Abstract: A navigation system includes a receiver and a signal processor. The receiver is mounted on a second aircraft. The second aircraft is an acquisition target of location information. The receiver is configured to receive a navigation signal from each of three or more first aircrafts. The navigation signal includes the location information on a location of the corresponding first aircraft. The navigation signal is transmitted as a radio signal from a navigation apparatus mounted on each of the three or more first aircrafts. The signal processor is mounted on the second aircraft. The signal processor is configured to calculate a location of the second aircraft on the basis of the navigation signal.

Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.

Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.

Abstract: An image processor includes an accepting unit that accepts designation of at least part of a three dimensional microscope image data, and an image generator that generates three dimensional magnified image data based on the designation. In the image processor, the image generator may sequentially output a first magnified image based on at least part of data of the three dimensional magnified image data, and a second magnified image based on the at least part of data of the three dimensional magnified image data which has at least part of data different from the first magnified image.

Abstract: There is provided a navigation system, comprising: a buoy on a water surface movably anchored to a bottom; a plurality of at least three transmitters fixed to the bottom or at different positions in the water for transmitting signals to specify the positions; a receiver, being disposed with the buoy, configured to receive signals transmitted by the plurality of transmitters; a signal processor, being disposed with the buoy, configured to specify the position of the buoy, based on the signals received by the receiver, and generate a navigation signal indicating the position of the buoy, and a radio, being disposed with the buoy, configured to transmit the navigation signal generated in the signal processor wirelessly, the navigation signal being receivable by a radio in a mobile body.

Abstract: In the intermediate process state estimation method, two generators are used, and as well as inputting a common input noise to the respective generators, a label corresponding to a certain step is input to one generator and a label corresponding to a step different from the certain step is input to the other generator. Then, one of generation data and training data generated by the respective generators is randomly input to a discriminator, and the generators and the discriminator learn in an adversarial manner from the discrimination result in the discriminator. Then, an input noise corresponding to a desired final state and a label corresponding to a step where it is desired that an intermediate process state be estimated are input to the learned generator to estimate the intermediate process state based on the generation data generated by the generator.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.

Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.

Abstract: An acquisition condition is decided for a second image of improved quality. Values x1 resulting from down sampling brightness values of an input first image are accepted by an input layer. A filter is scanned and a convolutional computation performed in a convolutional layer. Outputs z1 to z4 of the convolutional layer and a first image acquisition condition v=(v1, v2, v3, v4) of the first image are accepted by an output layer and a second acquisition condition y is computed by the output layer.

Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.

Abstract: An image processor includes an image generator configured to generate corresponding image data corresponding to first microscopic image data obtained under a first observation condition, based on second microscopic image data and third microscopic image data obtained under a second observation condition, and an image output unit configured to output the corresponding image data. The corresponding image data may be image data corresponding to a first focal plane from which the first microscopic image data are obtained, and wherein the second microscopic image data and the third microscopic image data may be image data on a second focal plane and a third focal plane, respectively, which are different from the first focal plane.

Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.

Abstract: A heat treatment apparatus includes a processing container extended in a vertical direction; a heater provided around the processing container; a temperature sensor provided along a longitudinal direction of the processing container either in the processing container or in a space between the processing container and the heater; and a pair of first partitions provided in the space across a half line that extends from a central axis of the processing container and passes through the temperature sensor, and extending along the longitudinal direction of the processing container.

Abstract: A method for producing a transparent electrode for oxygen production having a Ta nitride layer on a transparent substrate, including: a step of forming a Ta nitride precursor layer on the transparent substrate; and a step of nitriding the Ta nitride precursor layer with a mixed gas containing ammonia and a carrier gas.

Abstract: An aircraft position measurement system is provided for an aircraft configured to use an artificial satellite configured to fly in a known orbit. The aircraft position measurement system includes a reflector, a distance-angle measuring member, a satellite position obtainer, and an aircraft position calculator. The reflector configured to be mounted on the artificial satellite and reflect an electromagnetic wave in a direction in which the electromagnetic wave arrives. The distance-angle measuring member is configured to be mounted on the aircraft and emit an electromagnetic wave and measure a bearing and a distance to the artificial satellite when seen from the aircraft. The satellite position obtainer is configured to obtain an absolute position of the artificial satellite. The aircraft position calculator is configured to calculate a position of the aircraft based on the absolute position of the artificial satellite and the bearing and the distance to the artificial satellite.

Abstract: An image processor includes an accepting unit that accepts designation of at least part of a three dimensional microscope image data, and an image generator that generates three dimensional magnified image data based on the designation. In the image processor, the image generator may sequentially output a first magnified image based on at least part of data of the three dimensional magnified image data, and a second magnified image based on the at least part of data of the three dimensional magnified image data which has at least part of data different from the first magnified image.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.

Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.