Abstract: Provided is a cargo-handling vehicle allowing a reduction in production cost. A forklift, which is a cargo-handling vehicle, includes a driver's seat in which an operator sits, a front guard 51 provided in front of the driver's seat, a control system 20 provided between the driver's seat and the front guard 51, and a front cover 40 attached to the front guard 51. The front cover 40 includes a center cover 41 concealing a base portion of the control system 20, and a side cover 42 not concealing the base portion of the control system 20, and the side cover 42 is provided to the right or left, or both, of the center cover 41 and has a top positioned lower than a top of the center cover 41.

Abstract: A condensed heterocyclic compound has a sepiapterin reductase inhibitory action and is particularly useful for treatment of a pain. The condensed heterocyclic compound represented by Formula (I) below (R1 represents a hydrocarbon group or the like; R2 and R3 represent a hydrogen atom or the like; R4, X, and Y represent defined substituents), a tautomer or a pharmaceutically acceptable salt of the compound, or a solvate of any of these.

Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

Abstract: An optical device includes: a case; a wiring substrate that passes through the case and that includes an insulating member and a conductor; at least one of components including a first component configured to perform at least one of: outputting a light; receiving a light; and varying optical properties, and a second component configured to electrically control the first component, the at least one of components being housed in the case and flip-chip mounted on the wiring substrate.

Abstract: A light source includes: a seed light source configured to output incoherent seed light with a predetermined bandwidth; and a booster amplifier that is a semiconductor optical amplifier configured to optically amplify the seed light input from a first facet, and output the amplified seed light as amplified light from a second facet, wherein the first facet and the second facet of the booster amplifier are subjected to a reflection reduction treatment, the booster amplifier is configured to operate in a gain saturated state, and relative intensity noise (RIN) and ripple are simultaneously suppressed in the amplified light.

Abstract: A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.

Abstract: An optical device includes: a base including a mounting surface; and an optical component including an optical element part, a support part including a first adhered surface bonded to the mounting surface via a photocurable first adhesive, the support part being configured to support the optical element part, and an optical opening part provided adjacent to the first adhered surface, the optical opening part allowing light for curing the first adhesive to pass through.

Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.

Abstract: Provided is a cargo-handling vehicle allowing a reduction in production cost. A forklift, which is a cargo-handling vehicle, includes a driver's seat in which an operator sits, a front guard 51 provided in front of the driver's seat, a control system 20 provided between the driver's seat and the front guard 51, and a front cover 40 attached to the front guard 51. The front cover 40 includes a center cover 41 concealing a base portion of the control system 20, and a side cover 42 not concealing the base portion of the control system 20, and the side cover 42 is provided to the right or left, or both, of the center cover 41 and has a top positioned lower than a top of the center cover 41.

Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.

Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

Abstract: An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

Abstract: An optical module includes: an optical functional element outputting a first light beam; a first optical part receiving the first light beam, having a predetermined effect on the first light beam, and outputting the affected first light beam as a second light beam; a second optical part receiving the second light beam, having a predetermined effect on the second light beam, outputting the affected second light beam as a third light beam, and reflecting a reflected light beam in a direction not coupled to the first optical part, the reflected light beam being generated from the second light on an incident surface on which the second light beam is incident; a housing accommodating the optical functional element, the first optical part, and the second optical part; and an optical attenuator provided inside the housing and attenuating power of the reflected light beam incident on the optical attenuator.

Abstract: An optical module includes: a base having a predetermined product of a coefficient of linear expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warpage suppression component, which is mounted on a surface of the planar lightwave circuit element, the surface being on a side opposite to a side where the planar lightwave circuit element is mounted on the base, having a product of a coefficient of linear expansion and a Young's modulus that reduces warpage of the planar lightwave circuit element in accordance with warpage of the base depending on temperature change.

Abstract: An optical module includes: an optical element; and a thermoelectric module on which the optical element is mounted. Further, the thermoelectric module includes a first substrate, a second substrate disposed to face the first substrate, and a plurality of thermoelectric elements provided between the first substrate and the second substrate, and a pattern made of a material different from a material of the first substrate is formed on a surface of the first substrate opposite to a back surface of the first substrate facing the second substrate, and the optical element is mounted on the surface of the first substrate in association with the pattern.

Abstract: An optical module includes: at least one optical element; a housing main body that houses therein the at least one optical element; and a plurality of lead pins that are provided to a side wall of the housing main body. Further, at least one of the lead pins is electrically connected to the at least one optical element, and the lead pins are lined up in a plurality of rows along a height direction of the side wall, and are arranged in such a manner that adjacent lead pins do not overlap each other in a top view.

Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.

Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.