Patents by Inventor Yusuke Minagawa
Yusuke Minagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11743603Abstract: A solid-state imaging device adapted to encrypt data is described. The solid-state imaging device may include a sensor die comprising an array of imaging pixels formed on a first side of the sensor die and first wiring layers formed on a second side of the sensor die, wherein at least one of the imaging pixels is configured to generate specific signals; a logic die comprising second wiring layers formed on a first side of the logic die; and an encryption processor on the logic die configured to generate encrypted data using the specific signals. The first side of the logic die may be mounted adjacent to the second side of the sensor die and the first wiring layers electrically connect to the second wiring layers, wherein the at least one of the imaging pixels, the encryption processor, and a connecting conductor in which the specific signals pass through from the at least one of the imaging pixels to the encryption processor are located interior to the solid-state imaging device.Type: GrantFiled: November 29, 2017Date of Patent: August 29, 2023Assignee: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Taishin Yoshida, Marie Toyoshima, Toru Akishita, Tomohiro Morimoto, Masafumi Kusakawa, Ikuhiro Tamura, Takahiro Akahane, Eiji Hirata, Yoshinobu Furusawa
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Patent number: 11689828Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.Type: GrantFiled: January 21, 2022Date of Patent: June 27, 2023Assignee: SONY GROUP CORPORATIONInventors: Yusuke Minagawa, Go Asayama
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Patent number: 11665448Abstract: An information processing apparatus including a specification section specifying, from among a plurality of blocks that are set by dividing pixels included in at least a partial region of a pixel region having a plurality of pixels arrayed therein and each of which includes at least one or more of the pixels, at least one or more of the blocks, and a generation section generating a unique value based on pixel values of the pixels included in the specified blocks.Type: GrantFiled: July 27, 2021Date of Patent: May 30, 2023Assignee: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Toru Akishita
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Patent number: 11544967Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.Type: GrantFiled: June 29, 2021Date of Patent: January 3, 2023Assignees: Sony Semiconductor Solutions Corporation, Sony Group CorporationInventors: Yusuke Minagawa, Go Asayama, Toru Akishita, Hirotake Yamamoto, Shigeki Teramoto, Kazutaka Tachibana, Teiichi Shiga, Hiroshi Suzuki
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Patent number: 11381770Abstract: An information processing apparatus including a specification section specifying, from among a plurality of blocks that are set by dividing pixels included in at least a partial region of a pixel region having a plurality of pixels arrayed therein and each of which includes at least one or more of the pixels, at least one or more of the blocks, and a generation section generating a unique value based on pixel values of the pixels included in the specified blocks and a dispersion of the pixel values of the pixels among the plurality of blocks.Type: GrantFiled: April 30, 2021Date of Patent: July 5, 2022Assignee: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Toru Akishita
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Publication number: 20220150425Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.Type: ApplicationFiled: January 21, 2022Publication date: May 12, 2022Applicant: Sony Group CorporationInventors: Yusuke Minagawa, Go Asayama
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Patent number: 11318621Abstract: An in-vehicle building material processing system including: a flat cargo bed formed on a vehicle; rigid members for ensuring flatness with respect to a workpiece-receiving table formed at predetermined section of the cargo bed; clampers for fixing a building material on the workpiece-receiving table; a multi-joint robot provided with a freely swingable cutting means at its tip, which is capable of protruding in a range wider than outer periphery of the workpiece-receiving table; and a control unit having an operation unit for making the multi-joint robot to cut and process the building material desirably, wherein the control unit controls the cutting means to cut and process the building material while controlling at least either of the cutting means and the clampers to avoid a contact of the cutting means and the clampers.Type: GrantFiled: March 10, 2017Date of Patent: May 3, 2022Assignee: IIDA GROUP HOLDINGS CO., LTD.Inventors: Kazuhiko Mori, Yoichi Nishikawa, Ayumu Watanabe, Yusuke Minagawa
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Patent number: 11265504Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.Type: GrantFiled: February 25, 2020Date of Patent: March 1, 2022Assignee: SONY CORPORATIONInventors: Yusuke Minagawa, Go Asayama
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Publication number: 20210360183Abstract: An information processing apparatus including a specification section specifying, from among a plurality of blocks that are set by dividing pixels included in at least a partial region of a pixel region having a plurality of pixels arrayed therein and each of which includes at least one or more of the pixels, at least one or more of the blocks, and a generation section generating a unique value based on pixel values of the pixels included in the specified blocks.Type: ApplicationFiled: July 27, 2021Publication date: November 18, 2021Applicant: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Toru Akishita
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Publication number: 20210326592Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.Type: ApplicationFiled: June 29, 2021Publication date: October 21, 2021Applicants: Sony Group Corporation, Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Go Asayama, Toru Akishita, Hirotake Yamamoto, Shigeki Teramoto, Kazutaka Tachibana, Teiichi Shiga, Hiroshi Suzuki
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Publication number: 20210258523Abstract: [Subject] To generate a value unique to a solid-state imaging apparatus utilizing a physical feature of the solid-state imaging apparatus. [Solving Means] An information processing apparatus including a specification section specifying, from among a plurality of blocks that are set by dividing pixels included in at least a partial region of a pixel region having a plurality of pixels arrayed therein and each of which includes at least one or more of the pixels, at least one or more of the blocks, and a generation section generating a unique value based on pixel values of the pixels included in the specified blocks and a dispersion of the pixel values of the pixels among the plurality of blocks.Type: ApplicationFiled: April 30, 2021Publication date: August 19, 2021Applicant: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Toru Akishita
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Patent number: 11080524Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.Type: GrantFiled: May 30, 2017Date of Patent: August 3, 2021Assignee: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Go Asayama, Toru Akishita, Hirotake Yamamoto, Shigeki Teramoto, Kazutaka Tachibana, Teiichi Shiga, Hiroshi Suzuki
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Patent number: 11012652Abstract: [Subject] To generate a value unique to a solid-state imaging apparatus utilizing a physical feature of the solid-state imaging apparatus. [Solving Means] An information processing apparatus including a specification section specifying, from among a plurality of blocks that are set by dividing pixels included in at least a partial region of a pixel region having a plurality of pixels arrayed therein and each of which includes at least one or more of the pixels, at least one or more of the blocks, and a generation section generating a unique value based on pixel values of the pixels included in the specified blocks and a dispersion of the pixel values of the pixels among the plurality of blocks.Type: GrantFiled: December 6, 2017Date of Patent: May 18, 2021Assignee: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Toru Akishita
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Patent number: 10986264Abstract: The present technology relates to an image processing device, an image processing method, an image sensor, an information processing device, and a program that facilitate cancellation of a locked state. An image processing device includes: a detection unit that detects a predetermined state, using data from a plurality of sensors; and an imaging unit that captures an image of a predetermined object, in a case where the predetermined state is detected by the detection unit. The image processing device further includes a plurality of input interfaces that input the data from the plurality of sensors. When an application processor switches from an activated state to a non-activated state, detection by the detection unit is started. The present technology can be applied to a smartphone, for example.Type: GrantFiled: June 9, 2017Date of Patent: April 20, 2021Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Jun Ejiri, Masayuki Tachi, Yusuke Minagawa, Teruhiko Mochizuki, Nobuyuki Asakura, Michimasa Obana, Hisashi Nishimaki
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Publication number: 20200391389Abstract: An in-vehicle building material processing system including: a flat cargo bed formed on a vehicle; rigid members for ensuring flatness with respect to a workpiece-receiving table formed at predetermined section of the cargo bed; clampers for fixing a building material on the workpiece-receiving table; a multi-joint robot provided with a freely swingable cutting means at its tip, which is capable of protruding in a range wider than outer periphery of the workpiece-receiving table; and a control unit having an operation unit for making the multi-joint robot to cut and process the building material desirably, wherein the control unit controls the cutting means to cut and process the building material while controlling at least either of the cutting means and the clampers to avoid a contact of the cutting means and the clampers.Type: ApplicationFiled: March 10, 2017Publication date: December 17, 2020Applicant: IIDA GROUP HOLDINGS CO., LTD.Inventors: Kazuhiko MORI, Yoichi NISHIKAWA, Ayumu WATANABE, Yusuke MINAGAWA
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Patent number: 10726991Abstract: A coil unit includes a coil formed of a conducting wire arranged on a first plane and laid side by side with itself in an inside-outside direction with a coil axis normal to the first plane as the center, and a plurality of magnetic plates arranged on a second plane which is along and adjacent to the first plane. A gap which is formed by the magnetic plates and traverses the inside-outside direction of the coil is located near an edge portion of the coil in the inside-outside direction.Type: GrantFiled: May 18, 2016Date of Patent: July 28, 2020Assignee: NISSAN MOTOR CO., LTD.Inventors: Yuji Naruse, Yusuke Minagawa
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Publication number: 20200195872Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.Type: ApplicationFiled: February 25, 2020Publication date: June 18, 2020Applicant: Sony CorporationInventors: Yusuke Minagawa, Go Asayama
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Patent number: 10616522Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.Type: GrantFiled: July 20, 2017Date of Patent: April 7, 2020Assignee: Sony CorporationInventors: Yusuke Minagawa, Go Asayama
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Publication number: 20190373195Abstract: [Subject] To generate a value unique to a solid-state imaging apparatus utilizing a physical feature of the solid-state imaging apparatus. [Solving Means] An information processing apparatus including a specification section specifying, from among a plurality of blocks that are set by dividing pixels included in at least a partial region of a pixel region having a plurality of pixels arrayed therein and each of which includes at least one or more of the pixels, at least one or more of the blocks, and a generation section generating a unique value based on pixel values of the pixels included in the specified blocks and a dispersion of the pixel values of the pixels among the plurality of blocks.Type: ApplicationFiled: December 6, 2017Publication date: December 5, 2019Applicant: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Toru Akishita
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Publication number: 20190347963Abstract: A solid-state imaging device adapted to encrypt data is described. The solid-state imaging device may include a sensor die comprising an array of imaging pixels formed on a first side of the sensor die and first wiring layers formed on a second side of the sensor die, wherein at least one of the imaging pixels is configured to generate specific signals; a logic die comprising second wiring layers formed on a first side of the logic die; and an encryption processor on the logic die configured to generate encrypted data using the specific signals. The first side of the logic die may be mounted adjacent to the second side of the sensor die and the first wiring layers electrically connect to the second wiring layers, wherein the at least one of the imaging pixels, the encryption processor, and a connecting conductor in which the specific signals pass through from the at least one of the imaging pixels to the encryption processor are located interior to the solid-state imaging device.Type: ApplicationFiled: November 29, 2017Publication date: November 14, 2019Applicant: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Taishin Yoshida, Marie Toyoshima, Toru Akishita, Tomohiro Morimoto, Masafumi Kusakawa, Ikuhiro Tamura, Takahiro Akahane, Eiji Hirata, Yoshinobu Furusawa