Abstract: A light-emitting device including: a base; light-emitting elements arranged on the base at intervals in an array along a predetermined direction of the base; and conductive-wiring parts formed on first and second sides of the array of the light-emitting elements on the base. The conductive-wiring parts are discretely formed along the predetermined direction of the base, each of the conductive-wiring parts relaying electrical connection between the light-emitting elements, and the number of the conductive-wiring parts arranged per light-emitting element on each of the first and second sides of the array of the light-emitting elements is two or more.

Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.

Abstract: Provided is a light emitting device having a high light emitting efficiency and a good brightness distribution, further having a good color mixing and a good light distribution. A light emitting device includes a base member, a plurality of light emitting elements disposed on the base member, and a sealing member sealing the light emitting elements. The base member has a plurality of regions divided by virtual lines extending in a radial manner from one point disposed on the base member to an outer periphery of the base member, and a light transmissive wall member between adjacent two regions of the plurality of regions. A sealing member containing a fluorescent material is disposed on each region of the plurality of regions. A color tone of light emitted from a first region which is one of the two adjacent regions of the plurality of regions differs from a color tone of light emitted from a second region which is the other of the two adjacent regions.

Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.

Abstract: A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on the white resist and includes a transparent substrate and a semiconductor layer. The transparent substrate is bonded to the white resist via a bonding member. The semiconductor layer is provided on the transparent substrate. The wire connects the light-emitting element and the lead frame at the opening.

Abstract: A semiconductor light emitting device that achieves miniaturization and high brightness is provided. The semiconductor light emitting device has a light extraction surface (6) parallel to a lamination direction of a semiconductor layer (2). The semiconductor light emitting device includes a light guide member (3) placed on the semiconductor layer (2) and having a sloped surface (7) with a side surface opposite to the light extraction surface (6) sloped to the light extraction surface and a light-reflecting member (4) placed on a surface of the light guide member including at least the sloped surface of the light guide member.

Abstract: A manufacturing method for a light emitting device can include providing a bonding layer over a base, and disposing a shim plate with an opening over the bonding layer. A light emitting body is disposed over the bonding layer exposed from the opening of the shim plate. A lens is formed by approaching a die having a concave portion at its surface, to the shim plate, covering an upper surface of the light emitting body and an upper surface of the shim plate with a lens formation material within the concave portion, and then hardening the lens formation material.

Abstract: Provided is an illumination device that includes a light emitting device having a first electrode and a second electrode and a mounting substrate including a first wiring pattern and a second wiring pattern. The first wiring pattern and the second wiring pattern face and are bonded to the first electrode and the second electrode, respectively, through a bonding material. The second electrode and the second wiring pattern are configured to be at least partially overlapped with each other in a plan view irrespective of an orientation of the light emitting device, under condition that the first electrode and the first wiring pattern are at least partially overlapped with each other in the plan view.

Abstract: Provided is a light emitting device capable of further improving light extraction efficiency while reducing leakage of wavelength unconverted light or color unevenness of the light. The light emitting device includes: a base member; a light emitting element mounted on the base member; a light reflecting member disposed at a side surface side of the light emitting element; and a light-transmissive stacked layer covering at least an upper surface of the light emitting element, wherein the light-transmissive stacked layer includes a first light-transmissive layer, a first wavelength conversion layer disposed on the first light-transmissive layer, a second light-transmissive layer disposed on the first wavelength conversion layer, and a second wavelength conversion layer disposed on the second light-transmissive layer.

Abstract: A light emitting device includes a supporting base member which has an external electrode, at least one light emitting element disposed on at least a portion of an upper surface of the supporting base member. A sealing member encloses the light emitting element and has an outermost periphery larger than the supporting base member in a plan view. The supporting base member has at least one recess. The sealing member is filled in at least a portion of the recess and is formed so as to expose an electrode surface of the external electrode.

Abstract: A light emitting device has a lens, extended to outside of the mounting substrate on which a semiconductor a light emitting element is mounted, and leakage of light is reduced. A light emitting element, a substrate having the light emitting element mounted on its upper surface, and a lens, having a curved upper surface encloses the light emitting element and the upper surface of the substrate is included. From the bottom surface of the lens, a lower surface of the substrate is exposed. In a top view from a perpendicular direction to the upper surface of the substrate, the bottom surface of the lens includes an outer extending portion where the bottom surface is extended to outside of the substrate, and a inclined portion, which inclines with respect to a direction approximately in parallel to the upper surface of the substrate, at an end portion of the outer extending portion.

Abstract: A light-emitting device includes a lead frame, a white resist, a light-emitting element, and a wire. The white resist is provided on the lead frame to be in contact with the lead frame. The white resist has an opening to expose the lead frame. The light-emitting element is disposed on the white resist and includes a transparent substrate and a semiconductor layer. The transparent substrate is bonded to the white resist via a bonding member. The semiconductor layer is provided on the transparent substrate. The wire connects the light-emitting element and the lead frame at the opening.

Abstract: Provided is a light emitting device having a high light emitting efficiency and a good brightness distribution, further having a good color mixing and a good light distribution. A light emitting device includes a base member, a plurality of light emitting elements disposed on the base member, and a sealing member sealing the light emitting elements. The base member has a plurality of regions divided by virtual lines extending in a radial manner from one point disposed on the base member to an outer periphery of the base member, and a light transmissive wall member between adjacent two regions of the plurality of regions. A sealing member containing a fluorescent material is disposed on each region of the plurality of regions. A color tone of light emitted from a first region which is one of the two adjacent regions of the plurality of regions differs from a color tone of light emitted from a second region which is the other of the two adjacent regions.

Abstract: The present invention relates to a semiconductor device, including: a substrate; a plurality of first semiconductor elements and a second semiconductor element arranged on a mount area of the substrate; an external electrode to supply electricity to the first and second semiconductor elements; and a frame of reflective material formed at a periphery of the mount area.

Abstract: A light-emitting device including: a base; light-emitting elements arranged on the base at intervals in an array along a predetermined direction of the base; and conductive-wiring parts formed on first and second sides of the array of the light-emitting elements on the base. The conductive-wiring parts are discretely formed along the predetermined direction of the base, each of the conductive-wiring parts relaying electricalconnection between the light-emitting elements, and the number of the conductive-wiring parts arranged per light-emitting element on each of the first and second sides of the array of the light-emitting elements is two or more.