Patents by Inventor Yusuke

Yusuke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929265
    Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: March 12, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yusuke Yadani
  • Patent number: 11929307
    Abstract: A power semiconductor module, which is a semiconductor device, includes a semiconductor element 155 and a lead frame 318 that is disposed to face the semiconductor element 155 and connected to the semiconductor element 155 by a solder material 162. The lead frame 318 has the top surface 331 including a surface facing the semiconductor element 155, and the side surface 334 connected to the peripheral edge portion 333 of the top surface 331 at a predetermined angle with respect to the top surface 331. The top surface of the lead frame 318 includes the solder surface 332 that is in contact with the solder material 162 and the solder resistance surface on which the solder material 162 is less wettable than on the solder surface 332. The solder resistance surface is formed to surround the periphery of the solder surface 332. In this manner, when the semiconductor element and the lead frame are solder-joined in the semiconductor device, the region where the solder wet-spreads is appropriately controlled.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: March 12, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Yusuke Takagi, Ryo Terayama, Ko Hamaya, Osamu Ikeda
  • Patent number: 11926067
    Abstract: In a robot control system, the operation of a mobile robot that moves autonomously inside a facility is controlled based at least on an image captured by a photographing device that photographs a blind area located at a blind angle to the mobile robot. When entry of the mobile robot into a predetermined area corresponding to the blind area is detected, the amount of information obtainable from an image captured by the photographing device is increased.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: March 12, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shiro Oda, Tetsuya Taira, Satoshi Toyoshima, Yuta Watanabe, Takeshi Matsui, Takayoshi Nasu, Kei Yoshikawa, Yusuke Ota, Yutaro Ishida, Yuji Onuma, Kyosuke Arai
  • Patent number: 11929612
    Abstract: A first switching unit switches a first power grid from an isolated operation to a grid-connected operation. In switching the first power grid from the isolated operation to the grid-connected operation, the first switching unit determines a master and a slave among a plurality of power adjustment resources and allows the first power grid to be connected to the second power grid after master-slave control by means of the master and the slave such that electric power of the first power grid is in synchronization with electric power of the second power grid. The first switching unit preferentially selects as the master, a power adjustment resource close to a point of connection between the first power grid and the second power grid from among the plurality of power adjustment resources.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: March 12, 2024
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Shigetaka Hamada, Haruka Hirose, Yusuke Horii, Toru Nakamura, Takaaki Sano
  • Patent number: 11927208
    Abstract: A rotational coupler in one aspect of the present disclosure includes a plate-shaped first member, a plate-shaped second member, a tapered portion, and an outer circumferential ring. The outer circumferential ring includes a first ring flange configured to externally come into contact with the first member. The outer circumferential ring includes a bent portion in a middle part of the second ring flange in an extending direction. The bent portion is bent to protrude toward the first plate of the first member.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: March 12, 2024
    Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Takuma Watanabe, Yusuke Inomata
  • Patent number: 11930380
    Abstract: System and methods include obtaining data, over the Internet, associated with a plurality of Wi-Fi networks each Wi-Fi network having one or more access points and each Wi-Fi network being associated with a customer of one or more service providers; aggregating and filtering the data; analyzing the aggregated and filtered data for the network condition of each of the plurality of customers of one or more service providers; determining an internet service provider (ISP) outage based on a plurality of factors; and performing one of a plurality of resolution or notification actions.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: March 12, 2024
    Assignee: PLUME DESIGN, INC.
    Inventors: Yusuke Sakamoto, Yoseph Malkin, Sachin Vasudeva, Nipun Agarwal
  • Patent number: 11929380
    Abstract: There is provided a solid-state image-capturing element capable of reducing the capacitance by using a hollow region. At least a part of a region between an FD wiring connected to a floating diffusion and a wiring other than the FD wiring is a hollow region. The present disclosure can be applied to a CMOS image sensor having, for example, a floating diffusion, a transfer transistor, an amplifying transistor, a selection transistor, a reset transistor, and a photodiode.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: March 12, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yusuke Tanaka, Takashi Nagano, Toshifumi Wakano, Takeshi Matsunuma
  • Patent number: 11927908
    Abstract: An image forming apparatus include an image forming device, an image bearer, a transferrer, a cleaner, and an adhesion amount detector. The image forming device forms, on the image bearer, a toner image to be transferred to a recording medium and a toner image pattern to be input to the cleaner without being transferred to the recording medium. The cleaner cleans the image bearer. The adhesion amount detector detects a toner adhesion amount of the toner image. The toner image pattern is a belt-shaped pattern elongated in an orthogonal direction orthogonal to a traveling direction of the image bearer and having a greater amount of toner input to a portion of the cleaner corresponding to a position of the adhesion amount detector in the orthogonal direction than that input to a portion of the cleaner not corresponding to the position of the adhesion amount detector in the orthogonal direction.
    Type: Grant
    Filed: July 17, 2022
    Date of Patent: March 12, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Shotaro Hoshi, Yusuke Mitani
  • Publication number: 20240076223
    Abstract: An apparatus for producing a glass preform is an apparatus by pulling up a starting rod while the starting rod is rotated around an axis and glass fine particles generated by a burner are deposited in an axial direction of the starting rod. The apparatus for producing a glass preform includes an imaging device that acquires a deposition surface image by imaging a deposition surface of a glass fine particle deposit deposited on the starting rod, and an image processing unit that detects an edge shape of the deposition surface from the deposition surface image acquired using the imaging device to judge quality of the glass fine particle deposit by quantifying a degree of deformation of the edge shape.
    Type: Application
    Filed: March 3, 2022
    Publication date: March 7, 2024
    Inventors: Shinobu HATA, Yusuke KUBO
  • Publication number: 20240079459
    Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode; a fourth electrode, a semiconductor member, a first conductive member, a second conductive member, and an insulating member. The semiconductor member includes first, second and third semiconductor regions. The first semiconductor region includes a first outer edge region, a first partial region, a second partial region, a third partial region, and a fourth partial region. The first, third and fourth partial regions are of a first conductivity type. The second semiconductor region is of a second conductivity type. The third semiconductor region is of the first conductivity type. The second conductive member includes a first conductive portion. The insulating member includes a first insulating region and a second insulating region. An electrical resistivity of the second partial region is higher than an electrical resistivity of the first partial region.
    Type: Application
    Filed: February 14, 2023
    Publication date: March 7, 2024
    Inventors: Yusuke KOBAYASHI, Tomoaki INOKUCHI, Hiro GANGI, Shotaro BABA
  • Publication number: 20240081085
    Abstract: A solid-state image sensor includes a plurality of imaging element blocks 10 each configured from a plurality of imaging elements. Each of the imaging elements includes a first electrode, a charge accumulating electrode arranged in a spaced relation from the first electrode, a photoelectric conversion portion contacting with the first electrode and formed above the charge accumulating electrode with an insulating layer interposed therebetween, and a second electrode formed on the photoelectric conversion portion. The first electrode and the charge accumulating electrode are provided on an interlayer insulating layer, and the first electrode is connected to a connection portion provided in the interlayer insulating layer.
    Type: Application
    Filed: June 2, 2023
    Publication date: March 7, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Yusuke SATO
  • Publication number: 20240075666
    Abstract: An injection molding machine includes an injection apparatus configured to perform an injection operation of a material and a mold clamping apparatus configured to mold the material injected from the injection apparatus. Here, the injection apparatus includes a screw, a piston connected to the screw, and a hydraulic apparatus configured to drive the piston in an axial direction. On the other hand, the mold clamping apparatus includes a movable platen to which a first mold can be attached, a fixed platen to which a second mold can be attached, and an electric drive unit configured to move the movable platen in a mold closing direction or a mold opening direction with respect to the fixed platen.
    Type: Application
    Filed: August 19, 2023
    Publication date: March 7, 2024
    Inventors: Yutaka NAKAGAWA, Yusuke YONEHARA, Toshio TOYOSHIMA
  • Publication number: 20240076136
    Abstract: A bulk feeder includes a feeder main body, a track member provided to be vibratable with respect to the feeder main body and formed with a conveyance path through which multiple components are conveyed and a supply region that communicates with the conveyance path and opens upward to collect the multiple components, an excitation device configured to apply vibration to the track member so that the multiple components are conveyed along the conveyance path, a shutter provided above the track member to close an opening of the supply region, and a driving device configured to open or close the shutter to separate the shutter from the track member when the shutter shifts from a closed state to an open state.
    Type: Application
    Filed: January 29, 2021
    Publication date: March 7, 2024
    Applicant: FUJI CORPORATION
    Inventors: Yusuke YAMAZAKI, Yuji KAWASAKI
  • Publication number: 20240079177
    Abstract: A multilayer coil component includes an element body, a plurality of coil conductors, a first resistive layer, and a second resistive layer. The plurality of coil conductors are disposed in the element body and electrically connected to each other. The plurality of coil conductors include a first coil conductor and a second coil conductor adjacent to each other. The first resistive layer and the second resistive layer oppose each other between the first coil conductor and the second coil conductor. The first resistive layer is in contact with the first coil conductor.
    Type: Application
    Filed: July 26, 2023
    Publication date: March 7, 2024
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Kazuhiro EBINA, Takahiro SATO, Masaki TAKAHASHI, Takashi ENDO, Yuya ISHIMA, Kosuke ITO, Takuya MIYASHITA
  • Publication number: 20240075600
    Abstract: An electric tool includes a motor, an impact mechanism, an output shaft, a torque measuring unit, a fastening torque calculating unit, and a control unit. The output shaft receives, from the impact mechanism, rotational impact around an axis. The torque measuring unit measures, as measured torque, torque applied to the output shaft. The fastening torque calculating unit calculates, based on the measured torque measured by the torque measuring unit, fastening torque to be applied to a fastening member. The control unit performs a speed reducing function by changing, according to the fastening torque calculated by the fastening torque calculating unit, the number of revolutions of the motor from a first number of revolutions into a second number of revolutions. The second number of revolutions is smaller than the first number of revolutions.
    Type: Application
    Filed: January 26, 2021
    Publication date: March 7, 2024
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Yusuke TANJI, Hideki TAMURA
  • Publication number: 20240077766
    Abstract: A transparent substrate for a liquid crystal device includes an alignment layer that regulates an alignment direction of liquid crystal molecules contained in a liquid crystal layer of the liquid crystal device, and a base layer on which the alignment layer is formed. The transparent substrate includes a first surface and a second surface opposite the first surface. The first surface is a surface of the alignment layer, and the second surface is a surface of the base layer. The coefficient of static friction between the first surface and the second surface is less than or equal to 1.3. The transparent substrate has a hardness of F or higher in a pencil harness test on the first surface or on a surface of the base layer opposite the second surface.
    Type: Application
    Filed: October 19, 2023
    Publication date: March 7, 2024
    Applicant: TOPPAN Inc.
    Inventors: Yusuke TAKAHASHI, Yuji KATAOKA
  • Publication number: 20240076537
    Abstract: The disclosure is a cold storage material containing: a cold storage material main agent formed from water and a melting point adjuster; and a freezing point adjuster. The melting point adjuster includes a plurality of types of inorganic salts and an organic compound. Anions of the plurality of types of inorganic salts are all chlorine, and cations of the plurality of types of inorganic salts include at least sodium. The freezing point adjuster is a salt having a functional group that is identical to a cation included in any of the plurality of types of inorganic salts, and the salt has a temperature dependence of saturated solubility in pure water that decreases by 30% or more at a water temperature from 20° C. to 0° C.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Yusuke IKEDA, YUKA UTSUMI
  • Publication number: 20240076134
    Abstract: A bulk feeder includes a feeder main body, a track member provided vibratably with respect to the feeder main body and formed with a conveyance path through which multiple components are conveyed, an excitation device configured to apply vibration to the track member so that the multiple components are conveyed along the conveyance path, and a vibration sensor configured to detect a vibration value indicating a vibration state of the track member that vibrates by the excitation of the excitation device.
    Type: Application
    Filed: January 29, 2021
    Publication date: March 7, 2024
    Applicant: FUJI CORPORATION
    Inventors: Yusuke YAMAZAKI, Toshihiro NONOMURA, Yuji KAWASAKI
  • Publication number: 20240076524
    Abstract: A film contains a ?-1,3-glucan derivative obtained by introducing an acyl group into a ?-1,3-glucan and at least one resin selected from the group consisting of a rosin-based resin, a terpene-based resin, and a petroleum-based resin. The acyl group is represented by RCO—, and the R is a hydrocarbon group having 1 or more and 5 or less carbon atoms. Parts by weight of the resin with respect to 100 parts by weight of the ?-1,3-glucan derivative are 90 parts by weight or less. A pressure-sensitive adhesive tape includes the film and a pressure-sensitive adhesive layer.
    Type: Application
    Filed: February 28, 2022
    Publication date: March 7, 2024
    Inventors: Yoshiko OGINO, Tatsuya KUMADA, Yusuke HARA, Tomonari NAITO
  • Publication number: 20240079214
    Abstract: A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.
    Type: Application
    Filed: January 13, 2022
    Publication date: March 7, 2024
    Inventors: Yuji Mimura, Hiroshi Maeda, Takuro Masuzumi, Takashi Terada, Masaru Honda, Ryoichi Sakamoto, Takashi Fuse, Yusuke Kubota