Abstract: Methods, systems, and devices for system and method for reading and writing memory management data through a non-volatile cell based register are described. A memory device may include a set of latch units addressable via a set of row lines and a set of column lines. Each latch unit may include a sense amplifier coupled with a first line and a first non-volatile capacitor coupled with the first line and a second line, where the first capacitor is configured to store a charge representing one or more bits. Additionally, each latch unit may include a second capacitor coupled with the first line and a third line, where the second capacitor is configured to amplify a voltage at the first line based on the charge stored in the first capacitor.

Abstract: A drive device including: a motor; a transmission device including a reduction gear; a housing; an electric oil pump; and a control unit including a motor control unit and an electric oil pump control unit. The electric oil pump control unit includes: control mode switching means that, in oil supply processing, switches between and executes a normal control mode in which the output of the electric oil pump is changed in a plurality of stages according to the temperature of the stator or the rotor, and a startup mode in which the electric oil pump is operated at a maximum output in the normal control mode for a predetermined time at the start of power supply; and pump driving means that operates the electric oil pump.

Abstract: Methods, systems, and devices for reading and writing memory management data using a non-volatile cell based register are described. A memory device may include a set of latch units addressable via a set of row lines and a set of column lines. Each latch unit may include a sense amplifier coupled with a first line and a first non-volatile capacitor coupled with the first line and a second line, where the first capacitor is configured to store a charge representing one or more bits. Additionally, each latch unit may include a second capacitor coupled with the first line and a third line, where the second capacitor is configured to amplify a voltage at the first line based on the charge stored in the first capacitor.

Abstract: Methods, systems, and devices for system and method for reading and writing memory management data through a non-volatile cell based register are described. A memory device may include a set of latch units addressable via a set of row lines and a set of column lines. Each latch unit may include a sense amplifier coupled with a first line and a first non-volatile capacitor coupled with the first line and a second line, where the first capacitor is configured to store a charge representing one or more bits. Additionally, each latch unit may include a second capacitor coupled with the first line and a third line, where the second capacitor is configured to amplify a voltage at the first line based on the charge stored in the first capacitor.

Abstract: A device including a memory cell including a variable resistive memory element; a capacitor; a voltage generation circuit; and a switch circuit including a first switch and a second switch. The first switch is coupled between the voltage generation circuit and the capacitor without an intervention of the second switch. The second switch is coupled between the capacitor and the memory cell without an intervention of the first switch. The first switch is configured to take an on-state during a first period of time and an off-state during a second period of time following the first period of time and the second switch is configured to take an off-state during the first period of time and an on-state during the second period of time.

Abstract: A semiconductor device includes a memory cell array including a plurality of first and second memory cells each comprising a variable resistance element that establishes an electrical resistance that changes in response to an application of a write voltage after a forming voltage has been applied, the first memory cell to which the forming voltage is applied, and the second memory cell to which the forming voltage is not applied, and the second memory cell being configured to store one of first and second logic values constituting first information, the first and second logic values being different from each other.

Abstract: A semiconductor device includes a memory cell array including a plurality of first and second memory cells each comprising a variable resistance element that establishes an electrical resistance that changes in response to an application of a write voltage after a forming voltage has been applied, the first memory cell to which the forming voltage is applied, and the second memory cell to which the forming voltage is not applied, and the second memory cell being configured to store one of first and second logic values constituting first information, the first and second logic values being different from each other.

Abstract: Disclosed herein is a device that includes: a memory including a variable resistive memory cell including first and second terminals, a variable resistive memory element coupled between the first and second terminals, and a select transistor coupled between the second terminal and a first voltage line; and a capacitor circuit configured to be connected to the first terminal of the variable resistive memory cell when the select transistor is selected to be conductive between the second terminal and the first voltage line, the first terminal of the variable resistive memory cell being increased in voltage by the capacitor circuit to change a resistivity of the variable resistive memory element from a first level to a second level that is smaller than the first level.

Abstract: A phase change memory device comprises: a phase change element for rewritably storing data by changing a resistance state; a memory cell arranged at an intersection of a word line and a bit line and formed of the phase change element and a diode connected in series; a select transistor formed in a diffusion layer below the memory cell, for selectively controlling electric connection between an anode of the diode and a ground line in response to a potential of the word line connected to a gate; and a precharge circuit for precharging the diffusion layer below the memory cell corresponding to a non-selected word line to a predetermined voltage and for disconnecting the diffusion layer below the memory cell corresponding to a selected word line from the predetermined voltage.

Abstract: A phase change memory device comprises: a phase change element for rewritably storing data by changing a resistance state; a memory cell arranged at an intersection of a word line and a bit line and formed of the phase change element and a diode connected in series; a select transistor formed in a diffusion layer below the memory cell, for selectively controlling electric connection between an anode of the diode and a ground line in response to a potential of the word line connected to a gate; and a precharge circuit for precharging the diffusion layer below the memory cell corresponding to a non-selected word line to a predetermined voltage and for disconnecting the diffusion layer below the memory cell corresponding to a selected word line from the predetermined voltage.

Abstract: A nonvolatile memory includes circuits each having first control transistors, memory transistors, second control transistors and memory transistors repeatedly connected in series in sequence. Inversion layers are formed in the direction intersecting the serial direction with turning on of the control transistors. A selection circuit selects a connection of the inversion layer placed under the first control transistor and its corresponding read/write circuit. The control transistors placed on both sides adjacent to the memory transistor are turned on to perform reading. The first control transistors placed on both sides of the second control transistor as viewed from side to side are turned on to perform writing into the other of the right and left memory transistors via one of the right and left memory transistors. The selection circuit connects the read/write circuit and the inversion layer in such a manner that the same read/write circuit is used in reading and writing for the same memory transistor.

Abstract: A nonvolatile memory includes circuits each having first control transistors, memory transistors, second control transistors and memory transistors repeatedly connected in series in sequence. Inversion layers are formed in the direction intersecting the serial direction with turning on of the control transistors. A selection circuit selects a connection of the inversion layer placed under the first control transistor and its corresponding read/write circuit. The control transistors placed on both sides adjacent to the memory transistor are turned on to perform reading. The first control transistors placed on both sides of the second control transistor as viewed from side to side are turned on to perform writing into the other of the right and left memory transistors via one of the right and left memory transistors. The selection circuit connects the read/write circuit and the inversion layer in such a manner that the same read/write circuit is used in reading and writing for the same memory transistor.

Abstract: Using charges accumulated in a capacitance element connected to a drain side node of a memory cell, data is written in accordance with source side injection method. The capacitance value of the capacitance element is changed in accordance with the value of write data. A non-volatile semiconductor memory device allowing writing of multi-valued data at high speed with high precision is achieved.

Abstract: A nonvolatile memory includes circuits each having first control transistors, memory transistors, second control transistors and memory transistors repeatedly connected in series in sequence. Inversion layers are formed in the direction intersecting the serial direction with turning on of the control transistors. A selection circuit selects a connection of the inversion layer placed under the first control transistor and its corresponding read/write circuit. The control transistors placed on both sides adjacent to the memory transistor are turned on to perform reading. The first control transistors placed on both sides of the second control transistor as viewed from side to side are turned on to perform writing into the other of the right and left memory transistors via one of the right and left memory transistors. The selection circuit connects the read/write circuit and the inversion layer in such a manner that the same read/write circuit is used in reading and writing for the same memory transistor.

Abstract: To provide a technique which enables a load on a controller to be reduced by rapidly detecting n-bit errors during writing/erasing on a chip in ECC in a nonvolatile memory. A flash memory of the present invention, which is a nonvolatile memory that includes plural electrically erasable and writable nonvolatile memory cells and performs write-and-verify processing in a write operation on the nonvolatile memory cells, includes an ECC determination circuit that counts the number of bits of write error detected in the write-and-verify processing, and outputs the information, and a status register for holding pass/fail information of the write operation and the information about the number of bits of write error outputted from the ECC determination circuit.

Abstract: Using charges accumulated in a capacitance element connected to a drain side node of a memory cell, data is written in accordance with source side injection method. The capacitance value of the capacitance element is changed in accordance with the value of write data. A non-volatile semiconductor memory device allowing writing of multi-valued data at high speed with high precision is achieved.

Abstract: A nonvolatile memory includes circuits each having first control transistors, memory transistors, second control transistors and memory transistors repeatedly connected in series in sequence. Inversion layers are formed in the direction intersecting the serial direction with turning on of the control transistors. A selection circuit selects a connection of the inversion layer placed under the first control transistor and its corresponding read/write circuit. The control transistors placed on both sides adjacent to the memory transistor are turned on to perform reading. The first control transistors placed on both sides of the second control transistor as viewed from side to side are turned on to perform writing into the other of the right and left memory transistors via one of the right and left memory transistors. The selection circuit connects the read/write circuit and the inversion layer in such a manner that the same read/write circuit is used in reading and writing for the same memory transistor.

Abstract: To provide a technique which enables a load on a controller to be reduced by rapidly detecting n-bit errors during writing/erasing on a chip in ECC in a nonvolatile memory. A flash memory of the present invention, which is a nonvolatile memory that includes plural electrically erasable and writable nonvolatile memory cells and performs write-and-verify processing in a write operation on the nonvolatile memory cells, includes an ECC determination circuit that counts the number of bits of write error detected in the write-and-verify processing, and outputs the information, and a status register for holding pass/fail information of the write operation and the information about the number of bits of write error outputted from the ECC determination circuit.

Abstract: A semiconductor storage device that determines the cause of an error at the time of the error correction of data read out from a non-volatile semiconductor memory, on the basis of a previously recorded error correction count, and selects a data refresh processing or a substitute processing to perform. When the error is detected, the corrected data is rewritten back for preventing reoccurrence of error due to accidental cause. If it is determined that the reoccurrence frequency of the error is high and the error is due to degradation of the storage medium, based on the error correction count, the substitute processing is performed.

Abstract: In the conventional nonvolatile memory, it is not possible to determine the cause of the error is accidental or due to the degradation when the error is detect at the time of data read. Therefore, unnecessary substitute processing is performed, resulting in the exhaustion of the substitute area to shorten the life of the storage device.