Patents by Inventor Yutaka Noda

Yutaka Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6361626
    Abstract: A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: March 26, 2002
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Hitoshi Homma, Masakazu Takesue, Tadaaki Shono, Yutaka Noda
  • Patent number: 6320158
    Abstract: A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.
    Type: Grant
    Filed: January 14, 1999
    Date of Patent: November 20, 2001
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Yutaka Noda, Yoshitaka Muraoka, Fumihiko Tokura
  • Patent number: 6107181
    Abstract: A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: August 22, 2000
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Yutaka Noda, Yoshitaka Muraoka
  • Patent number: 5921729
    Abstract: A double surface machining system for machining both side surfaces of a workpiece comprises, in an operational state, a pair of upper and lower spindle heads to be vertically positioned and driven, respectively, a pair of upper and lower spindles provided for the upper and lower spindle heads, respectively, in parallel to each other, to be rotatable about horizontal axes thereof, the upper and lower spindles having front ends to which tools are mounted, respectively, a pair of upper and lower workpiece supports for supporting the workpiece therebetween, which are vertically positioned and driven on one side of the upper and lower spindle heads as viewed from a workpiece feed direction, respectively, and another pair of upper and lower workpiece supports for supporting the workpiece therebetween, which are vertically positioned and driven on another one side of the upper and lower spindle heads as viewed from a workpiece feed direction, respectively.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: July 13, 1999
    Assignees: Kabushiki Kaisha Toshiba, Japan Atomic Energy Research Institute
    Inventors: Mitsuru Kikuchi, Koya Watanabe, Yutaka Noda, Masanao Shibui
  • Patent number: 5751584
    Abstract: The processing material's shape data is obtained by measuring the three-dimensional shape of the processing material W by the three-dimensional measuring device 45, the machine's shape data defining the three-dimensional shape of the machine side including the main shaft head provided with the processing tool and the tool holder attached thereto is obtained, and whether the coordinate position of said processing material given by said processing material's shape data is in the space to be occupied by the machine given by said machine's shape data or not is determined at the relative movement position between the main shaft head (43) and the work table (35) by the execution of the processing program by the arithmetic processing by means of an arithmetic processing means, and when the coordinate position of the processing material W is in the space to be occupied by the machine, it is determined that the processing material W and the machine interfere with each other.
    Type: Grant
    Filed: August 14, 1995
    Date of Patent: May 12, 1998
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Akihiko Yuasa, Yutaka Noda, Satoshi Kumamoto, Makoto Kawano, Toshiyuki Hirose
  • Patent number: 5671467
    Abstract: A color image-forming apparatus includes an endless belt-like photosensitive member stretched between and wound around a drive roller and a driven roller, and a plurality of developing rollers making contact with an outer surface of the photosensitive member. At least one flexure correction shaft is held in contact with an inner surface of the photosensitive member on the side remote from the developing rollers. With this construction, the condition of contact between each developing roller and the photosensitive member is made stable and uniform, and the developing conditions for all the colors become uniform so that a high-quality image can be obtained.
    Type: Grant
    Filed: December 13, 1995
    Date of Patent: September 23, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshikazu Katsumata, Yoshihiro Mizoguchi, Yoshiaki Ijima, Makoto Kamioka, Yoshinori Ejima, Nobuo Kishiyama, Yutaka Noda, Eiichiro Nakao
  • Patent number: 5156237
    Abstract: An apparatus operable on each elevator platform for opening or closing doors wherein the apparatus includes a pair of doors for opening or closing an inlet/outlet on the elevator platform, a rail for guiding the rolling movement of rollers carried by a hanger plate standing upright on the upper surface of each door and a door-sill arranged below said inlet/outlet for guiding the slidable movement of a door shoe at the lower end of each door. Each door is essentially composed of a door main body having a vertically extending reinforcement member for supporting the dead weight of each door and a thermal insulating panel fixedly secured to the door main body on the elevator platform side, the thermally insulating panel being filled with a thermal insulating material, and a decorative plate is adhesively secured to the front surface of the thermal insulating panel on the elevator platform side.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: October 20, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshikatsu Hayashi, Masami Yoshikawa, Makoto Tomidokoro, Masaaki Murakami, Tetsuro Ogushi, Yutaka Noda