Abstract: An electric wave transmitting/receiving module includes: a waveguide including a conductive member and an opening facing a transmitting side and/or a receiving side; a dielectric substrate disposed on a side opposite to the opening of the waveguide; and transmitting/receiving means. The transmitting/receiving means includes a core line, a transmitting/receiving element, and a wire. The core line and the transmitting/receiving element are horizontally disposed on the dielectric substrate. The core line transmits the transmitting electric wave and/or receives the receiving electric wave. The transmitting/receiving element outputs a transmitting/receiving signal corresponding to the transmitting electric wave and/or the receiving electric wave. The wire sends the transmitting/receiving signal from the transmitting/receiving element to an external circuit.

Abstract: A chip-type electronic component includes a substrate, a common potential layer formed on an upper side of the substrate, an insulating film formed on the common potential layer, and provided to expose at least part of the common potential layer. At least one common potential electrode is provided on the exposed part of the common potential layer, and a plurality of conductors provided on the insulating film, each of the conductors forming a part of a thin-film circuit element. At least one columnar electrode is electrically connected to at least one of the conductors, and a sealing film is formed around the columnar electrode.

Abstract: A semiconductor device includes a semiconductor substrate on one side of which an integrated circuit and a plurality of connection pads connected to the integrated circuit are provided. An insulating film is provided on the plurality of connection pads except for parts of the connection pads and on the one side of the semiconductor substrate. A plurality of wiring lines are provided to be electrically connected to the integrated circuit via the connection pads, each of the wiring lines having a connection pad portion. A plurality of columnar electrodes are respectively provided on one side of the connection pad portions of the wiring lines. A sealing film is provide on the peripheries of the columnar electrodes to cover the integrated circuit and which is provided. At least one of the insulating film and the sealing film is formed of a resin in which magnetic powder is mixed.

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide.

Abstract: A semiconductor device includes a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a thin-film inductor element which is formed on the insulating film, and which includes first and second terminals and a conductive layer formed into a spiral shape between the first and second terminals so as to have a plurality of turns and at least one intersection. The conductive layer includes (i) a first conductor layer formed on the semiconductor substrate, and (ii) a second conductor layer which is formed on the insulating film, intersects the first conductor layer via the insulating film at the intersection. The thin-film inductor element has an arrangement in which the first and second conductor layers are symmetrically arranged in directions from an intermediate point between the first and second terminals along the longitudinal direction of the conductive layer to the first and second terminals.

Abstract: A chip-type electronic component includes a substrate, a common potential layer formed on an upper side of the substrate, an insulating film formed on the common potential layer, and provided to expose at least part of the common potential layer. At least one common potential electrode is provided on the exposed part of the common potential layer, and a plurality of conductors provided on the insulating film, each of the conductors forming a part of a thin-film circuit element. At least one columnar electrode is electrically connected to at least one of the conductors, and a sealing film is formed around the columnar electrode.

Abstract: A high frequency module for converting a high frequency wave in a free space to a high frequency wave in a planar waveguide includes two metal plates, a dielectric substrate and a planar waveguide disposed on the dielectric substrate. The dielectric substrate between the two metal plates has the planar waveguide disposed thereon, and the planar waveguide protrudes either in a through hole bored in one of the two metal plates, or in a hollow space defined by the other of the two metal plates on the dielectric substrate.

Abstract: A semiconductor device includes a semiconductor substrate, an insulating film formed on the semiconductor substrate, and a thin-film inductor element which is formed on the insulating film, and which includes first and second terminals and a conductive layer formed into a spiral shape between the first and second terminals so as to have a plurality of turns and at least one intersection. The conductive layer includes (i) a first conductor layer formed on the semiconductor substrate, and (ii) a second conductor layer which is formed on the insulating film, intersects the first conductor layer via the insulating film at the intersection. The thin-film inductor element has an arrangement in which the first and second conductor layers are symmetrically arranged in directions from an intermediate point between the first and second terminals along the longitudinal direction of the conductive layer to the first and second terminals.

Abstract: The present disclosure relates to a radio wave receiving system. The system includes an antenna that is operable for receiving a received signal. The received signal contains information. The radio wave receiving system also includes a reference signal generator that is operable for generating a reference signal. In addition, a selective output device is included that is operable for selectively outputting the received signal and the reference signal to a transmission path. The system also includes an information acquiring device that is operable for generating a signal component indicating a signal level difference between the received signal and the reference signal. The information acquiring device is further operable for acquiring the information from the signal component.

Abstract: A vehicle-vehicle communication system includes an in-vehicle wire LAN established in a vehicle. The in-vehicle wire LAN includes a plurality of devices connected by optical fiber links. A terminal for radio vehicle-vehicle communication is connected to the in-vehicle wire LAN by the optical fiber link. The terminal receives an optical digital signal in a predetermined format from the in-vehicle wire LAN. The terminal includes a light controlled oscillator and applies the received optical signal to the light controlled oscillator. The light controlled oscillator outputs a transmission signal of a frequency shifted from a predetermined frequency according to the intensity of the applied optical signal. Thus the terminal generates the transmission signal using FSK-modulation technique without converting the format of the optical signal into another format. The transmission signal is transmitted to a device in another vehicle via radio waves.

Abstract: A high frequency module for converting a high frequency wave in a free space to a high frequency wave in a planar waveguide includes two metal plates, a dielectric substrate and a planar waveguide disposed on the dielectric substrate. The dielectric substrate between the two metal plates has the planar waveguide disposed thereon, and the planar waveguide protrudes either in a through hole bored in one of the two metal plates, or in a hollow space defined by the other of the two metal plates on the dielectric substrate.

Abstract: An electric wave transmitting/receiving module includes: a waveguide including a conductive member and an opening facing a transmitting side and/or a receiving side; a dielectric substrate disposed on a side opposite to the opening of the waveguide; and transmitting/receiving means. The transmitting/receiving means includes a core line, a transmitting/receiving element, and a wire. The core line and the transmitting/receiving element are horizontally disposed on the dielectric substrate. The core line transmits the transmitting electric wave and/or receives the receiving electric wave. The transmitting/receiving element outputs a transmitting/receiving signal corresponding to the transmitting electric wave and/or the receiving electric wave. The wire sends the transmitting/receiving signal from the transmitting/receiving element to an external circuit.

Abstract: A wired circuit board having good alkali resistance as well as good flexibility. The wired circuit board comprising an insulating base layer 21, a conductor layer 22 laminated on the insulating layer 21, and an insulating cover layer 23 formed on the insulating base layer 21 to cover the conductor layer 22, wherein at least the insulating base layer 21 is formed from a resin having a repeated unit expressed by at least either the following general formula (1) or (2), and a weight-average molecular weight in the range of 0.1×105 to 1.

Abstract: A semiconductor package includes a semiconductor structure having a plurality of electrodes for external connection which are provided on a semiconductor substrate, an insulation layer provided on the semiconductor structure, an upper wiring having connection pad portions and provided on the insulation layer such that at least parts of the upper wiring are connected to the electrodes for external connection of the semiconductor structure, a micro electric mechanical system electrically connected to parts of the connection pad portions of the upper wiring, pole electrodes provided so as to be electrically connected to other connection pad portions of the upper wiring, and an upper insulation film covering the vicinities of the pole electrodes and at least the vicinity of the micro electric mechanical system.

Abstract: A connection pad, an insulating film, a ground layer a protective film, first to third wirings and posts S0, S1, G, D on the wirings are disposed on a semiconductor substrate. In this case, the first wiring transmits a high frequency signal, and a dummy pad portion and dummy post D for restraining attenuation of the high frequency signal are disposed midway in the wiring and not connected to external, circuits. An opening for decreasing a floating capacity is disposed in the ground layer under the posts S0, D.

Abstract: A Micro-cell is formed to include a plurality of spot-cells. Communication is executed between a micro-cell base station and a mobile terminal in the micro-cell, and between a spot-cell base station and the mobile terminal in the spot cell. The micro-cell base station and spot-cell base stations are connected to an integrated base station. A signal transmitted to the micro-cell base station from the mobile terminal is transferred to the integrated base station and information transmitted to the mobile terminal is transferred to the micro-cell base station and/or spot-cell base station from the integrated base station. The respective integrated base stations are connected to a server via a dedicated backbone to enable a large-capacity transmission.

Abstract: A wireless communication terminal including a wireless communication unit for receiving and transmitting voice signals between terminals connected through a voice channel and a data channel, a signal input/output unit for inputting and outputting voice signals for voice communication and a mixing unit, interposed between the wireless communication unit and signal input/output unit, for performing mixing operations to create a first mixed signal to be output to said signal input/output unit and second mixed signals each to be transmitted to the corresponding terminal. The wireless communication terminal is preferably used for wireless voice communication performed by three or more terminals without being interposed by a center apparatus (such as a server) or a repeater. Further, signal-receiving/transmitting is set for each wireless communication terminal whereupon convenience can be improved.

Abstract: A radio communication system between a mobile terminal station of a vehicle and a plurality of roadside fixed base stations is so constructed that communication areas of the base stations do not overlap with each other and satisfy the following two conditions. Condition (i): each communication area is defined so that there cannot be a plurality of terminal stations simultaneously. Condition (ii): it is needless to perform multiple access such as time division in the communication area and capable of affording the whole band and all the communication time allocated to one communication area to one terminal station and broad band communication becomes possible. Thus, each mobile terminal station can utilize all the frequency band allocated for service.

Abstract: In a semiconductor device, re-wiring is provided on a circuit element formation region of a semiconductor substrate. A columnar electrode for connection with a circuit board is provided on the rewiring. A first insulating film is provided over the semiconductor substrate excluding a connection pad, and a ground potential layer connected to a ground potential is provided on an upper surface of the first insulating film. A re-wiring is provided over the ground potential layer with a second insulating film interposed. The ground potential layer serves as a barrier layer for preventing crosstalk between the re-wiring and circuit element formation region. A thin-film circuit element is provided on the second insulating film, and a second ground potential layer is provided as a second barrier layer over the thin-film circuit element with an insulating film interposed. Re-wiring is provided over the second ground potential layer.

Abstract: A thin film passive element includes at least one of a capacitance element having a plurality of conductive layers and a dielectric material layer and an inductance element formed of a patterned conductive layer is stacked on a circuit element-forming region of a semiconductor substrate provided with a plurality of connection pads and is connected to the circuit element of the circuit element-forming region.