Patents by Inventor Yusuke Iizuka

Yusuke Iizuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8617788
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, wherein when a film having a film thickness of 100 nm is formed from the actinic ray-sensitive or radiation-sensitive resin composition, the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm, and a pattern forming method using the composition are provided.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: December 31, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Takayuki Kato, Hiroshi Saegusa, Kaoru Iwato, Shuji Hirano, Yusuke Iizuka, Shuhei Yamaguchi, Akinori Shibuya
  • Publication number: 20130130178
    Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (B) containing at least either a fluorine atom or a silicon atom, the resin (B) containing any of repeating units of general formulae (I-1) and (I-2) below: Wherein each of R1s independently represents a hydrogen atom, an alkyl group or a halogen atom, X1 represents a bivalent organic group, X2 represents a single bond or a bivalent organic group, each of Ar1s independently represents a monovalent aromatic ring group, Ar2 represents a bivalent aromatic ring group, and each of L's independently represents a single bond or a bivalent organic group.
    Type: Application
    Filed: August 26, 2011
    Publication date: May 23, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Yusuke Iizuka, Akinori Shibuya
  • Publication number: 20130115557
    Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including (A) a compound that when exposed to actinic rays or radiation, generates an acid, (B) a resin that when acted on by an acid, increases its rate of dissolution in an alkali developer, and (C) a hydrophobic resin, wherein the hydrophobic resin (C) contains a repeating unit derived from any of monomers of general formula (1) below.
    Type: Application
    Filed: September 28, 2011
    Publication date: May 9, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuhei Yamaguchi, Akinori Shibuya, Yusuke Iizuka
  • Publication number: 20130095429
    Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition that simultaneously achieves excellent developability and excellent immersion-liquid tracking properties, and a method of forming a pattern using the same. The composition contains a resin (B) containing at least either a fluorine atom or a silicon atom, the resin (B) containing any of repeating units of general formula (I) below.
    Type: Application
    Filed: July 7, 2011
    Publication date: April 18, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Yusuke Iizuka, Akinori Shibuya, Hidenori Takahashi, Toshiaki Fukuhara, Kousuke Koshijima
  • Patent number: 8362170
    Abstract: Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): wherein the variables in the formulae are defined in the specification.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: January 29, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Hirano, Kaoru Iwato, Hiroshi Saegusa, Yusuke Iizuka
  • Publication number: 20130004740
    Abstract: An actinic-ray-sensitive or radiation-sensitive resin composition which is capable of improving line edge roughness (LER) and inhibiting pattern collapse, a resist film and a pattern forming method each using the same, a method for preparing an electronic device, and an electronic device are provided. The actinic-ray-sensitive or radiation-sensitive resin composition contains: (A) a resin having repeating units having a structure represented by any one of the following general formulae (I-1) to (I-3), and repeating units containing at least one selected from the group consisting of a lactone structure, a sultone structure, and a cyano group; and (B) a compound that generates an acid by irradiation with actinic rays or radiations.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Shohei KATAOKA, Yusuke IIZUKA, Akinori SHIBUYA, Tomoki MATSUDA, Naohiro TANGO
  • Publication number: 20120271021
    Abstract: Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): wherein the variables in the formulae are defined in the specification.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 25, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji HIRANO, Kaoru IWATO, Hiroshi SAEGUSA, Yusuke IIZUKA
  • Publication number: 20120251948
    Abstract: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains (A) a resin capable of increasing the solubility in an alkaline developer by the action of an acid, and (C) at least one selected from the group of compounds represented by the following formula (ZI-3), (ZI-4) or (ZI-5) and capable of generating an acid upon irradiation of actinic rays or radiation, wherein the resin (A) contains at least one repeating unit having a group capable of decomposing by the action of an acid to leave a leaving group having a ring structure, and the leaving group having a ring structure has at least one of a polar group as a substituent and a polar atom as a part of the ring structure, and a compound derived from the leaving group having a ring structure has a log P value of not less than 0 and less than 2.8.
    Type: Application
    Filed: March 27, 2012
    Publication date: October 4, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Yusuke IIZUKA, Akinori SHIBUYA, Naohiro TANGO, Shohei KATAOKA
  • Patent number: 8252877
    Abstract: Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): wherein the variables in the formulae are defined in the specification.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: August 28, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Hirano, Kaoru Iwato, Hiroshi Saegusa, Yusuke Iizuka
  • Publication number: 20120171618
    Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a resin containing a repeating unit (A) containing both a structural moiety (S1) that is decomposed by an action of an acid to thereby generate an alkali-soluble group and a structural moiety (S2) that is decomposed by an action of an alkali developer to thereby increase its rate of dissolution into the alkali developer, and a compound that generates an acid when exposed to actinic rays or radiation.
    Type: Application
    Filed: March 15, 2012
    Publication date: July 5, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Yusuke IIZUKA, Hidenori TAKAHASHI, Michihiro SHIRAKAWA, Masahiro YOSHIDOME, Shuji HIRANO
  • Publication number: 20120164573
    Abstract: An actinic-ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent critical dimension uniformity (CDU) in the line width, and a pattern forming method using the same are provided. The actinic-ray-sensitive or radiation-sensitive resin composition of the present invention includes (A) a resin containing a repeating unit having a specific lactone structure and a repeating unit having a specific monocyclic alicyclic structure, which increases a solubility in an alkaline developer by the action of an acid, and (B) a compound having a specific structure, which generates an acid upon irradiation with an actinic-ray or a radiation.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 28, 2012
    Applicant: FUJIFILM Corporation
    Inventors: Naohiro Tango, Yusuke Iizuka, Akinori Shibuya, Shuhei Yamaguchi, Shohei Kataoka
  • Publication number: 20120076996
    Abstract: Provided is a resist composition, including (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, the compound being any of those of general formulae (I) and (II) below, (C) a resin containing at least either a fluorine atom or a silicon atom, and (D) a mixed solvent containing a first solvent and a second solvent, at least either the first solvent or the second solvent exhibiting a normal boiling point of 200° C. or higher.
    Type: Application
    Filed: September 27, 2011
    Publication date: March 29, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Kei YAMAMOTO, Yusuke IIZUKA, Akinori SHIBUYA, Shuhei YAMAGUCHI
  • Publication number: 20120015301
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin capable of increasing the solubility in an alkali developer by the action of an acid, the resin containing (a) a repeating unit represented by the following formula (AN-01), (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin that contains at least either a fluorine atom or a silicon atom and contains a repeating unit having a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer: wherein the variables in formula (AN-01) are defined in the description.
    Type: Application
    Filed: March 31, 2010
    Publication date: January 19, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Masahiro Yoshidome, Shuji Hirano, Hiroshi Saegusa, Kaoru Iwato, Yusuke Iizuka
  • Publication number: 20120009522
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, wherein when a film having a film thickness of 100 nm is formed from the actinic ray-sensitive or radiation-sensitive resin composition, the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm, and a pattern forming method using the composition are provided.
    Type: Application
    Filed: March 30, 2010
    Publication date: January 12, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Takayuki Kato, Hiroshi Saegusa, Kaoru Iwato, Shuji Hirano, Yusuke Iizuka, Shuhei Yamaguchi, Akinori Shibuya
  • Publication number: 20110318687
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin capable of increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin which contains (c) a repeating unit having at least one polarity conversion group and has at least either a fluorine atom or a silicon atom.
    Type: Application
    Filed: December 11, 2009
    Publication date: December 29, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Hiroshi Saegusa, Kaoru Iwato, Shuji Hirano, Yusuke Iizuka
  • Publication number: 20110236828
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, includes: (A) a resin capable of increasing the solubility of the resin (A) in an alkali developer by the action of an acid; and (C) a resin having at least either a fluorine atom or a silicon atom and containing (c) a repeating unit having at least two or more polarity conversion groups.
    Type: Application
    Filed: December 11, 2009
    Publication date: September 29, 2011
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji Hirano, Kaoru Iwato, Hiroshi Saegusa, Yusuke Iizuka
  • Patent number: 7955780
    Abstract: Provided is a positive resist composition using a resin having, in the polymer main chain, a specific acid decomposable structure and further having, in the side chain thereof, several specific acid decomposable groups, satisfactory in an exposure latitude, a focus latitude, and pattern collapse prevention at a high level, and having reduced development defects; and a pattern forming method.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: June 7, 2011
    Assignee: Fujifilm Corporation
    Inventors: Takayuki Kato, Akinori Shibuya, Yusuke Iizuka
  • Publication number: 20110091809
    Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes (A) a resin that when acted on by an acid, increases its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, and (C) a resin containing at least one group selected from among the following groups (x) to (z) and further containing at least either a fluorine atom or a silicon atom, in which three or more polymer chains are contained through at least one branch point, (x) an alkali-soluble group, (y) a group that when acted on by an alkali developer, is decomposed to thereby increase its solubility in the alkali developer, and (z) a group that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.
    Type: Application
    Filed: October 15, 2010
    Publication date: April 21, 2011
    Applicant: FUJIFILM Corporation
    Inventors: Hiroshi Saegusa, Kaoru Iwato, Yusuke Iizuka, Kousuke Koshijima
  • Publication number: 20100203451
    Abstract: Provided is a positive resist composition using a resin having, in the polymer main chain, a specific acid decomposable structure and further having, in the side chain thereof, several specific acid decomposable groups, satisfactory in an exposure latitude, a focus latitude, and pattern collapse prevention at a high level, and having reduced development defects; and a pattern forming method.
    Type: Application
    Filed: July 10, 2008
    Publication date: August 12, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Takayuki Kato, Akinori Shibuya, Yusuke Iizuka
  • Publication number: 20100152401
    Abstract: Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): wherein the variables in the formulae are defined in the specification.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 17, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji HIRANO, Kaoru IWATO, Hiroshi SAEGUSA, Yusuke IIZUKA