Abstract: According to an embodiment, a memory system includes first wiring lines; second wiring lines; third wiring lines; fourth wiring lines; and first and second storages. The first storage includes first memory cells arranged at intersections of the first wiring lines and the second wiring lines. Each of the third wiring lines is connected to any one of the first wiring lines. Each of the fourth wiring lines is pre-associated with a logical address specified by a host apparatus. The second storage includes second memory cells arranged at intersections of the third wiring lines and the fourth wiring lines. A resistance state of each of the second memory cells is set to a first resistance state or a second resistance state where a resistance value is lower than that in the first resistance state, according to a correspondence relationship between the logical address and the first wiring line.

Abstract: This semiconductor device comprises: a gate insulating film provided on a surface of a channel layer; a gate electrode provided on an upper surface of the gate insulating film; and a diffusion layer provided in the channel layer. Furthermore, this semiconductor device comprises: a polycrystalline silicon film provided so as to cover a surface of the gate electrode and the diffusion layer; and an inter-layer insulating film provided so as to cover the gate electrode and the polycrystalline silicon film.

Abstract: An imaging element according to embodiments may comprise a plurality of photoreceivers (11a), a plurality of scanning circuits (11b), a first wiring (L2), a plurality of second wirings (L1), and at least one variable resistance element (VR2). The plurality of scanning circuits (11b) may be connected to the plurality of photoreceivers, respectively. Each of the second wirings (L1) may branch off from the first wiring and be connected to one of the scanning circuits. The at least one variable resistance element (VR2) may be located on the first wiring so as to electrically intervene between adjacent branching points (N1, N2) among a plurality of branching points between the first wiring and the second wirings.

Abstract: According to an embodiment, a memory system includes first wiring lines; second wiring lines; third wiring lines; fourth wiring lines; and first and second storages. The first storage includes first memory cells arranged at intersections of the first wiring lines and the second wiring lines. Each of the third wiring lines is connected to any one of the first wiring lines. Each of the fourth wiring lines is pre-associated with a logical address specified by a host apparatus. The second storage includes second memory cells arranged at intersections of the third wiring lines and the fourth wiring lines. A resistance state of each of the second memory cells is set to a first resistance state or a second resistance state where a resistance value is lower than that in the first resistance state, according to a correspondence relationship between the logical address and the first wiring line.

Abstract: According to an embodiment, a memory system includes a memory and a computation unit. Into the memory, data are written. The memory stores therein multiple check matrices. Each of the check matrices is associated with the number of errors in the written data. The computation unit is configured to perform a first error correction on the written data by selectively using, from among the check matrices, a check matrix associated with the number of errors recognized in the written data.

Abstract: According to an embodiment, an imaging element includes a plurality of light receiving elements, a plurality of scanning circuits, a first line comprising a plurality of nodes, and a plurality of first variable resistance elements. The plurality of scanning circuits are respectively connected to the plurality of light receiving elements. Each of the plurality of first variable resistance elements is connected between the corresponding one of the nodes and a corresponding one of the scanning circuits. At least one of the first variable resistance elements includes a plurality of resistance elements connected to each other in parallel.

Abstract: This semiconductor device comprises: a gate insulating film provided on a surface of a channel layer; a gate electrode provided on an upper surface of the gate insulating film; and a diffusion layer provided in the channel layer. Furthermore, this semiconductor device comprises: a polycrystalline silicon film provided so as to cover a surface of the gate electrode and the diffusion layer; and an inter-layer insulating film provided so as to cover the gate electrode and the polycrystalline silicon film.

Abstract: According to an embodiment, a semiconductor storage device includes a first storage unit, a read control unit, a second storage unit, and a write control unit. The first storage unit is configured to store data supplied from a host device. The read control unit is configured to perform control of reading the data in accordance with a read request. The second storage unit is configured to store a logical address used for reading the data from the first storage unit by the read control unit. The write control unit is configured to perform control of adding the stored logical address to the data and write the resulting data into the first storage unit in a case where a size of the data requested to be written into the first storage unit by the host device is smaller than a threshold.

Abstract: According to an embodiment, a semiconductor storage device includes a first storage unit, a read control unit, a second storage unit, and a write control unit. The first storage unit is configured to store data supplied from a host device. The read control unit is configured to perform control of reading the data in accordance with a read request. The second storage unit is configured to store a logical address used for reading the data from the first storage unit by the read control unit. The write control unit is configured to perform control of adding the stored logical address to the data and write the resulting data into the first storage unit in a case where a size of the data requested to be written into the first storage unit by the host device is smaller than a threshold.

Abstract: According to an embodiment, a semiconductor circuit includes a substrate, a tunnel oxide film, a charge storage film, a blocking layer, and plural nodes. The substrate is made of a semiconductor in which two diffusion layers each serving as either a source or a drain are formed. The tunnel oxide film is formed on a region of the substrate between the diffusion layers. The charge storage film is formed on the tunnel oxide layer and stores charge. The blocking layer is formed between the charge storage film and a gate electrode and has layers of a first oxide film, a nitride film and a second oxide film to have a thickness of 5 nm or larger but 15 nm or smaller. The nodes allow external application of voltages so that the source and the drain are reversed and allow detection a gate voltage, a drain current and a substrate current.

Abstract: According to an embodiment, an error correction device includes first calculators, second calculators, estimators, and an inverter. Each first calculator calculates a first message representing a probability that 1-bit data that is input in a corresponding variable node is 1. Each second calculator calculates a second message representing a probability that a value of the data input to the variable node is 1 for each of two or more variable nodes connected to the check node by using the first messages of the variable nodes connected to the check node. Each estimator estimates a true value of the data input to the variable node to generate an estimated value by using the first and second messages. The inverter inverts the estimated value associated with at least one of the variable nodes with a probability higher than 0 and lower than 1.

Abstract: A semiconductor device according to embodiments includes a semiconductor substrate, a buried insulating layer which is formed on the semiconductor substrate, a semiconductor layer which is formed on the buried insulating layer and includes a narrow portion and two wide portions which are larger than the narrow portion in width and are respectively connected to one end and the other end of the narrow portion, a gate insulating film which is formed on a side surface of the narrow portion, and a gate electrode formed on the gate insulating film. The impurity concentration of the semiconductor substrate directly below the narrow portion is higher than the impurity concentration of the narrow portion, and the impurity concentration of the semiconductor substrate directly below the narrow portion is higher than the impurity concentration of the semiconductor substrate directly below the wide portion.

Abstract: According to an embodiment, a semiconductor circuit includes a substrate, a tunnel oxide film, a charge storage film, a blocking layer, and plural nodes. The substrate is made of a semiconductor in which two diffusion layers each serving as either a source or a drain are formed. The tunnel oxide film is formed on a region of the substrate between the diffusion layers. The charge storage film is formed on the tunnel oxide layer and stores charge. The blocking layer is formed between the charge storage film and a gate electrode and has layers of a first oxide film, a nitride film and a second oxide film to have a thickness of 5 nm or larger but 15 nm or smaller. The nodes allow external application of voltages so that the source and the drain are reversed and allow detection a gate voltage, a drain current and a substrate current.

Abstract: According to an embodiment, a semiconductor storage device includes a first storage unit, a read control unit, a second storage unit, and a write control unit. The first storage unit is configured to store data supplied from a host device. The read control unit is configured to perform control of reading the data in accordance with a read request. The second storage unit is configured to store a logical address used for reading the data from the first storage unit by the read control unit. The write control unit is configured to perform control of adding the stored logical address to the data and write the resulting data into the first storage unit in a case where a size of the data requested to be written into the first storage unit by the host device is smaller than a threshold.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array including blocks, each block being capable of executing a write, read, or erase operation independently of other blocks. A control portion is configured to execute the operation of a first block among the blocks in a first cycle, set a selection inhibited region within a range of a predetermined distance from the first block, until a temperature relaxation time for relaxing a temperature of the first block has elapsed, set a region except the selection inhibited region among the blocks as a second block, and execute the operation of the second block in a second cycle.

Abstract: According to an embodiment, an error correction device includes first calculators, second calculators, estimators, and an inverter. Each first calculator calculates a first message representing a probability that 1-bit data that is input in a corresponding variable node is 1, Each second calculator calculates a second message representing a probability that a value of the data input to the variable node is 1 for each of two or more variable nodes connected to the check node by using the first, messages of the variable nodes connected to the check node. Each estimator estimates a true value of the data input to the variable node to generate an estimated value by using the first and second messages. The inverter inverts the estimated value associated with at least one of the variable nodes with a probability higher than 0 and lower than 1.

Abstract: A semiconductor device according to embodiments includes a semiconductor substrate, a buried insulating layer which is formed on the semiconductor substrate, a semiconductor layer which is formed on the buried insulating layer and includes a narrow portion and two wide portions which are larger than the narrow portion in width and are respectively connected to one end and the other end of the narrow portion, a gate insulating film which is formed on a side surface of the narrow portion, and a gate electrode formed on the gate insulating film. The impurity concentration of the semiconductor substrate directly below the narrow portion is higher than the impurity concentration of the narrow portion, and the impurity concentration of the semiconductor substrate directly below the narrow portion is higher than the impurity concentration of the semiconductor substrate directly below the wide portion.

Abstract: A color unit is disclosed in which is included in an imaging device. The color unit includes; a first p-type electrode layer disposed on a light receiving side of the color unit, and including a light-absorptive organic material which selectively absorbs a wavelength other than a desired wavelength in a visible light band of the electromagnetic spectrum, a second p-type electrode layer disposed under the first p-type electrode layer and including a light-absorptive organic material which absorbs a desired wavelength and an n-type electrode layer disposed under the second p-type electrode layer and including an organic material, wherein photoelectric conversion is performed through a p-n junction between the second p-type electrode layer and the n-type electrode layer and light of the desired wavelength is converted into electrical current.

Abstract: A wireless communications network includes a first base station system that performs wireless communications according to a first protocol (e.g., 1xEV-DO protocol) and a second base station system that performs wireless communications according to a second, different protocol (e.g., IS-2000). A link is provided between the first and second base station systems to enable a network-initiated handoff procedure. If a source base station system detects that a handoff of a mobile station to a target base station system is required, the source base station system exchanges messaging over the link with the target base station system to perform the handoff. In one example, the handoff is a hard handoff.

Abstract: A color unit is disclosed in which is included in an imaging device. The color unit includes; a first p-type electrode layer disposed on a light receiving side of the color unit, and including a light-absorptive organic material which selectively absorbs a wavelength other than a desired wavelength in a visible light band of the electromagnetic spectrum, a second p-type electrode layer disposed under the first p-type electrode layer and including a light-absorptive organic material which absorbs a desired wavelength and an n-type electrode layer disposed under the second p-type electrode layer and including an organic material, wherein photoelectric conversion is performed through a p-n junction between the second p-type electrode layer and the n-type electrode layer and light of the desired wavelength is converted into electrical current.