Abstract: The invention provides a method for producing radiolabeled tyrosine derivatives with good purity and stability, by a safe method suitable for industrial production of pharmaceuticals. The invention relates to a method for producing Compound (5) and Radiolabeled Compound (6) as follows: wherein each symbol is as defined in the description.

Abstract: A layered body which allows a reduction in residual volatile component and a method for producing the layered body. A reinforcing fiber composite material which has high heat resistance and superior mechanical strength and a method for producing the reinforcing fiber composite material. A method includes fusing together a plurality of layers each of which contains: a powder of an imide oligomer represented by a specific general formula; and reinforcement fibers.

Abstract: Provided is an injection molded body of a polypropylene resin composition, which has excellent fluidity and burr prevention performance. The polypropylene resin composition contains a conjugated diene-modified polypropylene resin (A) that has a melt flow rate of 1-150 g/10 min as measured at 230° C. under a load of 2.16 kg and a polypropylene resin (B) that has a melt flow rate of 7-100 g/10 min as measured at 230° C. under a load of 2.16 kg. Relative to 100 parts by weight of the total of the components (A) and (B), the content of the component (A) is 0.1-50 parts by weight and the content of the component (B) is 99.9-50 parts by weight. The polypropylene resin composition has a melt flow rate of 10-80 g/10 min as measured under the above-described conditions, while having a melt tension of 0.7-30 gf as measured at 200° C. at 10 m/min.

Abstract: A control device for an automatic transmission disposed in a vehicle driving system, the automatic transmission having an engaging clutch as a shift element, has a shift controller that performs a shift control of the automatic transmission. The shift controller is configured such that, during a shift control to release the engaging clutch in response to a first shift request and before determination of a complete release of the engaging clutch, when a second shift request to engage the engaging clutch is generated, the shift control in response to the second shift request is executed.

Abstract: The aim is to provide a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a thermoplastic resin composition with superior moldability and workability that does not easily bleed out and a molded body with superior resistance to heat-moisture and chemicals; and a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a flame retardant with a heat resistance to working temperatures of 300° C. or higher and a molded body with superior resistance to reflow heat and chemicals. Disclosed is a flame retardant, which is a specific flame retardant for thermoplastic resins comprising the reaction product of a nitrogen-containing compound and a phosphorous-containing compound, that is insoluble in toluene and comprises in the range of 5 to 10 wt % of phosphorus atoms.

Abstract: A jet-black rubber modified acrylic resin composition comprising: a rubber modified acrylic resin (A); and a carbon black (B) blended with the resin (A), the rubber modified acrylic resin (A) being capable of providing a 3-mm-thick molded product that has transparency with a total light transmittance of 85% or higher, and the carbon black being dispersed in the resin composition and having a particle diameter of 10 to 40 nm.

Abstract: The aim is to provide a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a thermoplastic resin composition with superior moldability and workability that does not easily bleed out and a molded body with superior resistance to heat-moisture and chemicals; and a flame retardant for thermoplastic resins that has a high flame-retardant imparting effect, and that produces a flame retardant with a heat resistance to working temperatures of 300° C. or higher and a molded body with superior resistance to reflow heat and chemicals. Disclosed is a flame retardant, which is a specific flame retardant for thermoplastic resins comprising the reaction product of a nitrogen-containing compound and a phosphorous-containing compound, that is insoluble in toluene and comprises in the range of 5 to 10 wt % of phosphorus atoms.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.

Abstract: The present invention provides a novel acrylic block copolymer rich in flexibility and excellent in mechanical strength, moldability, oil resistance, heat resistance, thermal decomposition resistance, weather resistance, and compression set, and further rich in reactivity. The present invention also provides compositions, seal products, and automobile, electric, and electronic parts, all of which include the acrylic block copolymer. The acrylic block copolymer includes a methacrylic polymer block (a) and an acrylic polymer block (b), at least one of the polymer blocks containing, in its main chain, at least one acid anhydride group (c) represented by formula (1): (wherein R1s each represent hydrogen or a methyl group and may be the same or different, n represents an integer of 0 to 3, and m represents an integer of 0 or 1).

Abstract: In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

Abstract: In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

Abstract: A process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

Abstract: A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 ?m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 ?m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask (7) is formed on the bump formation side (3a) of a metal foil (3) having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit (1) and the height t2 of the bumps (2) to be formed on a wiring circuit (1), the bumps (2) are formed by half-etching the metal foil (3) from the bump formation etching mask (7) side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer (10) composed of a different metal from the metal foil (3) is formed on the bump formation side of the metal foil (3), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.

Abstract: The present invention provides a novel acrylic block copolymer rich in flexibility and excellent in mechanical strength, moldability, oil resistance, heat resistance, thermal decomposition resistance, weather resistance, and compression set, and further rich in reactivity. The present invention also provides compositions, seal products, and automobile, electric, and electronic parts, all of which include the acrylic block copolymer. The acrylic block copolymer includes a methacrylic polymer block (a) and an acrylic polymer block (b), at least one of the polymer blocks containing, in its main chain, at least one acid anhydride group (c) represented by formula (1): (wherein R1s each represent hydrogen or a methyl group and may be the same or different, n represents an integer of 0 to 3, and m represents an integer of 0 or 1).

Abstract: An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 and on the surface of each metal bump 16 formed on the metal film 11, and a pressure is applied on the surface to depress the resist film 24 on the metal bump 16, followed by etching. As the surface of the resin coating 21 is partially exposed at the depressed portion of the resist film 24, etching of the resin coating 21 proceeds from that portion to bulge the surface of the metal bump 16 from the resin coating 21. If the resist film 24 is formed after a flexible resin coating 22 is formed on the rigid resin coating 21, the flexible resin coating 22 can serve as an adhesive layer.