Patents by Inventor Yusuke ISHIYAMA

Yusuke ISHIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160099224
    Abstract: A semiconductor device according to the present invention includes an insulating substrate having a circuit pattern, semiconductor elements bonded on the circuit pattern with a brazing material, and a wiring terminal bonded with a brazing material on an electrode provided on each of the semiconductor elements on an opposite side of the circuit pattern, in which a part of the wiring terminal is in contact with the insulating substrate, and insulated from the circuit pattern.
    Type: Application
    Filed: June 29, 2015
    Publication date: April 7, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Naoki YOSHIMATSU, Yusuke ISHIYAMA, Taketoshi SHIKANO, Yuji IMOTO, Junji FUJINO, Shinsuke ASADA