Abstract: A probe made of copper and supported by a movable arm via a load cell and a jig has a joining surface having good wettability with solder at the tip end thereof and has a covering portion having poor wettability with the solder around the circumferential periphery. The solder and flux are stuck to the joining surface and the solder is put into contact with a bump electrode to be tested on a substrate in this state. Then, the solder is melted by an induction heating coil and then cooled down and solidified to join the bump electrode to be tested to the probe. The bump electrode is broken by pulling up the probe in this state at a constant speed and at the same time the pulling force exerted on the probe is measured by the load cell.

Abstract: A semiconductor device, which has a high adhesiveness to the Cu film and the barrier metal at the bump part or LSI wiring part of a flip chip, is disclosed. On a silicon substrate are formed a transistor as a functional element and a bump for making contact with the transistor and an external substrate. On the surface of the silicon substrate is formed a metallic film, and on the metallic film is formed an insulating film, and a part of the metallic film is exposed through a contact hole. On the metallic film within the contact hole is formed a barrier metal made of TiN, and on the barrier metal is formed a bonding layer made of Ti. On the bonding layer is formed a bump growing Cu film, and on the bump growing Cu film is formed a bump structure.

Abstract: A tensile strength or pull strength testing of a semiconductor bump electrode is measured without mounting a semiconductor chip on a substrate or the like. A probe to be inserted into a semiconductor bump electrode is heated up to a temperature at which a metal of the bump electrode 21 is fused, and then the probe having been heated up to the temperature to fuse the metal of the bump electrode is inserted into the bump electrode so that the metal of the bump electrode is fused. Further, the fused metal of the bump electrode is cooled down together with the probe to solidify the same. Thereafter, the probe fixed within the bump electrode is pulled vertically relative to the bump electrode until the bump electrode breaks. At the time of breakage of the semiconductor bump electrode, the pull force is detected as the pull strength of the bump electrode.

Abstract: A servo device for servo controlling a spindle motor according to the invention, comprising: a unit for generating a signal with at least two cycles during one full rotation of a rotator in the spindle motor in accordance with a rotational movement of the rotator; a unit for measuring a time required for each of the two periods; a unit for storing at least two target time corresponding to the two periods respectively; and a speed controlling unit for controlling a rotational speed of the rotator at the basis of the comparison between the respective measured period and the corresponding target period. Therefore, a current error of the measurement of periods are associated with the time of half the period preceding the current period, thereby the detection with the reduced delay can be performed in comparison with the detection at the time of one half rotation.

Abstract: In a magnetic disk unit, a magnetic head slider member for holding a magnetic head is floated from a recording face of a magnetic disk by an air flow caused by a high speed rotation of the magnetic disk. The magnetic disk unit has a magnetic head moving device for rotatably supporting the magnetic head slider member and positioning the magnetic head in a radial direction of the magnetic disk. A control method of the magnetic disk unit has the steps of reciprocating the magnetic head slider member a predetermined number of times at a high speed in a predetermined range in the radial direction of the magnetic disk by using a position of the magnetic head slider member as a reference in the radial direction of the magnetic disk provided when it is detected that a data error is included in reproduced data at a reproducing time of recorded data; and again reproducing the same recorded data after the reciprocating movement of the magnetic head slider member.