Patents by Inventor Yusuke Kubo

Yusuke Kubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186580
    Abstract: Provided is a lithium (N-carbonyl)sulfonamide compound represented by the following Formula (I). In Formula (I), R1 and R2 each represent an alkyl group having from 1 to 10 carbon atoms, an alkenyl group having from 2 to 10 carbon atoms, an alkynyl group having from 2 to 10 carbon atoms, or an aryl group, and L1 and L2 each represent a single bond or —O—, with a proviso that a case in which L1 and L2 are both single bonds are excluded.
    Type: Application
    Filed: February 16, 2022
    Publication date: June 6, 2024
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Teruhiko KUBO, Shigeru MIO, Yusuke SHIMIZU, Yurika OJI, Masahiro SUGURO
  • Publication number: 20240178437
    Abstract: Provided is a nonaqueous secondary battery including: a nonaqueous electrolyte solution that contains a compound (A) represented by the following Formula (I); a positive electrode that contains a positive electrode active material containing a compound (B) represented by the following Formula (II); and a negative electrode. The content of the compound (A) is more than 0% by mass but less than 1.0% by mass with respect to a total amount of the nonaqueous electrolyte solution. In Formula (I), X+ represents a hydrogen ion, a lithium ion, a sodium ion, or a potassium ion. In Formula (II), 0.1?a<1.3, 0.1<(1-b-c)<1.0, 0<b<0.6, and 0<c<0.6.
    Type: Application
    Filed: March 3, 2022
    Publication date: May 30, 2024
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Masahiro SUGURO, Yurika OJI, Yusuke SHIMIZU, Teruhiko KUBO, Shigeru MIO, Hidenobu NOGI
  • Publication number: 20240158199
    Abstract: In a binding discharge process, a binding process is performed on a plurality of sheets positioned at a binding position by repeating a process in which, after a conveyed sheet is conveyed in a reverse direction on a placement portion by a second conveyance portion to cause a downstream end of the sheet to abut an abutment portion, the sheet is moved in a shift direction and positioned at the binding position by a first shifting portion, and the plurality of sheets subjected to the binding process are discharged onto the stacking portion by a discharge portion. In a switchbackless shift discharge process, the conveyed sheet is shifted in the shift direction by the first shifting portion by driving a driving portion without conveying the sheet in the reverse direction by the second conveyance portion, and is discharged onto the stacking portion by the discharge portion.
    Type: Application
    Filed: January 26, 2024
    Publication date: May 16, 2024
    Inventors: Junya NAKAJIMA, Kakeru AOKI, Mamoru KUBO, Yusuke MITSUI
  • Patent number: 11981580
    Abstract: A method for producing a halide includes heat-treating a mixed material in an inert gas atmosphere, the mixed material being a mixture of M2O3, NH4X, and LiZ. The M includes at least one element selected from the group consisting of Y, a lanthanoid, and Sc. The X is at least one element selected from the group consisting of CI, Br, I, and F. The Z is at least one element selected from the group consisting of CI, Br, I, and F.
    Type: Grant
    Filed: May 16, 2021
    Date of Patent: May 14, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takashi Kubo, Yusuke Nishio, Akihiro Sakai, Akinobu Miyazaki
  • Publication number: 20240120254
    Abstract: A thermally-conductive sheet includes: a binder; and an anisotropic thermally-conductive filler. The anisotropic thermally-conductive filler is oriented in a thickness direction of the thermally-conductive sheet An arithmetical mean height Sa is 5 ?m or less and a maximum height Sz is 50 ?m or less on either surface of the thermally-conductive sheet. A dielectric breakdown voltage of the thermally-conductive sheet is 0.5 kV/mm or higher.
    Type: Application
    Filed: February 9, 2022
    Publication date: April 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke ARAMAKI, Yuma SATO, Yusuke KUBO
  • Publication number: 20240117148
    Abstract: A thermally conductive sheet includes a binder resin and boron nitride flakes. The boron nitride flakes are oriented in a thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet are tacky. A method for manufacturing a thermally conductive sheet includes preparing a thermally conductive composition containing a binder resin and boron nitride flakes. A molded block is formed from the thermally conductive composition. The molded block is sliced into a sheet shape to obtain a thermally conductive sheet precursor. The thermally conductive sheet precursor is pressed to obtain a thermally conductive sheet.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke ARAMAKI, Yuma SATO, Yusuke KUBO
  • Publication number: 20240116146
    Abstract: A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.
    Type: Application
    Filed: February 3, 2022
    Publication date: April 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke MUKASA, Yusuke KUBO, Keisuke ARAMAKI
  • Patent number: 11929303
    Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor element 30; a conductive cooling member 40 provided above the semiconductor element 30, a conductive thermally conductive member 10 that is provided between the semiconductor element 30 and the cooling member 40 and contains a cured resin. The conductive thermally conductive member 10 is connected to a ground 60 in the substrate 50 to electrically connect the cooling member 40 and the ground 60.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: March 12, 2024
    Assignee: Dexerials Corporation
    Inventors: Yusuke Kubo, Sergey Bolotov
  • Publication number: 20240076223
    Abstract: An apparatus for producing a glass preform is an apparatus by pulling up a starting rod while the starting rod is rotated around an axis and glass fine particles generated by a burner are deposited in an axial direction of the starting rod. The apparatus for producing a glass preform includes an imaging device that acquires a deposition surface image by imaging a deposition surface of a glass fine particle deposit deposited on the starting rod, and an image processing unit that detects an edge shape of the deposition surface from the deposition surface image acquired using the imaging device to judge quality of the glass fine particle deposit by quantifying a degree of deformation of the edge shape.
    Type: Application
    Filed: March 3, 2022
    Publication date: March 7, 2024
    Inventors: Shinobu HATA, Yusuke KUBO
  • Publication number: 20240010898
    Abstract: Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2, a flaky thermally conductive filler 3, and a non-flaky thermally conductive filler 4, wherein the amount of change between the thermal resistance value at load of 1 kgf/cm2 and the thermal resistance value at load in a range greater than 1 kgf/cm2 and not greater than 3 kgf/cm2 is not greater than 0.4° C.·cm2/W, and the amount of change between the compression rate at load of 3 kgf/cm2 and the compression rate at load of 1 kgf/cm2 is not less than 20%.
    Type: Application
    Filed: August 3, 2021
    Publication date: January 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Yuma SATO, Keisuke ARAMAKI, Yusuke KUBO
  • Publication number: 20230348679
    Abstract: A thermally conductive sheet includes: a binder resin; and a first thermally conductive filler oriented in a thickness direction of the thermally conductive sheet. The thermally conductive sheet has a contact thermal resistance with regard to an adherend of 0.46° C.·cm2/W or less. The first thermally conductive filler is preferably a fibrous thermally conductive filler and/or a flaky thermally conductive filler. The thermally conductive sheet preferably further includes a second thermally conductive filler which is at least one selected from a group consisting of alumina, aluminum, zinc oxide, boron nitride, aluminum nitride, graphite, and a magnetic powder.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 2, 2023
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke ARAMAKI, Yuma SATO, Yusuke KUBO
  • Patent number: 11742258
    Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: August 29, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Yuma Sato, Keisuke Aramaki, Yusuke Kubo
  • Publication number: 20230260989
    Abstract: A semiconductor device includes a semiconductor layer, a first conductor disposed on the semiconductor layer, a second conductor disposed on the semiconductor layer so as to be separated from the first conductor, a relay portion that is formed on the semiconductor layer so as to straddle the first conductor and the second conductor and that is made of a semiconductor having a first conductivity type region and a second conductivity type region, a first contact by which the first conductivity type region and the second conductivity type region are electrically connected to the first conductor, and a second contact that electrically connects the first conductivity type region of the relay portion and the second conductor together and that is insulated from the second conductivity type region.
    Type: Application
    Filed: April 19, 2023
    Publication date: August 17, 2023
    Inventor: Yusuke KUBO
  • Publication number: 20230246103
    Abstract: A semiconductor device includes: a semiconductor substrate including a main surface and a back surface opposite to the main surface; a semiconductor layer including a first surface in contact with the main surface of the semiconductor substrate and a second surface opposite to the first surface, and including a gate trench recessed in the second surface; a split gate structure provided in the gate trench; an insulating layer filling the gate trench and covering the second surface of the semiconductor layer; and a trap level region formed in any one of the semiconductor layer and the semiconductor substrate to trap carriers moving from the semiconductor layer.
    Type: Application
    Filed: December 30, 2022
    Publication date: August 3, 2023
    Applicant: ROHM CO., LTD.
    Inventor: Yusuke KUBO
  • Patent number: 11664369
    Abstract: A semiconductor device includes a semiconductor layer, a first conductor disposed on the semiconductor layer, a second conductor disposed on the semiconductor layer so as to be separated from the first conductor, a relay portion that is formed on the semiconductor layer so as to straddle the first conductor and the second conductor and that is made of a semiconductor having a first conductivity type region and a second conductivity type region, a first contact by which the first conductivity type region and the second conductivity type region are electrically connected to the first conductor, and a second contact that electrically connects the first conductivity type region of the relay portion and the second conductor together and that is insulated from the second conductivity type region.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: May 30, 2023
    Assignee: ROHM CO., LTD.
    Inventor: Yusuke Kubo
  • Publication number: 20230155020
    Abstract: A semiconductor device includes a semiconductor layer having a first surface and a second surface, an element structure formed on the first surface side of the semiconductor layer and including a first conductivity type first region and a second conductivity type second region in contact with the first region, a gate electrode opposing the second region with a gate insulating film therebetween, a first conductivity type third region formed in the semiconductor layer to be in contact with the second region, and a first electrode formed on the semiconductor layer and electrically connected to the first region and the second region, in which the element structure includes a first and a second element structure, the first element structure is separated from the second region in a direction along the first surface of the semiconductor layer, and includes a second conductivity type first column layer extending in a thickness direction.
    Type: Application
    Filed: March 22, 2021
    Publication date: May 18, 2023
    Applicant: ROHM CO., LTD.
    Inventor: Yusuke KUBO
  • Patent number: 11597196
    Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: March 7, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Yusuke Kubo, Keisuke Aramaki
  • Publication number: 20220262702
    Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
    Type: Application
    Filed: April 23, 2021
    Publication date: August 18, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Yuma SATO, Keisuke ARAMAKI, Yusuke KUBO
  • Publication number: 20220240411
    Abstract: A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 ?m at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100?80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 ?m at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.
    Type: Application
    Filed: May 13, 2021
    Publication date: July 28, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke MUKASA, Yusuke Kubo, Keisuke Aramaki
  • Publication number: 20220173494
    Abstract: The disclosure aims at providing an antenna array for 5G communications that has superior thermal dissipation and crosstalk suppression effect. To achieve the above-described object, an antenna array 1 for 5G communications according to the disclosure includes a substrate 10; at least one high-frequency semiconductor device 20, a noise-suppressing thermally conductive sheet 20, and a first thermal dissipation member 41 sequentially formed on one surface 10a of the substrate 10; and at least one antenna 50 and a second thermal dissipation member 42 sequentially formed on the other surface 10b of the substrate 10.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 2, 2022
    Applicant: Dexerials Corporation
    Inventors: Sergey BOLOTOV, Hiroyuki RYOSON, Keisuke ARAMAKI, Yusuke KUBO