Abstract: An optical module comprises an optical connector at the receiver side and an optical connector at the transmitter side, and hybrid IC for the receiver side and the transmitter side are mounted on a lead frame. The lead frame comprises a projecting part projecting outside from a part where each semiconductor chip is mounted. Nearby the connection part between the optical connector and the hybrid IC, the projecting part is connected to a ground pattern on a surface of the hybrid IC by a bonding wire. The wire is placed at this location, so that the effect of noise caused by an atmospheric electric wave, or GND/power lines can be reduced.

Abstract: An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector.

Abstract: A method of manufacture of an optical module using a mold die including cavity portions for holding an optical connector, electronic circuit parts, and lead pins which constitute component parts of the optical module, so as to form a package. The mold die has alignment portions in which rectangular channels for aligning the optical connector are formed. Partition plates are disposed vertically between the cavity portions and the alignment portions and adapted to prevent a resin from flowing out from the cavity portions during the resin molding. An optical connector, circuit parts, and lead pins are held in the die. Resin is injected into the cavity portion to form the optical module.

Abstract: An optical sub-module comprises at least one optical connector; at least one optical operation element fixed to the optical connector; electronic circuit parts constituting an electronic circuit portion connected to the optical operation element; a substrate for supporting said electronic circuit parts; lead pins composed of inner leads and outer leads, inner leads being connected to electronic circuit portion; and a molding resin member holding the optical connector, the optical operation element, the electronic circuit parts, the substrate, and the lead pins in a body except for the outer leads of the lead pins and an end of the optical connector.