Patents by Inventor Yusuke Hirabayashi

Yusuke Hirabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220028700
    Abstract: A gallium oxide substrate includes first and second main surfaces. When measured data z0(r,?) of height differences of points (r,?,z) on the first main surface from a least square plane of the first main surface are approximated by a function z(r,?)=?anmznm(r,?), a ratio of a first maximum height difference of a component of z(r,?) obtained by summing terms anmznm(r,?) with an index j of 4, 9, 16, 25, 36, 49, 64, and 81, when the second main surface is placed facing a horizontal flat surface, to a diameter of the first main surface is 0.39×10?4 or less, and a ratio of a second maximum height difference of a component of z(r,?) obtained by summing terms anmznm(r,?) with j of from 4 to 81, when an entire surface of the second main surface is adsorbed to a flat chuck surface, to the diameter is 0.59×10?4 or less.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: AGC Inc.
    Inventor: Yusuke HIRABAYASHI
  • Publication number: 20220002589
    Abstract: A method of manufacturing a gallium oxide substrate includes polishing the gallium oxide substrate with a polishing slurry, wherein the polishing slurry contains manganese dioxide particles and water.
    Type: Application
    Filed: September 21, 2021
    Publication date: January 6, 2022
    Applicant: AGC Inc.
    Inventor: Yusuke Hirabayashi
  • Patent number: 10948814
    Abstract: In a substrate for use as a mask blank including a first main surface, a normal region, a frame-shaped region and inner region are present on the first main surface. The frame-shaped region includes first to fourth corner region and first to fourth middle region. The inner region has a flatness of 100 nm or less, the flatness being determined on the basis of a least-squares plane PP1 of the normal region. When one of the corner regions is referred to as an n-th corner region and two middle regions nearest to the n-th corner region are respectively referred to as a first near middle region and a second near middle region, the specific relationship regarding the surface profile is satisfied in the n-th corner region and the first and second near middle regions.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 16, 2021
    Assignee: AGC Inc.
    Inventors: Nobuhiko Ikenoya, Yusuke Hirabayashi
  • Patent number: 10241392
    Abstract: A glass substrate for a mask blank includes two main surfaces facing each other and surfaces to be chamfered. The surfaces to be chamfered are provided peripherally around the two main surfaces. A flatness of one of the main surfaces is 100 nm or less. On the surface to be chamfered from which substrate corner parts are excluded, each of the substrate corner part being portions where a distance from an outer end of a two-dimensional projection profile of the one of the main surfaces and the surface to be chamfered is within 10 mm, a waviness measured in a range of 2 mm at an arbitrary part in a direction parallel to one side closest to the surface to be chamfered in the two-dimensional projection profile is 50 nm or less.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: March 26, 2019
    Assignee: AGC Inc.
    Inventors: Yusuke Hirabayashi, Yuzo Okamura, Naohiro Umeo
  • Patent number: 10222689
    Abstract: A mask blank includes a glass substrate including a first main surface and a second main surface, an absorbing film formed above the first main surface, and a conductive film formed on the second main surface. A reflective film is provided between the absorbing film and the glass substrate. In a surface of the conductive film on an opposite side to the glass substrate, when a surface shape of a square central area having a length of 142 mm and a width of 142 mm excluding a four-sided frame-shaped peripheral area thereof is expressed by the specific formula, flatness of a component obtained by summing all aklPk(x)Pl(y) with the sum of k and l being 3 or more and 25 or less is 20 nm or less.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: March 5, 2019
    Assignee: AGC Inc.
    Inventors: Yuzo Okamura, Yusuke Hirabayashi
  • Patent number: 10146126
    Abstract: A glass substrate for a mask blank includes a rectangular-shaped main surface on which a film having a circuit pattern is to be formed. The main surface includes a quadrangular peripheral frame and a square-shaped center area defined by excluding the frame. The center area has a longitudinal length of 142 mm and a lateral length of 142 mm. A surface morphology of the center area is expressed by the following formulas. A flatness of a sum of compositing all of aklPk(x)Pl(y) is less than or equal to 20 nm when a sum of k and l is greater than or equal to 3 and less than or equal to 9. The flatness is less than or equal to 20 nm when a sum of k and l is greater than or equal to 10 and less than or equal to 30.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: December 4, 2018
    Assignee: AGC Inc.
    Inventors: Yusuke Hirabayashi, Yuzo Okamura, Nobuhiko Ikenoya
  • Patent number: 10146125
    Abstract: A glass substrate for a mask blank includes a rectangular-shaped main surface on which a film having a circuit pattern is to be formed. The main surface includes a quadrangular peripheral frame and a square-shaped center area defined by excluding the frame. The center area has a longitudinal length of 142 mm and a lateral length of 142 mm. A surface morphology of the center area is expressed by { z ? ( x , y ) = ? k = 0 N 1 ? ? l = 0 N 2 ? a kl ? P k ? ( x ) ? P l ? ( y ) P k ? ( x ) = 1 2 k ? k ! ? d k dx k ? [ ( x 2 - 1 ) k ] P l ? ( y ) = 1 2 l ? l ! ? d l dy l ? [ ( y 2 - 1 ) l ] . A flatness of a sum of compositing all of aklPk(x)Pl(y) is less than or equal to 20 nm when a sum of k and l is greater than or equal to 3 and less than or equal to 9. The flatness is less than or equal to 20 nm when a sum of k and l is greater than or equal to 10 and less than or equal to 30.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: December 4, 2018
    Assignee: AGC Inc.
    Inventors: Yusuke Hirabayashi, Yuzo Okamura, Nobuhiko Ikenoya
  • Publication number: 20180239236
    Abstract: A mask blank includes a glass substrate including a first main surface and a second main surface, an absorbing film formed above the first main surface, and a conductive film formed on the second main surface. A reflective film is provided between the absorbing film and the glass substrate. In a surface of the conductive film on an opposite side to the glass substrate, when a surface shape of a square central area having a length of 142 mm and a width of 142 mm excluding a four-sided frame-shaped peripheral area thereof is expressed by the specific formula, flatness of a component obtained by summing all aklPk(x)Pl(y) with the sum of k and l being 3 or more and 25 or less is 20 nm or less.
    Type: Application
    Filed: February 15, 2018
    Publication date: August 23, 2018
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Yuzo Okamura, Yusuke Hirabayashi
  • Publication number: 20180149964
    Abstract: A glass substrate for a mask blank includes a rectangular-shaped main surface on which a film having a circuit pattern is to be formed. The main surface includes a quadrangular peripheral frame and a square-shaped center area defined by excluding the frame. The center area has a longitudinal length of 142 mm and a lateral length of 142 mm. A surface morphology of the center area is expressed by the following formulas. A flatness of a sum of compositing all of aklPk(x)Pl(y) is less than or equal to 20 nm when a sum of k and l is greater than or equal to 3 and less than or equal to 9. The flatness is less than or equal to 20 nm when a sum of k and l is greater than or equal to 10 and less than or equal to 30.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Yusuke HIRABAYASHI, Yuzo Okamura, Nobuhiko Ikenoya
  • Publication number: 20170277034
    Abstract: In a substrate for use as a mask blank including a first main surface, a normal region, a frame-shaped region and inner region are present on the first main surface. The frame-shaped region includes first to fourth corner region and first to fourth middle region. The inner region has a flatness of 100 nm or less, the flatness being determined on the basis of a least-squares plane PP1 of the normal region. When one of the corner regions is referred to as an n-th corner region and two middle regions nearest to the n-th corner region are respectively referred to as a first near middle region and a second near middle region, the specific relationship regarding the surface profile is satisfied in the n-th corner region and the first and second near middle regions.
    Type: Application
    Filed: March 23, 2017
    Publication date: September 28, 2017
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Nobuhiko IKENOYA, Yusuke HIRABAYASHI
  • Patent number: 9684232
    Abstract: A glass substrate for a mask blank has a rectangular planar shape. In four square regions each positioned at each corner of a first region (quality assurance region) and having one side of 8 mm, an angle between a least square plane in each the square region and that in the first region is 3.0 ?ad or less, and a PV value relative to the least square plane is 30 nm or less. In four strip regions each positioned in an area between one side of the first region and 8 mm inside the side and excluding the square regions, an angle between a least square plane in each the strip region and that in the first region is 1.5 ?ad or less, and a PV value relative to the least square plane is 15 nm or less.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: June 20, 2017
    Assignee: ASAHI GLASS COMPANY, LIMITED
    Inventor: Yusuke Hirabayashi
  • Publication number: 20170090277
    Abstract: A glass substrate for a mask blank includes a rectangular-shaped main surface on which a film having a circuit pattern is to be formed. The main surface includes a quadrangular peripheral frame and a square-shaped center area defined by excluding the frame. The center area has a longitudinal length of 142 mm and a lateral length of 142 mm. A surface morphology of the center area is expressed by { z ? ( x , y ) = ? k = 0 N 1 ? ? l = 0 N 2 ? a kl ? P k ? ( x ) ? P l ? ( y ) P k ? ( x ) = 1 2 k ? k ! ? d k dx k ? [ ( x 2 - 1 ) k ] P l ? ( y ) = 1 2 l ? l ! ? d l dy l ? [ ( y 2 - 1 ) l ] . A flatness of a sum of compositing all of aklPk(x)Pl(y) is less than or equal to 20 nm when a sum of k and l is greater than or equal to 3 and less than or equal to 9. The flatness is less than or equal to 20 nm when a sum of k and l is greater than or equal to 10 and less than or equal to 30.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 30, 2017
    Applicant: Asahi Glass Company, Limited
    Inventors: Yusuke HIRABAYASHI, Yuzo OKAMURA, Nobuhiko IKENOYA
  • Publication number: 20160209742
    Abstract: A glass substrate for a mask blank includes two main surfaces facing each other and surfaces to be chamfered. The surfaces to be chamfered are provided peripherally around the two main surfaces. A flatness of one of the main surfaces is 100 nm or less. On the surface to be chamfered from which substrate corner parts are excluded, each of the substrate corner part being portions where a distance from an outer end of a two-dimensional projection profile of the one of the main surfaces and the surface to be chamfered is within 10 mm, a waviness measured in a range of 2 mm at an arbitrary part in a direction parallel to one side closest to the surface to be chamfered in the two-dimensional projection profile is 50 nm or less.
    Type: Application
    Filed: January 6, 2016
    Publication date: July 21, 2016
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Yusuke Hirabayashi, Yuzo Okamura, Naohiro Umeo
  • Publication number: 20160168020
    Abstract: The present invention relates to a method of finishing a pre-polished TiO2—SiO2 glass substrate, containing a step of measuring a striae-originated MSFR (MSFR0) of a major surface, a step of measuring a TiO2 concentration distribution (?TiO2) in the major surface, a first and second processing steps of processing the major surface, and a cleaning step of cleaning the major surface, in which according to the MSFR0 (nm) and the ?TiO2 (wt %), the total etching amount (nm) of a chemical etching amount of the major surface in the second processing step and another chemical etching amount of the major surface in the cleaning step is controlled to satisfy the following expression (1) Total etching amount?(10 nm?MSFR0)v/A/?TiO2 ??(1) (v is an average etching rate (nm/sec) and A is an TiO2 concentration dependency (nm/sec/wt %) of an etching rate).
    Type: Application
    Filed: December 1, 2015
    Publication date: June 16, 2016
    Applicant: Asahi Glass Company, Limited
    Inventors: Yuzo OKAMURA, Yusuke HIRABAYASHI, Yoshiaki IKUTA
  • Publication number: 20160041461
    Abstract: A glass substrate for a mask blank has a rectangular planar shape. In four square regions each positioned at each corner of a first region (quality assurance region) and having one side of 8 mm, an angle between a least square plane in each the square region and that in the first region is 3.0 ?ad or less, and a PV value relative to the least square plane is 30 nm or less. In four strip regions each positioned in an area between one side of the first region and 8 mm inside the side and excluding the square regions, an angle between a least square plane in each the strip region and that in the first region is 1.5 ?ad or less, and a PV value relative to the least square plane is 15 nm or less.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 11, 2016
    Applicant: Asahi Glass Company, Limited
    Inventor: Yusuke HIRABAYASHI
  • Patent number: 8113065
    Abstract: A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: February 14, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Takeshi Ohsato, Shigenori Yasuie, Yusuke Hirabayashi, Hiroshi Yokobayashi
  • Patent number: 7938028
    Abstract: A force sensor comprises a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device comprises an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: May 10, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
  • Patent number: 7757571
    Abstract: A force sensor with a force sensor chip, and a buffering device for dampening and applying incoming external force to the force sensor chip. The buffering device includes an input portion to which external force is input, a sensor mount for fixing the force sensor chip to the exterior, a dampening mechanism for dampening external force, and a transmission portion for transmitting the dampened external force to the active sensing portion.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: July 20, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yusuke Hirabayashi, Takeshi Ohsato, Nobuhiro Sakurai, Shigenori Yasuie, Hiroshi Yokobayashi
  • Publication number: 20090320610
    Abstract: A force sensor 1 includes: a force sensor chip 2 including an action portion 21, a connecting portion 23 on which strain resistive elements are disposed, and a support portion 22 for supporting the action portion 21 and the connecting portion 23; an attenuator 3 including an input portion 30 to which an external force is input, a fixing portion 32 for fixing the force sensor chip 2, and a transmission portion 31 for attenuating the external force and transmitting the attenuated external force to the action portion 21; a first glass member 11 disposed between the action portion 21 and the transmission portion 31 and a second glass member 12 disposed between the support portion 22 and the fixing portion 32, through which glass members 11, 12 the force sensor chip 2 and the attenuator 3 are joined. A single or more glass beams 13 joins the first glass member 11 and the second glass member 12 together as a single member.
    Type: Application
    Filed: August 24, 2007
    Publication date: December 31, 2009
    Inventors: Takeshi Ohsato, Shigenori Yasuie, Yusuke Hirabayashi, Hiroshi Yakobayashi
  • Patent number: 7637174
    Abstract: A force sensor including a force sensor chip and a shock absorbing device that has a damping mechanism is disclosed. The damping mechanism is disc-shaped and has an annular groove formed in at least a front surface so as to dampen external force. The damping force is adjusted by varying the depth of the groove.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: December 29, 2009
    Assignee: Honda Motor Co., Ltd.
    Inventor: Yusuke Hirabayashi