Abstract: A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.

Abstract: A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, and a covering member. The light-emitting elements each has a light-extracting surface. The light-emitting elements each includes a layered structure including a semiconductor layer, and a plurality of electrodes connected to the layered structure. The light-transmissive members each has a lower surface facing the light-extracting surface of at least one of the light-emitting elements, and an upper surface opposite to the lower surface and having an area smaller than an area of the lower surface. The upper surface of each of the light transmissive members collectively constitutes a light-emitting part having an outermost periphery with a square shape or a circular shape. The covering member integrally covers lateral surfaces of the light-emitting elements and lateral surfaces of the light-transmissive members.

Abstract: A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.

Abstract: A light-emitting device includes a base, a light-emitting element, and reflecting elements. The light-emitting element is mounted on the base. The reflecting elements are arranged around the light-emitting element to reflect light emitted by the light-emitting element. Each of the reflecting elements includes a core and a dielectric multilayer film. The dielectric multilayer film covers the core and has a thickness to reflect a wavelength of the light emitted by the light-emitting element.

Abstract: A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.

Abstract: A light emitting device has a lens, extended to outside of the mounting substrate on which a semiconductor a light emitting element is mounted, and leakage of light is reduced. A light emitting element, a substrate having the light emitting element mounted on its upper surface, and a lens, having a curved upper surface encloses the light emitting element and the upper surface of the substrate is included. From the bottom surface of the lens, a lower surface of the substrate is exposed. In a top view from a perpendicular direction to the upper surface of the substrate, the bottom surface of the lens includes an outer extending portion where the bottom surface is extended to outside of the substrate, and a inclined portion, which inclines with respect to a direction approximately in parallel to the upper surface of the substrate, at an end portion of the outer extending portion.

Abstract: A light-emitting device includes a support having a primary surface; a power supply connector located on the primary surface of the support and including one or more wire pads; a light-emitting element located on the primary surface of the support; one or more wires connecting the light-emitting element and the wire pads; and a cover member located on the primary surface of the support and covering the light-emitting element and the wire pads.

Abstract: A method of manufacturing a light emitting device includes: placing, on a supporting layer, a light-emitting element including an anode and a cathode at a first surface side of the light-emitting element; placing, on the supporting layer, a protective element including a first terminal and a second terminal at a third surface side of the protective element; placing a protecting layer above a second surface of the light-emitting element; covering at least a lateral portion of the light-emitting element and a lateral portion of the protecting layer with a resin composition; curing the resin composition; removing the supporting layer to expose the anode, the cathode, the first terminal, and the second terminal; and forming a first electrode, which is electrically connected to the anode and the first terminal, and a second electrode, which is electrically connected to the cathode and the second terminal.

Abstract: A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.

Abstract: A method of manufacturing a semiconductor device includes disposing a substrate metal film on an upper surface of a substrate made of a metal; disposing a first element metal film on a lower surface of a first element; disposing a second element metal film on a lower surface of a second element; bonding the first element and the second element to the substrate so that an upper surface of the substrate metal film is in contact with a lower surface of the first element metal film and a lower surface of the second element metal film; oxidizing at least a portion of a region of the upper surface of the substrate metal film other than regions in contact with the first element metal film and the second element metal film; and disposing a wiring electrically connecting the first element and the second element, across and above the region oxidized.

Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. The second light reflecting member surrounds an outer periphery of the light emitting element in a plan view. The second light reflecting member is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member is disposed inside the second light reflecting member. The light transmissive member includes a wavelength conversion substance. The sealing member covers the first and second light reflecting members and the light transmissive member.

Abstract: A manufacturing method for a light emitting device can include providing a bonding layer over a base, and disposing a shim plate with an opening over the bonding layer. A light emitting body is disposed over the bonding layer exposed from the opening of the shim plate. A lens is formed by approaching a die having a concave portion at its surface, to the shim plate, covering an upper surface of the light emitting body and an upper surface of the shim plate with a lens formation material within the concave portion, and then hardening the lens formation material.

Abstract: A light emitting device has; a light emitting element, a light reflecting member that is disposed so as to cover the lateral surfaces of the light emitting element and expose a top surface of the light emitting element, a frame that is disposed on the light reflecting member so as to surround an outer periphery of the top surface of the light emitting element, a light transmissive member that is disposed inside the frame, and a sealing member that covers the light reflecting member, the frame and the light transmissive member, and that has a flange covering part of the frame.

Abstract: A light emitting device includes a supporting base member which has an external electrode, at least one light emitting element disposed on at least a portion of an upper surface of the supporting base member. A sealing member encloses the light emitting element and has an outermost periphery larger than the supporting base member in a plan view. The supporting base member has at least one recess. The sealing member is filled in at least a portion of the recess and is formed so as to expose an electrode surface of the external electrode.

Abstract: The present invention relates to a semiconductor device, including: a substrate; a plurality of first semiconductor elements and a second semiconductor element arranged on a mount area of the substrate; an external electrode to supply electricity to the first and second semiconductor elements; and a frame of reflective material formed at a periphery of the mount area.

Abstract: A light-emitting device includes a support having a primary surface; a power supply connector located on the primary surface of the support and including one or more wire pads; a light-emitting element located on the primary surface of the support; one or more wires connecting the light-emitting element and the wire pads; and a cover member located on the primary surface of the support and covering the light-emitting element and the wire pads.

Abstract: Provided is an illumination device that includes a light emitting device having a first electrode and a second electrode and a mounting substrate including a first wiring pattern and a second wiring pattern. The first wiring pattern and the second wiring pattern face and are bonded to the first electrode and the second electrode, respectively, through a bonding material. The second electrode and the second wiring pattern are configured to be at least partially overlapped with each other in a plan view irrespective of an orientation of the light emitting device, under condition that the first electrode and the first wiring pattern are at least partially overlapped with each other in the plan view.

Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.

Abstract: A light-emitting device includes a base, a light-emitting element, and reflecting elements. The light-emitting element is mounted on the base. The reflecting elements are arranged around the light-emitting element to reflect light emitted by the light-emitting element. Each of the reflecting elements includes a core and a dielectric multilayer film. The dielectric multilayer film covers the core and has a thickness to reflect a wavelength of the light emitted by the light-emitting element.

Abstract: A light emitting device has; a light emitting element, a light reflecting member that is disposed so as to cover the lateral surfaces of the light emitting element and expose a top surface of the light emitting element, a frame that is disposed on the light reflecting member so as to surround an outer periphery of the top surface of the light emitting element, a light transmissive member that is disposed inside the frame, and a sealing member that covers the light reflecting member, the frame and the light transmissive member, and that has a flange covering part of the frame.