Abstract: A steering device includes: a rack shaft; a rack housing housing the rack shaft; a motor unit having a motor case of which one end is coupled to the rack housing; a moving force application mechanism that moves the rack shaft by an output of the motor unit; and a support member that is fixed to the rack housing and supports the motor case. The rack housing has a fixing projection in which a bolt hole extending in a height direction is formed. The support member has an arc-shaped support part that extends along an outer circumferential surface of the motor case, and a pair of fixing pieces that protrudes from the support part toward a rack shaft housing section. Ends of the pair of fixing pieces are fastened with a bolt to the fixing projection of the rack housing.

Abstract: A working machine is provided, which can suppress reduction in visibility of a spot illuminated by illuminating light even when an ambient light environment changes. A working machine in which a working unit that performs predetermined work is connected to a machine body that travels is configured to include a headlight that illuminates a traveling direction of the machine body and is capable of color adjustment, a camera that detects a color of an illumination spot P that is illuminated by illuminating light K of the headlight, and a control unit that performs color adjustment of the headlight in accordance with the color detected by the camera.

Abstract: A burden on an operation of an operator is reduced. A working machine includes a grid light that projects a grid light of a grid-shaped pattern, and a control unit that control the vehicle in accordance with deformation of the pattern of the grid light according to a shape of a projection spot.

Abstract: The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.

Abstract: The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10?6 ?·cm or more and 1×10?3 ?·cm or less, and the tensile storage modulus of the thermosetting type die bond film at ?20° C. before thermal curing is 0.1 to 10 GPa.

Abstract: The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device. The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.

Abstract: A negative electrode active material for a lithium secondary battery, which includes a composition including Si in an amount of from 30% to 65% by mass of the negative electrode active material, includes a two phase matrix structure including an Sn—Cu based alloy matrix including an Sn content of 50% by mass or more of the Sn—Cu based alloy matrix, Si crystallites dispersed in the Sn—Cu based alloy matrix, and an Si—X based alloy crystallized so as to at least partially cover the Si crystallites, in which X is at least one element selected from Fe, Ni, and Co, and is added in an amount of 1% by mass or more of the negative electrode active material.

Abstract: The present invention relates to a negative electrode active material including an Si—Sn—Fe—Cu based alloy, in which an Si phase has an area ratio in a range of from 35 to 80% in the entire negative electrode active material, the Si phase is dispersed in a matrix phase, the matrix phase contains an Si—Fe compound phase crystallized around the Si phase and further contains an Sn—Cu compound phase crystallized to surround the Si phase and the Si—Fe compound phase, the Si—Fe compound phase is crystallized in a ratio of from 35 to 90% in terms of an area ratio in the entire matrix phase, and the matrix phase further contains an Sn phase unavoidably crystallized in the matrix phase in a ratio of 15% or less in terms of an area ratio in the entire matrix phase.

Abstract: The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10?6 ?·cm or more and 1×10?3 ?·cm or less, and the tensile storage modulus of the thermosetting type die bond film at ?20° C. before thermal curing is 0.1 to 10 GPa.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

Abstract: The present invention relates to a negative electrode active material including an Si—Sn—Fe—Cu based alloy, in which an Si phase has an area ratio in a range of from 35 to 80% in the entire negative electrode active material, the Si phase is dispersed in a matrix phase, the matrix phase contains an Si—Fe compound phase crystallized around the Si phase and further contains an Sn—Cu compound phase crystallized to surround the Si phase and the Si—Fe compound phase, the Si—Fe compound phase is crystallized in a ratio of from 35 to 90% in terms of an area ratio in the entire matrix phase, and the matrix phase further contains an Sn phase unavoidably crystallized in the matrix phase in a ratio of 15% or less in terms of an area ratio in the entire matrix phase,

Abstract: Provided is a robot capable of appropriately adjusting a position and the like of a main body in view of executing a specified task involving an interaction with a target object. While the position and posture of the main body (10) are being controlled according to a second target path, the robot (1) moves from a first specified area to a second specified area and stands there. In this state, a second position deviation (=the deviation of the position of the main body from a second target path) and a second posture deviation (=the deviation of the posture of the main body from a second target posture) are determined. According to the determination result, the second target path is corrected so that the subsequent position deviation and the like may be smaller.

Abstract: An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

Abstract: An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

Abstract: The present invention relates to a negative electrode active material for a lithium secondary battery, which has a composition containing Si in an amount of from 30 to 65% by mass and has a two phase matrix structure including an Sn—Cu based alloy matrix having an Sn content of 50% by mass or more, Si crystallites dispersed in the Sn—Cu based alloy matrix and an Si—X based alloy crystallized so as to at least partially cover the Si crystallites, in which X is at least one element selected from Fe, Ni and Co and is added in the Si—X based alloy in an amount of 1% by mass or more.

Abstract: A charging apparatus for a mobile robot enabling the mobile robot to move relatively freely even during charging using a wiring member, while preventing occurrence of an inconvenience such as damage to the wiring member, is provided. The charging apparatus includes a charging power source, a control board which controls the charging power source, and a wiring members for use in supplying electric power from the charging power source to a battery mounted on the mobile robot. The wiring member is connected to the mobile robot to follow the movement of the robot. The charging apparatus further includes a detector which detects tension applied to the wiring member. When the wiring members is pulled, an appropriate measure to stop the mobile robot or disconnect the wiring member from the robot is taken in accordance with a signal from the tension detector.

Abstract: The present invention provides a dicing die bond film in which peeling electrification hardly occurs and which has good tackiness and workability. The dicing die bond film of the present invention is a dicing die bond film including a dicing film and a thermosetting type die bond film provided thereon, wherein the thermosetting type die bond film contains conductive particles, the volume resistivity of the thermosetting type die bond film is 1×10?6 ?·cm or more and 1×10?3 ?·cm or less, and the tensile storage modulus of the thermosetting type die bond film at ?20° C. before thermal curing is 0.1 to 10 GPa.

Abstract: A charging apparatus for a mobile body has a charging stand, which includes a connector holder to be connected to a battery of a walking robot, a forward/backward mechanism which moves the connector holder forward/backward, and a protrusion which is driven by the forward/backward mechanism to move forward/backward as the connector holder moves forward/backward. Control information indicating the state of the forward/backward mechanism when the protrusion is located in a predetermined position, which is detected on the basis of the detection values of a retreat position sensor and an advance position sensor, is acquired, and the forward/backward mechanism is controlled according to the acquired control information thereby to move the connector holder forward/backward.

Abstract: Provided is an adhesive composition into which an additive for capturing a cation is incorporated, thereby making it possible to form a semiconductor-device-producing adhesive sheet capable of preventing deterioration of the electrical characteristic of a produced semiconductor device so as to improve the product reliability of the device. An adhesive composition, for producing a semiconductor device, which contains at least an additive for capturing a cation.