Patents by Inventor Yuta Kimura

Yuta Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190271969
    Abstract: Disclosed is an information collection and display system in which a data generation device that generates site data and a transaction data accumulation unit that stores the site data are connected. The information collection and display system includes an association data accumulation unit that stores association data defining association of each of a plurality of pieces of information included in the site data; an association data search unit that searches for second information associated with first information included in the plurality of pieces of information, on the basis of the association data; and a user interface that displays a connection relation of the plurality of pieces of information associated by the association data.
    Type: Application
    Filed: September 24, 2018
    Publication date: September 5, 2019
    Applicant: Hitachi, Ltd.
    Inventors: Hiroki MIYAMOTO, Yuncheng ZHU, Noboru FUJITA, Masahiro KIMURA, Yuta OKUBO, Daisuke OKABE
  • Publication number: 20190263847
    Abstract: Provided is a method for producing an alkenyl phosphorus compound which can produce an alkenyl phosphorus compound efficiently even with a smaller amount of a catalyst used than that used conventionally, and further which can maintain catalytic activity to produce an alkenyl phosphorus compound in high yield even at a larger reaction scale, and which can also be applied to quantity synthesis at an industrial scale using a conventional batch reactor or continuous reactor. A method for producing an alkenyl phosphorus compound, comprising: a step of reacting a compound represented by the following formula (1): [In formula (1), R1 represents OR3 or R3, R2 represents OR4 or R4, and R3 and R4 represent, for example, each independently a substituted or unsubstituted alkyl group.] with a compound represented by the following formula (2): R5—C?CH??(2) [In formula (2), R5 represents, for example, a hydrogen atom, or a substituted or unsubstituted alkyl group.
    Type: Application
    Filed: September 8, 2016
    Publication date: August 29, 2019
    Applicant: MARUZEN PETROCHEMICAL CO., LTD.
    Inventors: Yu KINAMI, Ryuichi TENJIMBAYASHI, Yusuke YOKOO, Ichiro KIMURA, Tomohiko SATO, Hiroyoshi FUJINO, Tomoko WATANABE, Yuta SAGA
  • Publication number: 20190252753
    Abstract: A dielectric filter includes a plurality of dielectric resonators. The dielectric filter also includes: a plurality of resonator body portions each formed of a first dielectric and respectively corresponding to the plurality of dielectric resonators, the first dielectric having a first relative permittivity; a peripheral dielectric portion formed of a second dielectric and lying around the plurality of resonator body portions, the second dielectric having a second relative permittivity lower than the first relative permittivity; and a shield portion formed of a conductor. Either one of a temperature coefficient of resonant frequency of the first dielectric at 25° C. to 85° C. and a temperature coefficient of resonant frequency of the second dielectric at 25° C. to 85° C. has a positive value and the other has a negative value.
    Type: Application
    Filed: December 20, 2018
    Publication date: August 15, 2019
    Applicant: TDK CORPORATION
    Inventors: Yuta ASHIDA, Shigemitsu TOMAKI, Yousuke FUTAMATA, Shin TAKANE, Yasuharu MIYAUCHI, Kazunari KIMURA
  • Patent number: 10381700
    Abstract: A dielectric filter includes: a resonator body formed of dielectric material; surrounding dielectric portion present around the resonator body and formed of dielectric material having a relative permittivity lower than the dielectric material used to form the resonator body; and an input/output conductor portion formed of a conductor and configured to perform at least one supply of an electromagnetic wave to the resonator body and reception of an electromagnetic wave from the resonator body. The resonator body has a first end face and a second end face located at opposite ends in a first direction. The input/output conductor portion is located either at least part of the input/output conductor portion is contained in a space formed by shifting a virtual plane corresponding to the first end face in the first direction away from the second end face, or the input/output conductor portion is in contact with the space.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: August 13, 2019
    Assignee: TDK CORPORATION
    Inventors: Yuta Ashida, Kazunari Kimura, Shigemitsu Tomaki
  • Patent number: 10374098
    Abstract: A high-performance and highly reliable semiconductor device is provided. The semiconductor device includes: a first oxide; a source electrode; a drain electrode; a second oxide over the first oxide, the source electrode, and the drain electrode; a gate insulating film over the second oxide; and a gate electrode over the gate insulating film. The source electrode is electrically connected to the first oxide. The drain electrode is electrically connected to the first oxide. Each of the first oxide and the second oxide includes In, an element M (M is Al, Ga, Y, or Sn), and Zn. Each of the first oxide and the second oxide includes more In atoms than element M atoms. An atomic ratio of the In, the Zn, and the element M in the first oxide is equal to or similar to an atomic ratio of the In, the Zn, and the element M in the second oxide.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: August 6, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yuta Endo, Hiromi Sawai, Hajime Kimura
  • Patent number: 10361532
    Abstract: Semiconductor lasers are arranged in a plurality of columns. The columns of the respective semiconductor lasers include semiconductor laser installed columns. Reflecting mirrors in the respective semiconductor laser installed columns reflect light in substantially the same axial direction as viewed from above, and constitute beam groups. The beam groups of the respective semiconductor laser installed columns are formed on both sides in a width direction of a housing. That is, the beam groups are configured for each of the semiconductor laser installed columns, and the respective beam groups are formed on mutually different axes as viewed from above.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: July 23, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Etsuji Katayama, Toshio Kimura
  • Patent number: 10306734
    Abstract: Presence of a working machine is noticed by those in the surroundings, and a worker is easily informed of a warning relating to an external environment. A working machine includes a detection unit including a sensor detecting an external environment of a machine body, and a control unit that controls a headlight that functions as an illumination unit based on the detected external environment.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: May 28, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yuta Kimura, Yoshimasa Teruya, Jun Fukano, Tsutomu Mizoroke
  • Publication number: 20190037666
    Abstract: Presence of a working machine is noticed by those in the surroundings, and a worker is easily informed of a warning relating to an external environment. A working machine includes a detection unit including a sensor detecting an external environment of a machine body, and a control unit that controls a headlight that functions as an illumination unit based on the detected external environment.
    Type: Application
    Filed: July 12, 2018
    Publication date: January 31, 2019
    Inventors: Yuta Kimura, Yoshimasa Teruya, Jun Fukano, Tsutomu Mizoroke
  • Publication number: 20190031080
    Abstract: There is provided a snow removal machine capable of illuminating, with a light projector, a dropped position of snow that varies depending on a direction of a chute guide. A working machine as a snow removal machine includes a machine body, and a chute that is provided on the machine body, and throws away snow. The chute includes a chute main body extending upwardly from the machine body, and a chute guide that is pivotably provided on a distal end portion of the chute main body, and adjusts a snow throwing direction that is an up-down direction of the snow to be thrown, the chute guide is connected to the chute main body side through a link, and the link is provided with a light projector so as to be capable of illuminating a dropped position of the snow to be thrown.
    Type: Application
    Filed: June 21, 2018
    Publication date: January 31, 2019
    Inventors: Yuta Kimura, Yoshimasa Teruya, Jun Fukano, Tsutomu Mizoroke
  • Publication number: 20190031099
    Abstract: Visibility of information that is provided to a worker is enhanced. A working machine includes an indicator device that functions as an information providing unit that provides information of a machine body to the worker, and the indicator device emits an indicator light to a ground that is located in front of the working machine and is exposed to a worker side that is located at a manipulation position.
    Type: Application
    Filed: May 14, 2018
    Publication date: January 31, 2019
    Inventors: Yuta Kimura, Yoshimasa Teruya, Jun Fukano, Tsutomu Mizoroke
  • Publication number: 20190016372
    Abstract: A steering device includes: a rack shaft; a rack housing housing the rack shaft; a motor unit having a motor case of which one end is coupled to the rack housing; a moving force application mechanism that moves the rack shaft by an output of the motor unit; and a support member that is fixed to the rack housing and supports the motor case. The rack housing has a fixing projection in which a bolt hole extending in a height direction is formed. The support member has an arc-shaped support part that extends along an outer circumferential surface of the motor case, and a pair of fixing pieces that protrudes from the support part toward a rack shaft housing section. Ends of the pair of fixing pieces are fastened with a bolt to the fixing projection of the rack housing.
    Type: Application
    Filed: July 5, 2018
    Publication date: January 17, 2019
    Applicant: JTEKT CORPORATION
    Inventors: Yuta KIMURA, Hiroaki MURAKAMI
  • Publication number: 20190003136
    Abstract: A burden on an operation of an operator is reduced. A working machine includes a grid light that projects a grid light of a grid-shaped pattern, and a control unit that control the vehicle in accordance with deformation of the pattern of the grid light according to a shape of a projection spot.
    Type: Application
    Filed: May 18, 2018
    Publication date: January 3, 2019
    Inventors: Yuta Kimura, Yoshimasa Teruya, Jun Fukano, Tsutomu Mizoroke
  • Publication number: 20190003698
    Abstract: A working machine is provided, which can suppress reduction in visibility of a spot illuminated by illuminating light even when an ambient light environment changes. A working machine in which a working unit that performs predetermined work is connected to a machine body that travels is configured to include a headlight that illuminates a traveling direction of the machine body and is capable of color adjustment, a camera that detects a color of an illumination spot P that is illuminated by illuminating light K of the headlight, and a control unit that performs color adjustment of the headlight in accordance with the color detected by the camera.
    Type: Application
    Filed: June 18, 2018
    Publication date: January 3, 2019
    Inventors: Yuta Kimura, Manabu Dobashi
  • Patent number: 9484240
    Abstract: The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: November 1, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuki Sugo, Yuta Kimura
  • Patent number: 9123794
    Abstract: The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10?6 ?·cm or more and 1×10?3 ?·cm or less, and the tensile storage modulus of the thermosetting type die bond film at ?20° C. before thermal curing is 0.1 to 10 GPa.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: September 1, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yasuhiro Amano, Miki Morita, Yuta Kimura
  • Publication number: 20140231983
    Abstract: The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 21, 2014
    Inventors: Yuki SUGO, Yuta KIMURA
  • Patent number: 8748040
    Abstract: A negative electrode active material for a lithium secondary battery, which includes a composition including Si in an amount of from 30% to 65% by mass of the negative electrode active material, includes a two phase matrix structure including an Sn—Cu based alloy matrix including an Sn content of 50% by mass or more of the Sn—Cu based alloy matrix, Si crystallites dispersed in the Sn—Cu based alloy matrix, and an Si—X based alloy crystallized so as to at least partially cover the Si crystallites, in which X is at least one element selected from Fe, Ni, and Co, and is added in an amount of 1% by mass or more of the negative electrode active material.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: June 10, 2014
    Assignee: Daido Steel Co., Ltd.
    Inventors: Yuta Kimura, Yuichiro Tago, Kenji Kodama, Satoshi Takemoto
  • Patent number: 8715857
    Abstract: The present invention relates to a negative electrode active material including an Si—Sn—Fe—Cu based alloy, in which an Si phase has an area ratio in a range of from 35 to 80% in the entire negative electrode active material, the Si phase is dispersed in a matrix phase, the matrix phase contains an Si—Fe compound phase crystallized around the Si phase and further contains an Sn—Cu compound phase crystallized to surround the Si phase and the Si—Fe compound phase, the Si—Fe compound phase is crystallized in a ratio of from 35 to 90% in terms of an area ratio in the entire matrix phase, and the matrix phase further contains an Sn phase unavoidably crystallized in the matrix phase in a ratio of 15% or less in terms of an area ratio in the entire matrix phase.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: May 6, 2014
    Assignee: Daido Steel Co., Ltd.
    Inventors: Yuta Kimura, Yuichiro Tago, Kozo Ozaki
  • Publication number: 20140057100
    Abstract: The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10?6 ?·cm or more and 1×10?3 ?·cm or less, and the tensile storage modulus of the thermosetting type die bond film at ?20° C. before thermal curing is 0.1 to 10 GPa.
    Type: Application
    Filed: November 5, 2013
    Publication date: February 27, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasuhiro Amano, Miki Morita, Yuta Kimura
  • Patent number: 8659157
    Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: February 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuta Kimura, Yasushi Inoue, Takeshi Matsumura