Abstract: A gas analysis system, includes: a light-emitting element that emits a laser light modulated by a predetermined modulation frequency; and a light-receiving element that: receives the laser light that has passed through a measurement target gas; and upon receiving the laser light, outputs a received signal having an N-frequency that is n times the predetermined modulation frequency, wherein n is an integer no less than 2; and a signal processing device that: calculates a third component by removing, from a first component having the N-frequency, a second component, wherein the second component is a component of optical interference noise arising on an optical path of the laser light from the light-emitting element to the light-receiving element and has the same frequency as the first component; and calculates, based on a magnitude of the third component, a concentration of the measurement target gas.

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: A sheet conveyance device includes a conveyance roller pair. A skew correction roller pair conveys the sheet after contacting two nip portions, and a sheet skew is corrected in a state in which the skew correction roller pair is being stopped. The sheet having a toner image is bent by a first conveyance guide such that a sheet first surface becomes an inside surface. The sheet is bent by the first and second conveyance guides to cause the sheet first surface to be the inside surface and a sheet second surface to be an outside surface. The skew correction roller pair includes two first rotary members of a first roller. A second roller and the two first rotary members form the two nip portions. The second roller and the first conveyance guide contact the sheet first surface. The first roller and the second conveyance guide contact the sheet second surface.

Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

Abstract: There are provided a communication system in which a piece of equipment in a facility and a device working in the facility cooperate easily with each other, an equipment server and a device server in the communication system, and a data structure which is to be communicated in the communication system. In a communication system (1), a message is used for control of a control target by being communicated in a common format between each of equipment servers (7) and each of object servers (9). The control target is a piece (3) of building equipment as a piece of equipment or an object (4) working in a building (2) as a facility.

Abstract: There are provided a communication system in which a piece of equipment in a facility and a device working in the facility cooperate easily with each other, an equipment server and a device server in the communication system, and a data structure which is to be communicated in the communication system. In a communication system (1), a message is used for control of a control target by being communicated in a common format between each of equipment servers (7) and each of object servers (9). The control target is a piece (3) of building equipment as a piece of equipment or an object (4) working in a building (2) as a facility.

Abstract: There are provided a communication system in which a piece of equipment in a facility and a device working in the facility cooperate easily with each other, an equipment server and a device server in the communication system, and a data structure which is to be communicated in the communication system. In a communication system, a message is used for control of a control target by being communicated in a common format between each of equipment servers and each of object servers. The control target is a piece of building equipment as a piece of equipment or an object working in a building as a facility.

Abstract: Described herein is a curable fluoropolymer composition comprising: an amorphous fluoropolymer; and particles of a metal fluoride, wherein the particles are not substantially surface treated and wherein the metal of the metal fluoride comprises at least one of an alkaline earth metal, a Group III transition metals, and a Lanthanide metals. Also described are cured articles made with the curable fluoropolymer composition.

Abstract: A webbing take-up device including: a spool; a tube-shaped cylinder; a fluid supply unit; a rotating member including thrust teeth in a radial pattern about a rotation central axial line formed to faces that oppose one another in an axial direction, and including a tapered portion formed to a rotation outer peripheral side end portion of each of the thrust teeth and having a rotation axial direction dimension that decreases on progression toward a rotation radial direction outside, the spool being rotated in the take-up direction by the rotating member rotating toward one side; and a moving member that is moved toward the axial direction leading end side of the cylinder under pressure of the fluid to cause the rotating member to rotate toward the one side by being moved in an engaged state with the thrust teeth of the rotating member.

Abstract: A substrate processing apparatus of accurately detecting an end point of substrate polishing using an acoustic sensor is disclosed. The substrate processing apparatus for polishing a substrate by pressing the substrate against a polishing pad, includes: an acoustic sensor configured to detect an acoustic event occurring with polishing of a substrate and output the acoustic event as acoustic signals; a power-spectrum generator configured to generate power spectra from the acoustic signals, each of the power spectra indicating a spectrum of a sound-pressure level; a map updating device configured to generate a power spectrum map indicating a temporal change in power spectrum by arranging the power spectra in a time-series order; and an end-point determiner configured to detect a polishing end point of the substrate based on a change in the sound-pressure level in the power spectrum map.

Abstract: A method of accurately detecting an end point of substrate polishing using an acoustic sensor is disclosed. The method includes: detecting an acoustic event occurring with polishing of a substrate and outputting the acoustic event as acoustic signals; generating power spectra from the acoustic signals, each of the power spectra indicating a spectrum of a sound-pressure level; generating a power spectrum map indicating a temporal change in power spectrum by arranging the power spectra in a time-series order; and detecting a polishing end point of the substrate based on a change in the sound-pressure level in the power spectrum map.

Abstract: A polishing apparatus for performing polishing between a polishing pad and a semiconductor wafer disposed to face the polishing pad includes a polishing table for holding the polishing pad, a top ring for holding the semiconductor wafer, a swing arm for holding the top ring, and a swing shaft motor for causing the swing arm to swing. The polishing apparatus further includes an arm torque detection section that detects an arm torque imparted to the swing arm when the swing arm is swinging in a predetermined angle range, and an endpoint detection section that detects a polishing endpoint indicating the end of polishing on the basis of the arm torque detected by the arm torque detection section.

Abstract: The present invention addresses the problem of providing: a dispersant which enables the production of a dispersed material having excellent dispersibility and storage stability even when the dispersant is used in a small amount; a dispersed material having excellent dispersibility and storage stability; an electrode film having excellent adhesiveness and electrical conductivity; and a non-aqueous electrolyte secondary battery having excellent rate properties and cycle properties. The problem can be solved by a dispersant which is a polymer containing 40 to 100% by mass of a (meth)acrylonitrile-derived unit and having a weight average molecular weight of 5,000 to 400,000.

Abstract: A sheet conveyance device capable of reducing occurrence of creases on a sheet. A pair of first conveyance rollers nip and convey a sheet. A pair of second conveyance rollers arranged downstream of the first conveyance rollers in a sheet conveyance direction nip and convey the sheet. A pair of registration rollers arranged downstream of the second conveyance rollers nip and convey the sheet after correcting skew of the sheet. A switching mechanism switches a state of the second conveyance rollers between a contact state and a separated state. A control unit that controls the rollers and the switching mechanism executes a first conveyance operation that conveys the sheet with the first conveyance rollers and the registration rollers after correcting the skew in the separated state and in a state where a sheet conveyance speed by the registration rollers is higher than that by the first conveyance rollers.

Abstract: A stimulated Raman scattering microscope device is configured to irradiates a sample with a first optical pulse at a first repetition frequency, to irradiate the sample with a second optical pulse of an optical frequency different from an optical frequency of the first optical pulse at a second repetition frequency, and to detect optical pulses of the first repetition frequency that are included in detected light from the sample irradiated with the first optical pulse and the second optical pulse, as a detected optical pulse train. The second optical pulse is generated by dispersing predetermined optical pulses that include lights of a plurality of optical frequencies, regulating to output optical pulses of a predetermined number of different optical frequencies out of the dispersed optical pulses at the second repetition frequency, and coupling the regulated optical pulses.

Abstract: A measurement system and method, which increases a degree of freedom for setting a measurement period and a transmission period of measurement values and has a high accuracy, are provided. The measurement system includes a control device and a measurement device that measures a measurement object in a first period and transmits measurement values obtained from the measurement device to the control device. The measurement device transmits the measurement values waiting to be transmitted and additional information including information of the number of the measurement values waiting to be transmitted to the control device using frames transmitted in a second period that is longer than the first period. The control device generates time series data in which the measurement values are arranged in time series using the additional information.

Abstract: An ophthalmologic apparatus is provided, which is capable of more securely supporting left and right cheekbone portions of a subject in accordance with the size and shape of the subject's face allowing the subject to respond orally where the positions of the subject's eyes are fixed. The ophthalmologic apparatus includes a forehead contact portion coming into contact with the forehead of the subject, and a cheek contact portion coming into contact with the cheeks of the subject.

Abstract: Polypeptide assemblies and building blocks and methods for making them are provided.

Abstract: The composition includes a curable fluoropolymer having nitrogen-containing cure sites and a curative including an organo onium cation and an anion represented by Formula (I) or Formula (II). The composition is free of metal cations or has not more than 20 parts per million metal cations and free of silicon dioxide or has less than 0.5 percent by weight silicon dioxide, based on the total weight of the composition. In some cases, the composition consists of the curable fluoropolymer and the curative. Shaped articles including the composition, a fluoroelastomer prepared by curing the composition, a method of making a fluoroelastomer article, and a process for making the composition are also described.

Abstract: A polishing apparatus 100 includes a first electric motor 14 that rotationally drives a polishing table 12, and a second electric motor 22 that rotationally drives a top ring 20 that holds a semiconductor wafer 18. The polishing apparatus 100 includes: a current detection portion 24; an accumulation portion 110 that accumulates, for a prescribed interval, current values of three phases that are detected by the current detection portion 24; a difference portion 112 that determines a difference between a detected current value in an interval that is different to the prescribed interval and the accumulated current value; and an endpoint detection portion 29 that detects a polishing endpoint that indicates the end of polishing of the surface of the semiconductor wafer 18, based on a change in the difference that the difference portion 112 outputs.