a depth direction, and light reflection is enhanced in the anodized film. The radiation reflection plate has high heat dissipation properties and is capable of increasing the reflectance of light at desired specific wavelengths.

Abstract: A microstructure enabling provision of an anisotropic conductive member capable of reducing wiring defects and a method of producing such microstructure. The microstructure includes through-holes formed in an insulating matrix and filled with a metal and an insulating substance. The through-holes have a density of 1×106 to 1×1010 holes/mm2, a mean opening diameter of 10 nm to 5000 nm, and a mean depth of 10 ?m to 1000 ?m. The sealing ratio of the through-holes as attained by the metal alone is 80% or more, and the sealing ratio of the through-holes as attained by the metal and the insulating substance is 99% or more. The insulating substance is at least one kind selected from the group consisting of aluminum hydroxide, silicon dioxide, metal alkoxide, lithium chloride, titanium oxide, magnesium oxide, tantalum oxide, niobium oxide, and zirconium oxide.

Abstract: An insulated light-reflective substrate, comprising a substrate and an anodized film provided on the surface of the substrate, wherein: the substrate has at its surface an aluminum alloy layer of a thickness of not less than 10 ?m; the aluminum alloy layer has an aluminum purity of 99.9% by weight or higher, with the total content of Si and Fe in the layer being not more than 0.005% by weight, and the content of inevitable impurities in the layer as components other than Al, Si, Fe, Ga and Zn being not more than 0.01% by weight; the anodized film has micropores each extending from the surface of the film in the direction of thickness; and the ratio of center line length to depth of the micropores is 1.0 to 1.2.

Abstract: A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are disposed at a density of 1×106 to 1×1010 micropores/mm2. The through micropores are filled with a metal at a filling ratio of at least 30% and a polymer layer is formed on at least one surface of the insulating base.

Abstract: An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes.

Abstract: Disclosed is a structure that has a thickness of 100 ?m or greater and has regular micropores. A microstructure includes an aluminum or aluminum alloy oxide film which has cylindrical micropores extending from a bottom surface to a top surface of the microstructure. The micropores are arrayed at the bottom surface so as to have a degree of ordering as defined by general formula (1) of at least 70%, the center-to-center distance between neighboring micropores is from 300 to 600 nm and the axial length of the micropores is at least 100 ?m.

Abstract: An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re).

Abstract: Disclosed is a microstructure comprising an aluminum anodized film bearing through micropores, wherein a surface of the microstructure is covered with a protective film for preventing hydration of the aluminum anodized film. The microstructure may be used as a porous alumina membrane filter excellent in filtration rate and its stability with time.

Abstract: A microstructure includes an anodized aluminum layer that has on a surface thereof micropores, at least some of which contain a catalyst, in a micropore array with a degree of ordering of at least 40%. A method of manufacturing the microstructure includes anodizing an aluminum member to form on its surface an anodized layer having micropores, removing the aluminum member, and supporting a catalyst on at least part of the anodized layer. The microstructure is excellent in heat resistance.

Abstract: Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm2. In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.

Abstract: A method of manufacturing a microstructure wherein an aluminum member having an aluminum substrate and a micropore-bearing anodized film present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving the anodized film until a barrier layer has a thickness of 3 to 50 nm, and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized film so that a ratio of a diameter of a micropore opening “a” to a micropore diameter at a height “a/2” from a micropore bottom “b” (a/b) is in a range of 0.9 to 1.1, whereby the microstructure having micropores formed on a surface thereof is obtained. The manufacturing method enables microstructures having an ordered array of pits to be obtained in a short period of time.

Abstract: Disclosed is a method of manufacturing a microstructure, wherein an aluminum substrate is subjected to, in order, (1) a step of subjecting a surface of the aluminum substrate to a first anodizing treatment to form an anodized film having micropores on the surface of the aluminum substrate; (2) a step of partially dissolving the anodized film using an acid or alkali; (3) a step of performing a second anodizing treatment to grow the micropores in their depth direction; and (4) a step of removing a part of the anodized film above inflection points in cross section of the micropores, whereby the microstructure having the micropores formed at a surface of the anodized film is obtained and a microstructure manufactured by the method. The method is capable of obtaining in a short period of time a microstructure having an ordered array of pits without using highly toxic chromic (VI) acid.