Abstract: An object of the present invention is to provide a hair styling composition formulated to make hair styling easy and to add wet-look shine to hair. The hair styling composition which achieves the above object contains (A) a thickener, (B) a hair fixative polymer and/or a liquid oil, (C) a wax particle dispersion, and (D) water. In the hair styling composition of the present invention, the wax particle dispersion (C) is preferably an Euphorbia Cerifera (Candelilla) wax particle dispersion or a beeswax particle dispersion, or preferably contains wax, at least one nonionic surfactant selected from the group consisting of polyoxyethylene cetyl ether and polyoxyethylene polyoxypropylene cetyl ether, and water.

Abstract: An isotropic etching process can be performed with high uniformity. A plasma etching method of etching an etching target layer containing silicon includes preparing a processing target object having the etching target layer in a processing chamber; removing an oxide film on a surface of the etching target layer by generating plasma of a first processing gas that contains a fluorocarbon gas or a fluorohydrocarbon gas but does not contain oxygen; removing a carbon-based reaction product generated when the removing of the oxide film by generating plasma of a second processing gas that does not contain oxygen; and etching the etching target layer without applying a high frequency bias power to a lower electrode serving as a mounting table configured to mount the processing target object thereon by generating plasma of a third processing gas containing a fluorocarbon gas or a fluorohydrocarbon gas with a microwave.