Abstract: A solid-state imaging device adapted to encrypt data is described. The solid-state imaging device may include a sensor die comprising an array of imaging pixels formed on a first side of the sensor die and first wiring layers formed on a second side of the sensor die, wherein at least one of the imaging pixels is configured to generate specific signals; a logic die comprising second wiring layers formed on a first side of the logic die; and an encryption processor on the logic die configured to generate encrypted data using the specific signals. The first side of the logic die may be mounted adjacent to the second side of the sensor die and the first wiring layers electrically connect to the second wiring layers, wherein the at least one of the imaging pixels, the encryption processor, and a connecting conductor in which the specific signals pass through from the at least one of the imaging pixels to the encryption processor are located interior to the solid-state imaging device.

Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.

Abstract: A coil unit includes a coil formed of a conducting wire arranged on a first plane and laid side by side with itself in an inside-outside direction with a coil axis normal to the first plane as the center, and a plurality of magnetic plates arranged on a second plane which is along and adjacent to the first plane. A gap which is formed by the magnetic plates and traverses the inside-outside direction of the coil is located near an edge portion of the coil in the inside-outside direction.

Abstract: A construction block and a wall face structure with high durability and versatility are provided. The construction block including: a front face wall and a rear face wall being parallel to each other; a top face wall with a horizontal groove formed for inserting a horizontal reinforcement; side face walls formed with at least one vertical groove for inserting a vertical reinforcement; at least one vertical hole formed between both of the side face walls and closed off by the top face wall and opened at a bottom face; a plurality of protrusions formed on the bottom face in a shape to engage with the horizontal groove; and recessed slits respectively formed in vertical direction on each side face of the front face wall and the rear face wall, is used.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: Decoding of image data from a bit stream of encoded image data is performed. The image data was encoded in a selected domain by a transform function. A set of coefficients is extracted from the bit stream, wherein the set of coefficients represent a block of the image data. Each coefficient is compared to a theoretical model of a distribution of the coefficient data representative of the transform function. A decoding error is indicated when a coefficient does not lie within the theoretical model.

Abstract: A construction block and a wall face structure with high durability and versatility are provided. The construction block including: a front face wall and a rear face wall being parallel to each other; a top face wall with a horizontal groove formed for inserting a horizontal reinforcement; side face walls formed with at least one vertical groove for inserting a vertical reinforcement; at least one vertical hole formed between both of the side face walls and closed off by the top face wall and opened at a bottom face; a plurality of protrusions formed on the bottom face in a shape to engage with the horizontal groove; and recessed slits respectively formed in vertical direction on each side face of the front face wall and the rear face wall, is used.

Abstract: As an aspect of the present invention, a noncontact power feeding apparatus includes: a power transmission resonator; and a power reception resonator configured to be magnetically coupled with the power transmission resonator by magnetic field resonance. The power transmission resonator is magnetically coupled with the power reception resonator by the magnetic field resonance, whereby electric power is supplied from an electric power source to the power reception resonator through the power transmission resonator. One of the power transmission resonator and the power reception resonator has a predetermined single resonant frequency, and the other one of the power transmission resonator and the power reception resonator has multiple resonant frequencies inclusive of the predetermined single resonant frequency.

Abstract: A data stream that contains periodic time reference values referenced to a first reference clock is received for transcoding. The received data stream is processed to form an output data stream that contains the periodic time reference values. At least one of the periodic time reference values is adjusted by adding a count value to the at least one periodic reference value to form an adjusted periodic time reference value. The output data stream is transmitted with the adjusted periodic time reference value.

Abstract: A block encode circuit (800) including a scanner (820) operable to scan a block having data values spaced apart in the block by run-lengths to produce a succession of pairs of values of Level and Run representing each data value and run-length, and wherein the Level values include one or more AC values succeeded by a DC value in the succession, and a Run-Level encoder (830) responsive to said scanner (820) to encode the values of Level and Run in a same AC to DC order as in the succession of pairs of values from said scanner (820) to deliver an encoded output. Other encoders, decoders, codecs and systems and processes for their operation and manufacture are disclosed.

Abstract: A block encode circuit (800) including a scanner (820) operable to scan a block having data values spaced apart in the block by run-lengths to produce a succession of pairs of values of Level and Run representing each data value and run-length, and wherein the Level values include one or more AC values succeeded by a DC value in the succession, and a Run-Level encoder (830) responsive to said scanner (820) to encode the values of Level and Run in a same AC to DC order as in the succession of pairs of values from said scanner (820) to deliver an encoded output. Other encoders, decoders, codecs and systems and processes for their operation and manufacture are disclosed.

Abstract: A contactless power feeding apparatus includes a secondary winding to which power is supplied from a primary winding by an AC power supply. An impedance absolute-value characteristic of Z1 has a frequency of a fundamental wave component to be between a frequency where a local maximum exists and that is nearest to the frequency of the fundamental wave component, and a frequency where a local minimum exists and that is nearest to the frequency of the fundamental wave component. An impedance absolute-value characteristic of Z2 has the frequency of the fundamental wave component to be between a frequency where the local maximum exists and that is nearest to the frequency of the fundamental wave component, and a frequency where the local minimum exists and that is nearest to the frequency of the fundamental wave component.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which a plurality of pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing AD conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, wherein the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals read out in accordance with the read-out mode while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which a plurality of pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing AD conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, wherein the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals read out in accordance with the read-out mode while performing AD conversion for the division pixel signals.

Abstract: A contactless electricity-supplying device (20) includes a secondary winding (201) to which electric power is supplied from a primary winding (101), by an AC power supply (6). The impedance characteristic (Z) of Z1 in regard to the frequency has a local maximum (ZMAX) near the frequency (f0) of the fundamental wave component of aforementioned AC power supply (6); and the impedance characteristic (Z) of Z2 in regard to the frequency has the aforementioned frequency (f0) of the fundamental wave component to be between, a frequency (fMAX) that has its local maximum (ZMAX) nearest to aforementioned frequency (f0) of the fundamental wave component, and a frequency (fMIN) that has its local minimum (ZMin) nearest to the frequency (f0) of the fundamental wave component. Z1 indicates that the coupling coefficient (k) between aforementioned primary winding (101) and aforementioned secondary winding (201) is a prescribed value (0.