Abstract: A digital burst mode communication system operates at a fixed wavelength for transmission and reception of burst mode signals using a pair of transceivers and a single optical cable. The stray noise level in the system is significantly reduced by use of angled plate absorbers that receive scattered transmission burst signal from a 45 degree partially reflecting mirror. Use of transparent glass ferrule with or without a front surface anti-reflection coating instead of an opaque ceramic ferrule to support optical fiber at a selected location within the transreceiver reduces optical detector signal noise. Isolation of received burst signal from transmitted burst signal is increased to better than 30 dB. The system operates by sending only data bits across the single optical cable without scrambling or encoding preambles, significantly improving the efficiency of high speed communication.

Abstract: Provided are a motor having a small number of parts and provided with waterproof performance in a low-cost method, and a positioning device and a conveyance device that are positioned and driven by the motor. The motor includes a columnar motor body that is formed with a center hole penetrating in an axial direction, and a housing for accommodating the motor body. The housing includes a cylindrical part that covers an outer peripheral surface of the motor body; a rotation output part provided on an upper side of the cylindrical part in the axial direction and fixed to rotary bodies of the motor body; and a fixed part provided on a lower side of the cylindrical part in the axial direction and fixed to fixed bodies of the motor body. The housing is sealed by a sealing mechanism at only one place of the cylindrical part in the axial direction.

Abstract: The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

Abstract: The present invention relates to a method for producing a homopolymer of olefin represented by formula (1): CH2?CHR1 (R1 is a hydrogen atom or hydrocarbon group having 1 to 20 carbon atoms) or a copolymer of two or more thereof or a method for producing a copolymer of olefin represented by formula (1) with olefin containing a polar group represented by formula (2): CH2?CHR2R3 (R2 is a hydrogen atom or methyl group, R3 is —COOR12, —CN, —OCOR12, —OR12, —CH2—OCOR12, —CH2OH, —CH2—N(R13)2 or —CH2-Hal (R12, R13 and Hal have the same meanings as stated in the description), using as a catalyst a metal complex of group 10 elements in the periodic system typified by the structure represented by formula 1 (“Men” represents a menthyl group and “Me” represents a methyl group). The present invention enables the production of high molecular weight polymers of the polar group-containing monomers such as polar group-containing allyl compounds.

Abstract: The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

Abstract: An actuator, a stator, a motor, a rotational-to-linear motion conversion mechanism, and a linear actuator are provided. The motor, the actuator, and the linear actuator at least include a screw shaft and a nut. The screw shaft is a rod-like member, and at least a part of the surface of the screw shaft has a thread. The nut is screwed onto the thread on the screw shaft, and moves the screw shaft in a linear motion direction that is a direction in parallel with a rotational center. The stator, the motor, the actuator, and the linear actuator can at least convert a rotational motion into a linear motion.

Abstract: A digital burst mode communication system operates at a fixed wavelength for transmission and reception of burst mode signals using a pair of transceivers and a single optical cable. The stray noise level in the system is significantly reduced by use of angled plate absorbers that receive scattered transmission burst signal from a 45 degree partially reflecting mirror. Use of transparent glass ferrule with or without a front surface anti-reflection coating instead of an opaque ceramic ferrule to support optical fiber at a selected location within the transreceiver reduces optical detector signal noise. Isolation of received burst signal from transmitted burst signal is increased to better than 30 dB. The system operates by sending only data bits across the single optical cable without scrambling or encoding preambles, significantly improving the efficiency of high speed communication.

Abstract: The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

Abstract: A digital burst mode communication system operates at a fixed wavelength for transmission and reception of burst mode signals using a pair of transceivers and a single optical cable. The stray noise level in the system is significantly reduced by use of angled plate absorbers that receive scattered transmission burst signal from a 45 degree partially reflecting mirror. Isolation of received burst signal from transmitted burst signal is increased to better than 30 dB. The system operates by sending only data bits across the single optical cable without scrambling or encoding preambles, significantly improving the efficiency of high speed communication.

Abstract: The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

Abstract: A method and a system for providing a messenger on-air service using an official account include providing an interface for creating and managing an event using an official account, and creating an event chat room in which a plurality of users sharing a relationship with an event creator participate based on a request of the event creator through the interface.

Abstract: An electric power steering device includes a steering column in which a steering shaft for transmitting a steering torque is built, an electric motor for transmitting a steering assist force through a gear mechanism in a gearbox to the steering shaft, and a control device for driving and controlling the electric motor. The control device includes a drive circuit module having a switching element for driving the electric motor, and a control module that is mounted on the gearbox for controlling the drive circuit module. The drive circuit module is mounted on a housing of the electric motor.

Abstract: The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

Abstract: A passive optical network system and method in which at least part of the data is optically transmitted through a single optical fiber using a wavelength division multiplexing technique, with a plurality of signals being carried through the fiber in each direction, a different wavelength being used for each of the multiplexed upstream and downstream signals. The system may be retrofitted into existing telecommunications system to provide a multi-fold increase in the available bandwidth of long-distance optical fiber transmission.

Abstract: A digital burst mode communication system operates at a fixed wavelength for transmission and reception of burst mode signals using a pair of transceivers and a single optical cable. The stray noise level in the system is significantly reduced by use of angled plate absorbers that receive scattered transmission burst signal from a 45 degree partially reflecting mirror. Isolation of received burst signal from transmitted burst signal is increased to better than 30 dB. The system operates by sending only data bits across the single optical cable without scrambling or encoding preambles, significantly improving the efficiency of high speed communication.

Abstract: An optical network unit useful in a passive optical network has capability for automatic shutdown upon detection of a malfunction, thereby protecting the integrity of upstream data transmitted in the network. The unit detects the generation of upstream light during intervals in which transmission is not authorized. In response, the light source of the unit is deactivated to prevent collisions with upstream data from other optical network units in the network.

Abstract: There is provided an electric power steering device for solving unsolved problems with ensuring advantages of a control device of motor housing mounting type and gearbox mounting type. An electric power steering device includes: a steering column in which a steering shaft for transmitting a steering torque is built; an electric motor for transmitting a steering assist force through a gear mechanism in a gearbox to the steering shaft; and a control device for driving and controlling the electric motor. The control device including at least: a drive circuit module including a switching element for driving the electric motor, and mounted on a housing of the electric motor; and a control module, mounted on the gearbox, for controlling the drive circuit module.

Abstract: To provide a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of the wiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device.

Abstract: To provide a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of the wiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device.

Abstract: To provide a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of the wiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device.