Patents by Inventor Yusuke Moriya

Yusuke Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10608028
    Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: March 31, 2020
    Assignee: SONY CORPORATION
    Inventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
  • Publication number: 20200092549
    Abstract: A parallel processing starting unit 3 that partitions an inputted image into tiles each having a predetermined size, and distributes tiles obtained through the partitioning, and N tile encoding units 5-1 to 5-N each of that carries out a prediction difference encoding process on a tile distributed thereto by the parallel processing starting unit 3 to generate a local decoded image are disposed, and each of N tile loop filter units 7-1 to 7-N determines a filter per tile suitable for a filtering process on the local decoded image generated by the corresponding one of the tile encoding units 5-1 to 5-N, and carries out the filtering process on the local decoded image by using the filter.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Ryoji HATTORI, Akira MINEZAWA, Yusuke ITANI, Kazuo SUGIMOTO, Shunichi SEKIGUCHI, Yoshimi MORIYA, Norimichi HIWASA
  • Publication number: 20200090665
    Abstract: In encoding, a frequency-domain sample sequence derived from an acoustic signal is divided by a weighted envelope and is then divided by a gain, the result obtained is quantized, and each sample is variable-length encoded. The error between the sample before quantization and the sample after quantization is quantized with information saved in this variable-length encoding. This quantization is performed under a rule that specifies, according to the number of saved bits, samples whose errors are to be quantized. In decoding, variable-length codes in an input sequence of codes are decoded to obtain a frequency-domain sample sequence; an error signal is further decoded under a rule that depends on the number of bits of the variable-length codes; and from the obtained sample sequence, the original sample sequence is obtained according to supplementary information.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 19, 2020
    Applicant: Nippon Telegraph and Telephone Corporation
    Inventors: Takehiro MORIYA, Noboru HARADA, Yutaka KAMAMOTO, Yusuke HIWASAKI, Masahiro FUKUI
  • Publication number: 20200090664
    Abstract: In encoding, a frequency-domain sample sequence derived from an acoustic signal is divided by a weighted envelope and is then divided by a gain, the result obtained is quantized, and each sample is variable-length encoded. The error between the sample before quantization and the sample after quantization is quantized with information saved in this variable-length encoding. This quantization is performed under a rule that specifies, according to the number of saved bits, samples whose errors are to be quantized. In decoding, variable-length codes in an input sequence of codes are decoded to obtain a frequency-domain sample sequence; an error signal is further decoded under a rule that depends on the number of bits of the variable-length codes; and from the obtained sample sequence, the original sample sequence is obtained according to supplementary information.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 19, 2020
    Applicant: Nippon Telegraph and Telephone Corporation
    Inventors: Takehiro MORIYA, Noboru Harada, Yutaka Kamamoto, Yusuke Hiwasaki, Masahiro Fukui
  • Publication number: 20200073525
    Abstract: A method is provided for modifying an image. The method comprises displaying an image, the image comprising a portion of an object; and determining if an edge of the object is in a location within the portion. The method further comprises detecting movement, in a member direction, of an operating member with respect to the edge. The method still further comprises moving, if the edge is not in the location, the object in an object direction corresponding to the detected movement; and modifying, if the edge is in the location, the image in response to the detected movement, the modified image comprising the edge in the location.
    Type: Application
    Filed: October 31, 2019
    Publication date: March 5, 2020
    Applicant: SONY CORPORATION
    Inventors: Yusuke MIYAZAWA, Tetsuo IKEDA, Fuminori HOMMA, Reiko MIYAZAKI, Ken MIYASHITA, Shoichiro MORIYA
  • Publication number: 20200049959
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 10, 2019
    Publication date: February 13, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Patent number: 10539849
    Abstract: A color change member includes: a color change layer that has a light incident surface, a light emission surface, and a side surface; a first protective layer that is provided on the light incident surface of the color change layer; and a second protective layer that is provided on at least a part of the side surface of the color change layer.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: January 21, 2020
    Assignee: JOLED INC.
    Inventors: Yusuke Moriya, Kensaku Maeda
  • Patent number: 10523935
    Abstract: A parallel processing starting unit 3 that partitions an inputted image into tiles each having a predetermined size, and distributes tiles obtained through the partitioning, and N tile encoding units 5-1 to 5-N each of that carries out a prediction difference encoding process on a tile distributed thereto by the parallel processing starting unit 3 to generate a local decoded image are disposed, and each of N tile loop filter units 7-1 to 7-N determines a filter per tile suitable for a filtering process on the local decoded image generated by the corresponding one of the tile encoding units 5-1 to 5-N, and carries out the filtering process on the local decoded image by using the filter.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: December 31, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Ryoji Hattori, Akira Minezawa, Yusuke Itani, Kazuo Sugimoto, Shunichi Sekiguchi, Yoshimi Moriya, Norimichi Hiwasa
  • Patent number: 10514840
    Abstract: A method is provided for modifying an image. The method comprises displaying an image, the image comprising a portion of an object; and determining if an edge of the object is in a location within the portion. The method further comprises detecting movement, in a member direction, of an operating member with respect to the edge. The method still further comprises moving, if the edge is not in the location, the object in an object direction corresponding to the detected movement; and modifying, if the edge is in the location, the image in response to the detected movement, the modified image comprising the edge in the location.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: December 24, 2019
    Assignee: SONY CORPORATION
    Inventors: Yusuke Miyazawa, Tetsuo Ikeda, Fuminori Homma, Reiko Miyazaki, Ken Miyashita, Shoichiro Moriya
  • Patent number: 10515643
    Abstract: In encoding, a frequency-domain sample sequence derived from an acoustic signal is divided by a weighted envelope and is then divided by a gain, the result obtained is quantized, and each sample is variable-length encoded. The error between the sample before quantization and the sample after quantization is quantized with information saved in this variable-length encoding. This quantization is performed under a rule that specifies, according to the number of saved bits, samples whose errors are to be quantized. In decoding, variable-length codes in an input sequence of codes are decoded to obtain a frequency-domain sample sequence; an error signal is further decoded under a rule that depends on the number of bits of the variable-length codes; and from the obtained sample sequence, the original sample sequence is obtained according to supplementary information.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: December 24, 2019
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takehiro Moriya, Noboru Harada, Yutaka Kamamoto, Yusuke Hiwasaki, Masahiro Fukui
  • Publication number: 20190369355
    Abstract: There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.
    Type: Application
    Filed: January 16, 2018
    Publication date: December 5, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Munekatsu FUKUYAMA, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Masanori IWASAKI, Toshihiko HAYASHI, Shuzo SATO, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Yusuke MORIYA, Minoru ISHIDA
  • Patent number: 10475837
    Abstract: An electronic device has a mounted image sensor including a light shielding body having light shielding walls and light transmitting portions each formed in an opening between the light shielding walls, a first light-shielding layer formed on a light incident surface side of the light shielding body and having an opening narrower than the opening of the light shielding body for each of the openings of the light shielding body, a microlens provided for each of the openings of the first light-shielding layer on the light incident surface side of the light shielding body, and a light receiving element layer with an array of a large number of light receiving elements. The present disclosure can be used for, for example, a compound-eye optical system.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: November 12, 2019
    Assignee: SONY CORPORATION
    Inventors: Yusuke Moriya, Kunihiko Hikichi, Hiroyuki Itou, Atsushi Yamamoto, Masahiko Shimizu
  • Patent number: 10379323
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: August 13, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke Moriya, Masanori Iwasaki, Takashi Oinoue, Yoshiya Hagimoto, Hiroyasu Matsugai, Hiroyuki Itou, Suguru Saito, Keiji Ohshima, Nobutoshi Fujii, Hiroshi Tazawa, Toshiaki Shiraiwa, Minoru Ishida
  • Publication number: 20190244996
    Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
    Type: Application
    Filed: April 19, 2019
    Publication date: August 8, 2019
    Applicant: SONY CORPORATION
    Inventors: Takaaki HIRANO, Shinji MIYAZAWA, Kensaku MAEDA, Yusuke MORIYA, Shunsuke FURUSE, Yutaka OOKA
  • Patent number: 10332924
    Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: June 25, 2019
    Assignee: Sony Corporation
    Inventors: Takaaki Hirano, Shinji Miyazawa, Kensaku Maeda, Yusuke Moriya, Shunsuke Furuse, Yutaka Ooka
  • Publication number: 20180331142
    Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
    Type: Application
    Filed: July 26, 2018
    Publication date: November 15, 2018
    Applicant: SONY CORPORATION
    Inventors: Atsushi YAMAMOTO, Shinji MIYAZAWA, Yutaka OOKA, Kensaku MAEDA, Yusuke MORIYA, Naoki OGAWA, Nobutoshi FUJII, Shunsuke FURUSE, Masaya NAGATA, Yuichi YAMAMOTO
  • Publication number: 20180259749
    Abstract: The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
    Type: Application
    Filed: July 15, 2016
    Publication date: September 13, 2018
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Yusuke MORIYA, Masanori IWASAKI, Takashi OINOUE, Yoshiya HAGIMOTO, Hiroyasu MATSUGAI, Hiroyuki ITOU, Suguru SAITO, Keiji OHSHIMA, Nobutoshi FUJII, Hiroshi TAZAWA, Toshiaki SHIRAIWA, Minoru ISHIDA
  • Patent number: 10038021
    Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: July 31, 2018
    Assignee: Sony Corporation
    Inventors: Atsushi Yamamoto, Shinji Miyazawa, Yutaka Ooka, Kensaku Maeda, Yusuke Moriya, Naoki Ogawa, Nobutoshi Fujii, Shunsuke Furuse, Masaya Nagata, Yuichi Yamamoto
  • Publication number: 20180190700
    Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.
    Type: Application
    Filed: March 2, 2018
    Publication date: July 5, 2018
    Inventors: Takaaki HIRANO, Shinji MIYAZAWA, Kensaku MAEDA, Yusuke MORIYA, Shunsuke FURUSE, Yutaka OOKA
  • Publication number: 20180158858
    Abstract: The present disclosure relates to an image sensor and an electronic device that make it possible to suppress the trouble such as mixing color, stray light, and reduction of the contour resolution that can be caused in the image sensor having a structure in which the light shielding body is arranged on the light receiving element layer.
    Type: Application
    Filed: June 9, 2016
    Publication date: June 7, 2018
    Applicant: SONY CORPORATION
    Inventors: YUSUKE MORIYA, KUNIHIKO HIKICHI, HIROYUKI ITOU, ATSUSHI YAMAMOTO, MASAHIKO SHIMIZU